400MM2 Search Results
400MM2 Price and Stock
Cinch Connectivity Solutions CGM-1400-MM-29M-02COAX ADAPT 2.92MM TO 2.92MM |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CGM-1400-MM-29M-02 | Bag | 10 | 1 |
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CGM-1400-MM-29M-02 | 72 |
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400MM2 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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S5 100 B112 MT RELAY
Abstract: CK 66 UL 94V-0 LCD sh 0357 94v-0 c225t F8212 panduit standoff RF based remote control robot circuit diagram of incubator D1148 burndy Y35 crimping tool manual
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SA-NCCB51 S5 100 B112 MT RELAY CK 66 UL 94V-0 LCD sh 0357 94v-0 c225t F8212 panduit standoff RF based remote control robot circuit diagram of incubator D1148 burndy Y35 crimping tool manual | |
transistor fet 3884
Abstract: MS-013 SO20 AN10273
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BUK9MGP-55PTS BUK9MGP-55PTS transistor fet 3884 MS-013 SO20 AN10273 | |
PQ018EH01ZPH
Abstract: 015E PQ015EH01ZPH PQ015EH01ZZH PQ018EH01ZZH PQ025EH01ZPH PQ025EH01ZZH O10F PQXXXEH01ZXH
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PQxxxEH01ZxH O-263 11ZxH PQ025EH01ZxH 120Hz 3600mm2 900mm2 400mm2 115mm2 PQ018EH01ZPH 015E PQ015EH01ZPH PQ015EH01ZZH PQ018EH01ZZH PQ025EH01ZPH PQ025EH01ZZH O10F | |
W3E32M72SR-XSBXContextual Info: White Electronic Designs W3E32M72SR-XSBX 32Mx72 REGISTERED DDR SDRAM FEATURES BENEFITS Registered for enhanced performance of bus speeds of 200, 250, 266Mb/s 74% SPACE SAVINGS vs. TSOP Reduced part count Package: 51% I/O reduction vs TSOP • 208 Plastic Ball Grid Array PBGA , 16 x 25mm |
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W3E32M72SR-XSBX 32Mx72 266Mb/s E32M72SR-XSBX W3E32M72SR-XSBX | |
m5248p
Abstract: M5268P M5264L M5262L 5269L M5272L 5262L M5266P 5286P
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5262L 0V/60V) \900mm2/ 5248P 5286P 16-pm \400mm2/ 5268P 5269L 5270L m5248p M5268P M5264L M5262L 5269L M5272L M5266P | |
CD12L-0B-020-A0
Abstract: 0N4A SSP-0P-4E mouse PHOTO SENSORS photoswitch SS2-0P-4A SS5-0P-4E CD12M-0B-070-A1 0P4A SS2-0N-4A
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M18x1 M12x1 100mm CD12L-0B-020-A0 0N4A SSP-0P-4E mouse PHOTO SENSORS photoswitch SS2-0P-4A SS5-0P-4E CD12M-0B-070-A1 0P4A SS2-0N-4A | |
Contextual Info: ELECTRICAL SOLUTIONS A. System Overview CD-940 Crimping Dies • Color-coded for easy matching to color-coding marked on connectors • Embosses die index number on connector barrels for post crimp inspection B1. Cable Ties • Part number permanently marked on crimping die for |
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CD-940 CD-940-750 400mm2 CT-940CH CT-2940 CD-920, CDM-920, CD-930 CD-940 CD-940-DA | |
BUSBAR calculation free
Abstract: EN27779 BUSBAR calculation earth BUSBAR calculation online ups battery charger project 3 phase BUSBAR IEC 60439-1 62040-2 62040-1 ral 7035
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Windows/95, Windows/98, BUSBAR calculation free EN27779 BUSBAR calculation earth BUSBAR calculation online ups battery charger project 3 phase BUSBAR IEC 60439-1 62040-2 62040-1 ral 7035 | |
kodak
Abstract: IEC60825-1 Metal detection sensor distance of 20 cm Infrared emitter RED laser diode operating Temperature EN50081-1 EN50082-2 RL110 IEC-60825-1 RL100D
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10-30VDC Photo/03/03 kodak IEC60825-1 Metal detection sensor distance of 20 cm Infrared emitter RED laser diode operating Temperature EN50081-1 EN50082-2 RL110 IEC-60825-1 RL100D | |
ic 7447
Abstract: 7447 7447 IC ATR0600 ASK-LS-0-000-0 AEK-LS-0-000-0 data sheet IC 7447 ATR0620 ATR0610 AHK-LS-0-000-0
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ATR0610 ATR0620) ATR0600 ic 7447 7447 7447 IC ASK-LS-0-000-0 AEK-LS-0-000-0 data sheet IC 7447 ATR0620 AHK-LS-0-000-0 | |
EN60947-5-2
Abstract: lux sensor EN50082-2 Infrared emitter led optics LED Reflective Optical Sensor Metal detection sensor distance of 20 cm RED laser diode operating Temperature short distance detection EN50081-1
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10-30VDC 100mm Photo/03/03 EN60947-5-2 lux sensor EN50082-2 Infrared emitter led optics LED Reflective Optical Sensor Metal detection sensor distance of 20 cm RED laser diode operating Temperature short distance detection EN50081-1 | |
soil moisture sensors
Abstract: Victory Engineering Thermistor asymtek victory engineering spreeta biosensor miniature mass air flow sensor spreeta LED InfraTec spreeta 2000
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SW-846 soil moisture sensors Victory Engineering Thermistor asymtek victory engineering spreeta biosensor miniature mass air flow sensor spreeta LED InfraTec spreeta 2000 | |
Contextual Info: BUK9MPP-55PRR Dual TrenchPLUS logic level FET Rev. 01 — 14 May 2009 Product data sheet 1. Product profile 1.1 General description Dual N-channel enhancement mode field-effect power transistor in SO20. Device is manufactured using NXP High-Performance HPA TrenchPLUS technology, featuring |
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BUK9MPP-55PRR BUK9MPP-55PRR | |
BUK9MJJ-55PTT
Abstract: MS-013 SO20
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BUK9MJJ-55PTT BUK9MJJ-55PTT MS-013 SO20 | |
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STR F 9208 L
Abstract: P45M cdm-9 CD930 CD-930G-250 HTCT250-2-1 120mm2 GCE250-250 CD-930H INDEX11
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CD-920 CTAPF4-12-C CTAPF3-12-C CTAPF2-12-C CTAPF1-12-C CTAPF1/0-12-L CTAPF2/0-12-Q CTAPF3/0-12-Q CD-920 CD-930G-1/0 STR F 9208 L P45M cdm-9 CD930 CD-930G-250 HTCT250-2-1 120mm2 GCE250-250 CD-930H INDEX11 | |
IC CS 3758 GP
Abstract: CS 3758 GP MOTOROLA smd SCR vrm chip fault finding SCR 30A 400V ek c06 Thyristor catalog three phase SCR gate drive circuit SCR firing circuit diode S68a
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U-157 UC3886 UC3910 UC3910 U-156, DL137/D U-158, IC CS 3758 GP CS 3758 GP MOTOROLA smd SCR vrm chip fault finding SCR 30A 400V ek c06 Thyristor catalog three phase SCR gate drive circuit SCR firing circuit diode S68a | |
Contextual Info: W3E32M72SR-XBX 32Mx72 REGISTERED DDR SDRAM FEATURES BENEFITS Registered for enhanced performance of bus speeds of 200, 250, 266Mb/s 74% SPACE SAVINGS vs. TSOP Package: 51% I/O reduction vs TSOP Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 25mm |
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W3E32M72SR-XBX 32Mx72 266Mb/s | |
Burndy lphY46
Abstract: STR 20012 burndy Y35 crimping tool manual Burndy Y46 PARTS
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CT-2001 CD-2001-6 SCSSTCT250-250 CD-930H-250 CD-920H CD-930H CT-940CH CT-2940 Burndy lphY46 STR 20012 burndy Y35 crimping tool manual Burndy Y46 PARTS | |
ecg voltage regulator 3v
Abstract: PQ070XH02Z PQ070XH02ZP PQ070XH02ZZ
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PQ070XH02Z O-263 ecg voltage regulator 3v PQ070XH02ZP PQ070XH02ZZ | |
015Y3H
Abstract: PQ015Y053ZP PQ015Y053ZZ PQ015Y3H3ZP PQ015Y3H3ZZ PQ025Y053ZP PQ025Y3H3ZP PQ025Y3H3ZZ PQ033Y053ZP PQ033Y3H3ZP
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Series/PQxxxY053Z 015Y3H 015Y3H PQ015Y053ZP PQ015Y053ZZ PQ015Y3H3ZP PQ015Y3H3ZZ PQ025Y053ZP PQ025Y3H3ZP PQ025Y3H3ZZ PQ033Y053ZP PQ033Y3H3ZP | |
HK-10S100-4500
Abstract: 10s100 ERC80-004 vthon
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To-263 150kHz) 1CY503H 3600mm2 900mm2 400mm2 115mm2 OP06069 HK-10S100-4500 10s100 ERC80-004 vthon | |
18COContextual Info: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 64 • 1.0mm pitch |
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W3H64M64E-XSBX 18CO | |
Contextual Info: White Electronic Designs W3E32M72SR-XSBX ADVANCED* 32Mx72 REGISTERED DDR SDRAM FEATURES BENEFITS Registered for enhanced performance of bus speeds of 200, 250, 266Mb/s 74% SPACE SAVINGS vs. TSOP Package: 51% I/O reduction vs TSOP • 208 Plastic Ball Grid Array PBGA , 16 x 25mm |
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32Mx72 266Mb/s W3E32M72SR-XSBX | |
MARKING 1F5
Abstract: CP1032 606016 5R23K
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CP1032 150kHz) O-263-5) O-220-5) MARKING 1F5 CP1032 606016 5R23K |