48-VQFN PACKAGE Search Results

circuit diagram GSM transmitter receiver

Abstract: GSM 900, 1800, 1900 max power diagram Sony Semiconductor VQFN-48P-01 saw filter modulator circuit diagram Semiconductor Russia filter IF gsm 900 GSM900 IF FILTER gsm demodulator gsm1800 demodulator
Contextual Info: CXA3343ER DUETTO 2 GSM 900/1800/1900 DUAL/TRIPLE BAND RX/TX PRELIMINARY DATA SHEET Structure Bipolar silicon monolithic IC 48 pin VQFN Plastic 48PIN VQFN(PLASTIC) 1.0 MAX 6.4 36 25 13 (0 .1 48 12 1 0.4 x4 0.2 S A-B C S .3 9) x4 0.2 ± 0.01 0.03 ± 0.03 0.23 ± 0.02

CMX7045

Abstract: AIS TRANSMITTER GMSK SOTDMA AIS marine receiver PE0402 GNSS UNIVERSAL GMSK AIS automatic identification system
Contextual Info: Product Preview PP7045/1 November 2011 CMX7045 Marine AIS-SART Processor Automatic Identification System—Search and Rescue Transmitter 48-pin VQFN 48-pin LQFP Market Overview CMX7045 Brief Description AIS-SART (Automatic Identification System—Search and Rescue

Voice encryption

Abstract: CMX7011 CMX188 vocoder cml security access voice control system wireless door
Contextual Info: Product Preview PP7011/6 February 2013 CMX7011 Digital Voice Processor Analogue Communications Enhancements ACE for PMR/LMR Small 48-pin VQFN and LQFP Packages Introduction CMX7011 Brief Description The need for secure voice communication has become an important requirement for

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65154RSLR ACTIVE Package Type Package Pins Package Drawing Qty VQFN RSL 48

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65154RSLR ACTIVE Package Type Package Pins Package Drawing Qty VQFN RSL 48

48-PIN

Abstract: 404aa
Contextual Info: 48-PIN PLASTIC VQFN 6x6 HD D 36 37 25 24 E 48 HE 13 12 1 P DETAIL OF P PART S y A S c ZE C ZD 1 48 12 13 A B (UNIT:mm) ITEM D 37 36 24 25 Lp (0.35) (0.05) (0.2) e b x M S A-B C NOTE Although there are 4 terminals in the corner part of a package, these terminals are not designed for

Contextual Info: Product Brief Features: XC2300D - Series 16/32-bit µC for Low-End Automotive Safety The XC2300D series, with the XC233xD LQFP-64 and XC232xD (VQFN-48) derivatives, further enlarges the XC2300 microcontroller family in the low-end. With a maximum memory size of 160kB Flash and up to 12kB RAM, the microcontrollers of this series are well suited for low-end cost-sensitive safety applicationss

UCD3020A

Contextual Info: For data sheet and general inquiries on the UCD30xx part family, please contact ucd30xxdigitalpowersupport@list.ti.com PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing

UCD3020A

Contextual Info: For data sheet and general inquiries on the UCD30xx part family, please contact ucd30xxdigitalpowersupport@list.ti.com PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE OPTION ADDENDUM

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 27-Jan-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2)

Contextual Info: For data sheet and general inquiries on the UCD30xx part family, please contact ucd30xxdigitalpowersupport@list.ti.com PACKAGE MATERIALS INFORMATION www.ti.com 21-Jan-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 2-May-2014 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp

VQFN package

Abstract: jedec package MO-220 Die Attach epoxy stamping MO-220 "exposed pad" PCB via IPC A 610
Contextual Info: VQFN PCB Design Guidance Notes Publication: D/VQFN/2 February 2008 General guidelines on using the CML VQFN package 2008 CML Microsystems Plc VQFN PCB Design Guidance Notes 1. Introduction VQFNs are near chip scale plastic encapsulated leadless packages that CML has adopted for a

ADS8380

Abstract: ADS8381 ADS8383 ADS8481 ADS8484 va710
Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

Contextual Info: SN74SSTVF16859 13ĆBIT TO 26ĆBIT REGISTERED BUFFER WITH SSTL_2 INPUTS AND OUTPUTS SCES429B − MARCH 2003 − REVISED FEBRUARY 2004 D Member of the Texas Instruments D D D D D D D D D D D D D D DGG PACKAGE TOP VIEW Widebus Family Operates at 2.3 V to 2.7 V for PC1600,

Contextual Info: BurrĆBrown Products from Texas Instruments ADS8484 SLAS511 – NOVEMBER 2007 18-BIT, 1.25-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE • 48-Pin 7x7 QFN Package 1.25-MHz Sample Rate