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    676 BGA Search Results

    676 BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    676 BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN:


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    PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    VSC9111

    Abstract: No abstract text available
    Text: G56053-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9111. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV DQ LQWHJUDWHG 621 76'+ WUDQVSRUW RYHUKHDG WHUPLQDWLQJ WUDQVFHLYHU IRU XVH LQ 676670 DSSOLFDWLRQV 7KH GHYLFH FDQ EH XVHG WR FRPELQH IRXU 676670 RU  676


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    PDF G56053-0, VSC9111. WHVWHU76, VSC9111

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-676-13-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-001 26 X 26


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    PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000


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    PDF C17200)

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-676-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-005 26 X 26


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    PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000


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    PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-000 26 X 26


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    PDF C17200) 64-56A 64-22A/31A 65-17A

    fg676

    Abstract: 676-Pin bga pin 676
    Text: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)


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    PDF FG676 676-PIN FG676) fg676 bga pin 676

    SF-BGA676C-B-41F

    Abstract: No abstract text available
    Text: 27.00mm [1.063"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 27.00mm [1.063"] Top View RoHS 25.00mm [0.984"] Ø 0.23mm [0.009"] ±0.0005" Side View 1.68mm [0.066"] 2 1 3 Description: Giga-snaP BGA SMT Foot 676 position male terminal pins to solder balls 1.0mm [0.039"] centers, 26x26 array


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    PDF 26x26 FR4/G10 SF-BGA676C-B-41F

    FF676

    Abstract: 676-BALL
    Text: R Flip-Chip BGA FF676 Package PK088 (v1.1) August 27, 2007 676-BALL FLIP-CHIP BGA (FF676) 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


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    PDF FF676) PK088 676-BALL co088 FF676

    FGG676

    Abstract: fg676 PK035
    Text: R PK035 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG676/FGG676) Package 676-BALL FINE-PITCH BGA, 1.00MM PITCH (FG676/FGG676) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


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    PDF PK035 FG676/FGG676) 676-BALL FGG676 fg676 PK035

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


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    PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    VSC9142

    Abstract: No abstract text available
    Text: G56054-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9142. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ


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    PDF G56054-0, VSC9142. VSC9142

    MS-034-AAL-1

    Abstract: EF676
    Text: 676 Ball Flip-Chip BGA EF676 Package PK375 (v1.0) May 26, 2009 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 (4X) D1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 PIN 1 I.D. 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF


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    PDF EF676) PK375 5M-1994e MS-034-AAL-1 EF676

    ATM machine using microcontroller

    Abstract: STS-48c VSC9112
    Text: G56048-0, Rev 1.0 STS-48c Physical Layer Packet/ATM Over SONET/SDH Device VSC9112. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ


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    PDF G56048-0, STS-48c VSC9112. ATM machine using microcontroller VSC9112

    recommended layout CSG324

    Abstract: CSG324 SPARTAN 6 UG385 spartan 6 LX150 XC6SLX4 2 CSG225 I XC6SLX4 CSG225 UG385 LX150 AB p89 LX100T
    Text: Spartan-6 FPGA Packaging and Pinouts Advance [optional]Product Specification UG385 v1.0 June 24, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


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    PDF UG385 Docu2009 recommended layout CSG324 CSG324 SPARTAN 6 UG385 spartan 6 LX150 XC6SLX4 2 CSG225 I XC6SLX4 CSG225 UG385 LX150 AB p89 LX100T

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL43B1G63A-K0/K9/F8/E7M 1Gx72 204-PIN VL43B1G63A 512Mx8 28-bit 204-pin

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered


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    PDF VL43B1G63A-K0/K9/F8/E7M 1Gx72 204-PIN VL43B1G63A 512Mx8 28-bit 204-pin

    CSG324

    Abstract: transistor bl p89 bl p76 transistor transistor bl p85 XC6SLX150T spartan 6 LX150t bl p78 transistor CPG196 CSG484 xc6slx75csg484
    Text: Spartan-6 FPGA Packaging and Pinouts Product Specification UG385 v1.2 February 22, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG385 CSG324 transistor bl p89 bl p76 transistor transistor bl p85 XC6SLX150T spartan 6 LX150t bl p78 transistor CPG196 CSG484 xc6slx75csg484

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan
    PDF 26x26 15X15

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan
    PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30