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    45X45 BGA Search Results

    45X45 BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    45X45 BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    plastic ul94v0

    Abstract: 45x45 bga 45x45 mm bga 6063
    Text: Model Name : MBA45001-15W/2.6 BGA Heat Sink For 45x45 Chip set MBA45001-15W/2.6 Specification: 1.Material: Heat Sink : Aluminum 6063 Clip : Plastic UL94-V0 2.Heat Sink Dimension : 44.6*44.6*14.6 mm height (with base) Base : 2.6mm, Fin height : 12mm 3.Weight: 31.2 gm


    Original     		MBA45001-15W/2 45x45 UL94-V0) MBA45001-28W/2 plastic ul94v0 45x45 bga 45x45 mm bga 6063 PDF

    45x45 bga

    Abstract: 45x45 mm bga
    Text: 480 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A F K L φM φP M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of


    Original     		45x45) S480S2-K6-2 45x45 bga 45x45 mm bga PDF

    45x45 bga

    Abstract: No abstract text available
    Text: 672 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A K L φM φP F M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of


    Original     		45x45) S672S2-K6-2 45x45 bga PDF

    11 ak 30 a4

    Abstract: 45x45 bga
    Text: 480-PIN PLASTIC BGA ADVANCED (45x45) D B ZE A ZD 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B 3-C0.5 INDEX AREA C1.25 A A2


    Original     		480-PIN 45x45) P480S9-127-K6 11 ak 30 a4 45x45 bga PDF

    11 ak 30 a4

    Abstract: ZD 580 p 127
    Text: 580-PIN PLASTIC BGA ADVANCED (45x45) D B A ZE ZD 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B 3-C0.5 INDEX AREA C1.25 A A2


    Original     		580-PIN 45x45) P580S9-127-K6 11 ak 30 a4 ZD 580 p 127 PDF

    11 AK 30 S-2

    Abstract: 45x45 mm bga
    Text: 580 PIN PLASTIC BGA 45x45 A B B A 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 C D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B Index area J H G S detail of A part A K L


    Original     		45x45) S580S2-K6-2 11 AK 30 S-2 45x45 mm bga PDF

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545 PDF

    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842 PDF

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)


    Original     		BGA45 1849-pin 1752-pin BGA45 SSD-A-H7053-1 JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 BGA4545 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    socket 1155

    Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294
    Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		NP352 10mA/20mV NP352-1600-54-* NP352-160018 45x45 NP352-1849-35 NP352-106426 socket 1155 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294 PDF

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20 PDF

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1 PDF

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1 PDF

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20 PDF

    100GBASE-R

    Abstract: QSFP 40G transceiver 40GBASE-R CPRI multi rate gearbox pcie gen3 QSFP optical active cable QSFP M20K 5SGX
    Text: Stratix V Device Family Overview SV51001-1.3 This document provides an overview of the Stratix V device features. Many of these features are enabled in the Quartus ® II software version 10.0. The remaining features will be enabled in future versions of the Quartus II software.


    Original     		SV51001-1 28-nm 100GBASE-R QSFP 40G transceiver 40GBASE-R CPRI multi rate gearbox pcie gen3 QSFP optical active cable QSFP M20K 5SGX PDF

    Untitled

    Abstract: No abstract text available
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]


    OCR Scan     		16X16 17X17 PDF

    16X16

    Abstract: bga 576 socket bga 24x24 576
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00


    OCR Scan     		16X16 C-1640240 bga 576 socket bga 24x24 576 PDF

    EA-190-H125-T710

    Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
    Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow


    Original     		UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710 PDF

    strapack s-669

    Abstract: strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1
    Text: 1999年 1 月 ver. 4 イントロダク ション Application Note 71 現在表面実装用のJリード・パッケージ、クワッド・フラット・パック （QFP）パッケージ、およびFineLine BGATMを含むボール・グリッド・ア


    Original     		-AN-071-04/J strapack s-669 strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1 PDF

    GAL20V8B-15LD

    Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
    Text: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.


    Original     		I0162 GAL20V8B-15LD pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2 PDF

    SOP48

    Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
    Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7


    OCR Scan     		QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 CF RM sot89 SOP38 14X14X2 epson QFP 216 45x45 mm bga 14x14x2.7 PDF

    456-BGA

    Abstract: 45x45 bga 8kx1 RAM LB 156 15G04K100 15G04K200 25G01K100 25G02K100
    Text: Programmable Serial Interface High Speed Devices PRELIMINARY Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps–1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path


    Original     		PDF

    45x45 bga

    Abstract: 15G04K100 15G04K200 25G01K100 25G02K100
    Text: Programmable Serial Interface PRELIMINARY High Speed Devices Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps – 1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path


    Original     		384Kb 45x45 bga 15G04K100 15G04K200 25G01K100 25G02K100 PDF