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    study of alloy

    Abstract: Cu6Sn5 63Sn37Pn 63Sn37Pb
    Text: Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao*, Luu Nguyen*, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 * National Semiconductor Corporation, Santa Clara, CA 95052 Abstract Aging effects and creep behavior along with


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