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    Fix Supply BULK-RS-E50MIL-8

    Military Grade MIL-R-3065E EPDM
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    Fix Supply BULK-RS-N50MIL-55

    Military Grade MIL-R-3065D F2 Ne
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    Dataman LP-SOP-16PIN(150MIL)

    The Dataman Lp-Sop-16Pin(150Mil) Is A Device Specific Adapter For Devices In Sop16. |Dataman LP-SOP-16PIN(150MIL)
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    Newark LP-SOP-16PIN(150MIL) Bulk 1
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    Dataman DIL8W/SOIC8 ZIF 150MIL

    The Dataman Dil8W/Soic8 Zif 150Mil Is A Universal Adapter For Soic Devices Up To 8-Pins. |Dataman DIL8W/SOIC8 ZIF 150MIL
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    Newark DIL8W/SOIC8 ZIF 150MIL Bulk 1
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    Dataman DIL16W/SOIC16 ZIF 150MIL

    The Dataman Dil16W/Soic16 Zif 150Mil Is A Universal Adapter For Soic Devices Up To 16-Pins. |Dataman DIL16W/SOIC16 ZIF 150MIL
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    Newark DIL16W/SOIC16 ZIF 150MIL Bulk 1
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    50MIL Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TLA-6T121

    Abstract: TLA-6T102-T TLA-6T103 TLA-6T118 6T115 78Q2120 DP83843 ICS1890 LXT970A ML6673
    Text: 1/18 001-01 / 20020221 / ed415_tla6t.fm LAN Components TLA-6T102/103/106/107/109/110/111/112/115/116/117/ 118/119/120/121/122/124/401/402/403/404/405 10/100BASE-TX Pulse Transformers TLA-6T102 FEATURES • 16-pin SOP package(1.27mm=50mil pin pitch). • Excellent common-mode noise suppression.


    Original     		10/100BASE-TX TLA-6T102 16-pin 50mil 100kHz] DP83843, ML6673, ICS1890, 78Q2120. TLA-6T102-T: TLA-6T121 TLA-6T102-T TLA-6T103 TLA-6T118 6T115 78Q2120 DP83843 ICS1890 LXT970A ML6673 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M02 EIAJ code : ∗SOP032-P-0450-1 32-pin plastic SOP Lead pitch 50mil Nominal dimensions 50mil Standard Conforms with EIAJ:TYPE IV Lead shape Gullwing Sealing method Plastic mold FPT-32P-M02 32-pin plastic SOP


    Original     		FPT-32P-M02 OP032-P-0450-1 50mil 450mil 32-pin FPT-32P-M02) 1994IAJ PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE PACKAGE 24 PIN CERAMIC FPT-24C-A01 24-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Metal seal FPT-24C-A01 24-pin ceramic SOP (FPT-24C-A01) 0.25(.010)MIN 6.99±0.64 (.275±.025) 10.16±0.18 (.400±.007) 7.11(.280) 23.04(.907)


    Original     		FPT-24C-A01 50mil 24-pin FPT-24C-A01) F24006SC-2-2 PDF

    LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
    Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 50mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 50mil 650mil 44-pad LCC-44C-F01) C44001SC-2-2 LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 PDF

    991066

    Abstract: No abstract text available
    Text: SMALL OUTLINE PACKAGE 18 PIN CERAMIC FPT-18C-C01 18-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Cerdip FPT-18C-C01 18-pin ceramic SOP (FPT-18C-C01) +0.33 11.10 –0.05 +.013 .437 –.002 0.64(.025)MAX 0.97±0.18 (.038±.007) 7.06±0.51


    Original     		FPT-18C-C01 50mil 18-pin FPT-18C-C01) F18001SC-2-2 991066 PDF

    a06 transistor

    Abstract: PGA-441C-A06 441pin 441-pin
    Text: PIN GRID ARRAY PACKAGE 441 PIN CERAMIC PGA-441C-A06 441-pin ceramic PGA Lead pitch 50mil Pin matrix 27 Sealing method Metal seal PGA-441C-A06 441-pin ceramic PGA (PGA-441C-A06) 0.20 ± 0.05 DIA. (.008 ± .002) C 0.50 (.020) TYP. (3 PLCS) 25.40 ± 0.50 SQ


    Original     		PGA-441C-A06 50mil 441-pin PGA-441C-A06) R441006SC-1-2 a06 transistor PGA-441C-A06 441pin PDF

    PGA257-C-S19U-1

    Abstract: 256c 256-PIN
    Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A01 EIAJ code : ∗PGA257-C-S19U-1 256-pin ceramic PGA Number of pins 257 pins includes extra index pin Lead pitch 50mil Pin matrix 19 Sealing method Metal seal (PGA-256C-A01) 256-pin ceramic PGA (PGA-256C-A01)


    Original     		PGA-256C-A01 PGA257-C-S19U-1 50mil 256-pin PGA-256C-A01) R256001SC-5-3 PGA257-C-S19U-1 256c PDF

    TSOP032-P-0400-1

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M17 EIAJ code : TSOP032-P-0400-1 Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP II (FPT-32P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)


    Original     		FPT-32P-M17 TSOP032-P-0400-1 50mil 400mil 32-pin FPT-32P-M17) TSOP032-P-0400-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)


    Original     		FPT-26P-M02 50mil 300mil 26-pin FPT-26P-M02) F26002S-3C-3 PDF

    209MIL

    Abstract: No abstract text available
    Text: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50mil Row spacing 209mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030)


    Original     		FPT-16C-C02 50mil 209mil 16-pin FPT-16C-C02) F16016SC-1-2 209MIL PDF

    LCC 18 Pin Package

    Abstract: QFJ044-P-S653-2
    Text: PLASTIC LEADED CHIP CARRIER 44 PIN PLASTIC LCC-44P-M02 EIAJ code : ∗QFJ044-P-S653-2 Lead pitch 50mil Package width x package length 653 × 653mil Lead shape J bend Sealing method Plastic mold 44-pin plastic QFJ PLCC (LCC-44P-M02) 44-pin plastic QFJ (PLCC)


    Original     		LCC-44P-M02 QFJ044-P-S653-2 50mil 653mil 44-pin LCC-44P-M02) LCC 18 Pin Package QFJ044-P-S653-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M03 EIAJ code : ∗SOP016-P-0375-1 16-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-16P-M03 16-pin plastic SOP


    Original     		FPT-16P-M03 OP016-P-0375-1 50mil 375mil 16-pin FPT-16P-M03) 00pitch PDF

    FPT-24P-M01

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP


    Original     		FPT-24P-M01 OP024-P-0300-1 50mil 300mil 24-pin FPT-24P-M01) FPT-24P-M01 PDF

    m7207

    Abstract: No abstract text available
    Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P76 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P76) 72-pin plastic SIMM (socket type) (MSS-72P-P76) 107.95±0.13


    Original     		MSS-72P-P76 50mil 72-pin MSS-72P-P76) m7207 PDF

    Untitled

    Abstract: No abstract text available
    Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P74 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P74) 72-pin plastic SIMM (socket type) (MSS-72P-P74) 107.95±0.13


    Original     		MSS-72P-P74 50mil 72-pin MSS-72P-P74) PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE 32 PIN PLASTIC LCC-32P-M03 EIAJ code : ∗SOJ032-P-0400-1 32-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-32P-M03 32-pin plastic SOJ (LCC-32P-M03) * : Resin protrusion. (Each side : 0.15 (.006) max)


    Original     		LCC-32P-M03 SOJ032-P-0400-1 50mil 400mil 32-pin LCC-32P-M03) PDF

    diode s453

    Abstract: QFJ028-P-S453-2 LCC-28P-M03
    Text: PLASTIC LEADED CHIP CARRIER 28 PIN PLASTIC LCC-28P-M03 EIAJ code : ∗QFJ028-P-S453-2 Lead pitch 50mil Package width x package length 453 × 453mil Lead shape J bend Sealing method Plastic mold 28-pin plastic QFJ PLCC (LCC-28P-M03) 28-pin plastic QFJ (PLCC)


    Original     		LCC-28P-M03 QFJ028-P-S453-2 50mil 453mil 28-pin LCC-28P-M03) diode s453 QFJ028-P-S453-2 LCC-28P-M03 PDF

    SIMM 30-pin

    Abstract: p03 transistor MSS-30P-P03 30-pin
    Text: SINGLE IN-LINE TYPE MODULE 30 PIN PLASTIC MSS-30P-P03 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 30-pin plastic SIMM socket type (MSS-30P-P03) 30-pin plastic SIMM (socket type) (MSS-30P-P03) 88.90 ±0.13(3.500 ±.005)


    Original     		MSS-30P-P03 50mil 30-pin MSS-30P-P03) SIMM 30-pin p03 transistor MSS-30P-P03 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M02 EIAJ code : ∗SOP024-P-0375-1 24-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-24P-M02 24-pin plastic SOP


    Original     		FPT-24P-M02 OP024-P-0375-1 50mil 375mil 24-pin FPT-24P-M02) PDF

    Untitled

    Abstract: No abstract text available
    Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P24 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 72-pin plastic SIMM socket type (MSS-72P-P24) 72-pin plastic SIMM (socket type) (MSS-72P-P24) 107.95±0.13(4.250±.005)


    Original     		MSS-72P-P24 50mil 72-pin MSS-72P-P24) PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M05 EIAJ code : ∗SOP020-P-0375-2 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M05 20-pin plastic SOP


    Original     		FPT-20P-M05 OP020-P-0375-2 50mil 375mil 20-pin FPT-20P-M05) PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M04 EIAJ code : ∗SOP016-P-0225-1 Lead pitch 50mil Nominal dimensions 225mil Standard Conforms with EIAJ: TYPE I Lead shape Gullwing Sealing method Plastic mold 16-pin plastic SOP FPT-16P-M04 16-pin plastic SOP


    Original     		FPT-16P-M04 OP016-P-0225-1 50mil 225mil 16-pin FPT-16P-M04) 00pitch PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-16C-F01
    Text: LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : ∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50mil Package width x package length 250 × 50mil Sealing method Frit seal LCC-16C-F01 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		LCC-16C-F01 QFN016-G-S250-1 50mil 250mil 16-pad LCC-16C-F01) C16003SC-2-2 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-16C-F01 PDF

    quad flat j-leaded package

    Abstract: QFJ-44C-C01
    Text: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 50mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25


    Original     		QFJ-44C-C01 50mil 650mil 44-pin QFJ-44C-C01) J44001SC-4-2 quad flat j-leaded package QFJ-44C-C01 PDF