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    7457 IC Search Results

    7457 IC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    7457 IC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    2 ao 565

    Abstract: SC CONNECTOR DRAWING aesz
    Text: DATE REV ECN APP'D. BY 2/2/06 AO 7457 JM g l B ISOMETRIC VIEW NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-Q1. Z35-7512 CT710079 2 ao 565 SC CONNECTOR DRAWING aesz

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 SAW APP’D. BY .635 [16.13] MAX B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF 7188Sâ CT710065

    SS-7188S-A-NF-K1-50

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01. Z35-7512 CT710099 SS-7188S-A-NF-K1-50

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 TRM APP'D. BY B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT710046

    Untitled

    Abstract: No abstract text available
    Text: - .708 [17.98] .850 [21.59] MAX.- -.635 [16.13] MAX.- DATE REV ECN 2/2/06 A4 7457 JM 3/21/06 A5 7549 TRM APP’D. BY ( .148 [3.75] ) • HIGHEST POINT OF BEAM J ~ \ — J~V I I t ( r ( .068 [1.73] ) B — .125 ±.010 [3.18 ±0.25] .155 [3.937] TYP. ( .016 [0.41] )


    OCR Scan     		PDF PR022-01. CT710025

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/2 /06 A2 7457 JM 3/21/06 A3 7549 SAW APP’D. BY • .850 [21.59] MAX ■ B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF CT710002

    NT 101

    Abstract: No abstract text available
    Text: .100 [2.54] 3 DATE REV ECN APP'D. BY 2/2/06 A4 7457 JM .050 [1.27] (7) .050 [1.27] 0.035 [0.B9] ±.003 [OJOS] (fi) |-$H 0.005 [g.15]| , 0.062 [K57] ±.0D3 [O.ÜB] (Z )— ' f I4I0DQG [oTTsJI .125 [11B ] -fri 0.006 [0.Î5Ï1 | B P.C.B. RECOMMENDED HOLE LAYOUT


    OCR Scan     		PDF Z35-7512 CT700020 NT 101

    Untitled

    Abstract: No abstract text available
    Text: DATE I— LO CN .100 [2.54] TYP. I— .050 [1.27] TYP. REV ECN 2/2 /06 A1 7457 JM 4/4 /06 A2 7557 TRM APP’D. BY O .050 [1.27] 0.035 [0.89] ±.0 0 3 [0.08] 10 $ 0.006 [0.15] 4- 4- 4 - PIN #1 ,.128 [3.25] -e — 0.062 [1.57] ±.003 [0.08] (2) $ .080 [2.03]


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: in DATE REV ECN 2/2 /06 A1 7457 JM 4/3 /06 A2 7557 TRM APP'D. BY m B cm o. o O CD o o + r NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. 2002/95/ECÃ

    Untitled

    Abstract: No abstract text available
    Text: DATE — 0.035 [0.89] ±.003 [0.08] 8 U .050 [1.27] REV ECN 2/2 /06 C1 7457 JM 3/21/06 C2 7549 SAW APP’D. BY TYP .050 [1.27] — .100 [2.54] TYP CO ro «HH*- •125±.010 -.375 [9.53] (3.17±0.25 565 [14.35] P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE


    OCR Scan     		PDF PR022-01. CT710073

    ME 738

    Abstract: No abstract text available
    Text: DATE REV ECN APP’D. BY 2/2/06 A3 7457 JM 3 -30 -0 6 A4 7557 TRM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT700019 ME 738

    Untitled

    Abstract: No abstract text available
    Text: — DATE REV ECN 2/2 /06 A1 7457 JM 3/21/06 A2 7548 TRM APP'D. BY .100 [2.54] TYP. - - . 0 5 0 [1.27] TYP. .050 [1.27]1.035 [0.89] ±.0 0 3 [0.08] 8 - [. ] 0.006 0 15 PIN #1 • .128 [3.25] .125 [3.18] 0.006 -e (2) [ 0.15] .450 [11.43] P.C.B. RECOMMENDED HOLE LAYOUT


    OCR Scan     		PDF PR026-01. CT710081

    122D

    Abstract: No abstract text available
    Text: J — Ü : DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM *1.254 [3 1.85] MAX — B tn ^ IfÖ T T T NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC U L 9 4 V - 0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. Z35-7512 CT710044 122D

    Untitled

    Abstract: No abstract text available
    Text: DATE iH J i5 - t - 1— W t 4Í w i REV ECN 2/2 /06 A3 7457 JM 3 -3 0 -0 6 A4 7557 TRM APP’D. BY NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY o o ad 10 SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF CT700019

    Untitled

    Abstract: No abstract text available
    Text: DATE REV 2/2 /06 ECN A4 7457 JM 3 -3 0 -0 6 A5 7557 TRM APP’D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF CT700020

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM - *3.454 [B7.7¿]MAX • -*3.512 [89.20]- — j h - *.140 [3.7S] {1fi> B .000 TOP OF PCB TO BOTTOM OF OPENING -| |— -55D [1.3-97] REF TYP -.010 MAX. RADIUS(4) SUGGESTED PANEL OPENING -*J.2DÖ [S1JZB]- NOTES: BOTÏÏ1M SURFACE OF JACK(PCB SURFACE)


    OCR Scan     		PDF CT710046

    Untitled

    Abstract: No abstract text available
    Text: ^ LO DATE REV ECN 2/2/06 A2 7457 JM 3/24/06 A3 7557 TRM APP'D. BY 10 CN O .o . B o O o + o Cvj r To' J= C NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF

    ss-7188s-a-fls

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B -*.72D [18.02] M A X — *.635 [16.13] MAX — NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: ,0+0 [ 1 . 0 Z ] H — COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-D1. Z35-7512 CT710002 ss-7188s-a-fls

    Untitled

    Abstract: No abstract text available
    Text: 2 DATE REV ECN 2/2/06 A7 7457 JM 3 -2 4 -0 6 A8 7557 TRM APP'D. BY BOTTOM SURFACE OF JACK PCB SURFACE .738 [18.74] MAX.-0.035 [0.89] ± .0 0 3 [0.08] (8) - ( .148 [3.75] ) TO HIGHEST POINT OF BEAM £ B P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE


    OCR Scan     		PDF PR022-01. CT700015

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/2 /06 A2 7457 JM 3/2 0/06 A3 7548 TRM APP’D. BY .523 [13.28] MAX B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 .350 [8.89] CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .050 [1.27]— TYP. SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT710060

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 Cl 7457 JM ,1Z5±,010 B *.6 4 n M AX .670 MAX 17.02 NOTES: 1. CONNECTOR MATERIALS: HOUSING: ( I1 5 ± a . 3 B ) THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. Z35-7512 CT710073

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 SAW 5 -3 -0 6 A5 7608 TRM APP'D. BY 4.554 [115.67] MAX B X c oo .550 [13.97] TYP LO •'Ñh LO NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN


    OCR Scan     		PDF PR022-01. CT710019

    1B92

    Abstract: draino
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS S E E P R 0 2 2 -0 1 .


    OCR Scan     		PDF PR022-01. Z35-7512 CT710Q15 1B92 draino

    SS-700810S-A-PG4-BA

    Abstract: No abstract text available
    Text: DATE — .100 [2.54] 3 REV ECN APP’D. BY 2/2/06 A7 7457 JM 3 - 2 4 -0 6 A8 7557 TRM - . 0 5 0 [1.27] (7) .050 [1.27] 0.035 [0.89] ±.003 [0.08] (8) •0-10 0 0 6 [0.15Î1 , 0.062 [1.57] ±.003 [0.08] (2) .A 10 0 0 6 [0.15Ï1 .125 [3.18] B B ■ft I0OO6 [0.15]]


    OCR Scan     		PDF CT700015 SS-700810S-A-PG4-BA