Untitled
Abstract: No abstract text available
Text: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
|
Original
|
PDF
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929
|
Original
|
PDF
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929
|
Original
|
PDF
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN:
|
Original
|
PDF
|
C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
|
VSC9111
Abstract: No abstract text available
Text: G56053-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9111. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV DQ LQWHJUDWHG 621 76'+ WUDQVSRUW RYHUKHDG WHUPLQDWLQJ WUDQVFHLYHU IRU XVH LQ 676670 DSSOLFDWLRQV 7KH GHYLFH FDQ EH XVHG WR FRPELQH IRXU 676670 RU 676
|
Original
|
PDF
|
G56053-0,
VSC9111.
WHVWHU76,
VSC9111
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-11-676-13-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-001 26 X 26
|
Original
|
PDF
|
C17200)
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000
|
Original
|
PDF
|
C17200)
|
Untitled
Abstract: No abstract text available
Text: Product Number: 582-11-676-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-005 26 X 26
|
Original
|
PDF
|
C17200)
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000
|
Original
|
PDF
|
C17200)
64-56A
64-22A/31A
65-17A
|
Untitled
Abstract: No abstract text available
Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-000 26 X 26
|
Original
|
PDF
|
C17200)
64-56A
64-22A/31A
65-17A
|
fg676
Abstract: 676-Pin bga pin 676
Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)
|
Original
|
PDF
|
FG676
676-PIN
FG676)
fg676
bga pin 676
|
SF-BGA676C-B-41F
Abstract: No abstract text available
Text: 27.00mm [1.063"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 27.00mm [1.063"] Top View RoHS 25.00mm [0.984"] Ø 0.23mm [0.009"] ±0.0005" Side View 1.68mm [0.066"] 2 1 3 Description: Giga-snaP BGA SMT Foot 676 position male terminal pins to solder balls 1.0mm [0.039"] centers, 26x26 array
|
Original
|
PDF
|
26x26
FR4/G10
SF-BGA676C-B-41F
|
FF676
Abstract: 676-BALL
Text: R Flip-Chip BGA FF676 Package PK088 (v1.1) August 27, 2007 676-BALL FLIP-CHIP BGA (FF676) 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
|
Original
|
PDF
|
FF676)
PK088
676-BALL
co088
FF676
|
FGG676
Abstract: fg676 PK035
Text: R PK035 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG676/FGG676) Package 676-BALL FINE-PITCH BGA, 1.00MM PITCH (FG676/FGG676) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
|
Original
|
PDF
|
PK035
FG676/FGG676)
676-BALL
FGG676
fg676
PK035
|
|
BGA package tray 40 x 40
Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09
|
Original
|
PDF
|
BGA-484P-M07
BGA-484P-M09
BGA-496P-M02
BGA-543P-M01
BGA-320P-M06
BGA-544P-M01
BGA-352P-M36
BGA-544P-M02
BGA-352P-M41
BGA-544P-M04
BGA package tray 40 x 40
ST-BG272720TJ-1-1-Y-1
676 BGA package tray
tray datasheet bga
TRAY JEDEC BGA 5 6
BGA-544P-M04
tray bga
PBGA 484P
SDP91-PS,PBGA,496P
BGA-676P-M07
|
VSC9142
Abstract: No abstract text available
Text: G56054-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9142. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ
|
Original
|
PDF
|
G56054-0,
VSC9142.
VSC9142
|
MS-034-AAL-1
Abstract: EF676
Text: 676 Ball Flip-Chip BGA EF676 Package PK375 (v1.0) May 26, 2009 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 (4X) D1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 PIN 1 I.D. 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF
|
Original
|
PDF
|
EF676)
PK375
5M-1994e
MS-034-AAL-1
EF676
|
ATM machine using microcontroller
Abstract: STS-48c VSC9112
Text: G56048-0, Rev 1.0 STS-48c Physical Layer Packet/ATM Over SONET/SDH Device VSC9112. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ
|
Original
|
PDF
|
G56048-0,
STS-48c
VSC9112.
ATM machine using microcontroller
VSC9112
|
recommended layout CSG324
Abstract: CSG324 SPARTAN 6 UG385 spartan 6 LX150 XC6SLX4 2 CSG225 I XC6SLX4 CSG225 UG385 LX150 AB p89 LX100T
Text: Spartan-6 FPGA Packaging and Pinouts Advance [optional]Product Specification UG385 v1.0 June 24, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development
|
Original
|
PDF
|
UG385
Docu2009
recommended layout CSG324
CSG324
SPARTAN 6 UG385
spartan 6 LX150
XC6SLX4 2 CSG225 I
XC6SLX4 CSG225
UG385
LX150
AB p89
LX100T
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
PDF
|
VL43B1G63A-K0/K9/F8/E7M
1Gx72
204-PIN
VL43B1G63A
512Mx8
28-bit
204-pin
|
Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered
|
Original
|
PDF
|
VL43B1G63A-K0/K9/F8/E7M
1Gx72
204-PIN
VL43B1G63A
512Mx8
28-bit
204-pin
|
CSG324
Abstract: transistor bl p89 bl p76 transistor transistor bl p85 XC6SLX150T spartan 6 LX150t bl p78 transistor CPG196 CSG484 xc6slx75csg484
Text: Spartan-6 FPGA Packaging and Pinouts Product Specification UG385 v1.2 February 22, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
|
Original
|
PDF
|
UG385
CSG324
transistor bl p89
bl p76 transistor
transistor bl p85
XC6SLX150T
spartan 6 LX150t
bl p78 transistor
CPG196
CSG484
xc6slx75csg484
|
Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
|
OCR Scan
|
PDF
|
26x26
15X15
|
Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
|
OCR Scan
|
PDF
|
26x26
985-15x15
nnn-03-30
985-16X16-nnn-03-30
985-17X17-nnn-03-30
18X18-nnnâ
19X19--n
985-20X20-nm-03-30
985-21X21
-nnn-03-30
|