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    4-LAYER PCB LAYOUT GUIDELINE Search Results

    4-LAYER PCB LAYOUT GUIDELINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PXAC37KFBD/00 Rochester Electronics LLC PXAC37 - XA 16-bit microcontroller family 32K/1024 OTP CAN transport layer controller Visit Rochester Electronics LLC Buy
    C467 Coilcraft Inc Designer's Kit, SLC/SLR, SM power inductors, RoHS Visit Coilcraft Inc
    CCE4502 CC 3.3L-QFN Renesas Electronics Corporation IO-Link Device Phy with Integrated Frame Handler Visit Renesas Electronics Corporation
    CCE4502 CC 5B-CSP Renesas Electronics Corporation IO-Link Device Phy with Integrated Frame Handler Visit Renesas Electronics Corporation
    CCE4502 CC 5L-QFN Renesas Electronics Corporation IO-Link Device Phy with Integrated Frame Handler Visit Renesas Electronics Corporation

    4-LAYER PCB LAYOUT GUIDELINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AT85C51SND3Bx

    Abstract: AT89C51SND3 PGB0010603MR 77 dpf Automotive USB connector
    Text: High Speed USB Design Guidelines 1. Introduction This document provides guidelines for integrating a AT85C51SND3Bx high speed USB device controller onto a 4-layer PCB. The material covered can be broken into two main categories: board design guidelines and layout examples.


    Original     		PDF AT85C51SND3Bx AT85C51SND3Bx AT89C51SND3 PGB0010603MR 77 dpf Automotive USB connector

    4-Layer PCB Layout Guideline for HDMI Products In

    Abstract: prepreg FR4 Prepreg 4-Layer PCB Layout Guideline for HDMI Products FR4 microstrip stub "HDMI connector" hdmi connector 4-Layer PCB Layout Guideline prepregs AN204
    Text: 204 PI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products Introduction The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and 1.3a. Rev. 1.3a has a more relaxed specification which allows an occurrence of a single


    Original     		PDF 250ps. AN204 4-Layer PCB Layout Guideline for HDMI Products In prepreg FR4 Prepreg 4-Layer PCB Layout Guideline for HDMI Products FR4 microstrip stub "HDMI connector" hdmi connector 4-Layer PCB Layout Guideline prepregs

    AN2733

    Abstract: touchpad sensor pcb PET ITO stack-up FR4 epoxy glass 1.6mm substrate Capacitive PCB touchpad sensor grid pcb design sensor indium oxide pet GC25405 touch controller IC touchpad sensor pcb design
    Text: AN2733 S-Touch PCB and layout guidelines Introduction The aim of this application note is to provide guidelines for the construction and the layout of different types of printed circuit boards PCB for the implementation of S-TouchTM capacitive devices: the FR4 and flexible PCBs or the ITO panel.


    Original     		PDF AN2733 AN2733 touchpad sensor pcb PET ITO stack-up FR4 epoxy glass 1.6mm substrate Capacitive PCB touchpad sensor grid pcb design sensor indium oxide pet GC25405 touch controller IC touchpad sensor pcb design

    fbga Substrate design guidelines

    Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
    Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB


    Original     		PDF AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195

    capacitive level sensor

    Abstract: capacitive touch sensor pcb guideline finger print using labview capacitive touch slider Capacitive PCB capacitive touch sensor labview 3M Touch Systems Capacitive Guidelines touch switch with pcb layout finger print sensor pcb with circuit
    Text: AN 19.16 Physical Design and Layout Guidelines for Capacitive Sensor Systems 1 Overview SMSC’s capacitive sensor family provides systems with a wide variety of slider, button, and LED driver functionality. This application note describes design and printed circuit board PCB layout techniques


    Original     		PDF

    467MP

    Abstract: PET ITO stack-up AD7147 ic PRESSURE SENSOR AD7148 AN-957 AN957 Touch Sensor layout sensor pcb
    Text: AN-957 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Layout Guidelines for the AD7147 and AD7148 CapTouch Controllers by Susan Pratt The stack-up in Table 2 is recommended to ensure there is


    Original     		PDF AN-957 AD7147 AD7148 AN07374-0-4/08 467MP PET ITO stack-up ic PRESSURE SENSOR AN-957 AN957 Touch Sensor layout sensor pcb

    FR4 Prepreg for RF 06 layer PCB

    Abstract: Ablestik 84-1 lmis N4000-13 ablestik ablebond TRF1123 TRF1223 C001 ablebond ablestik m0021
    Text: Application Report SLWA038 – June 2005 Junction Temperature of TRF1123/TRF1223 and Recommended PCB Layout Guidelines Tim McGovern . Wireless Infrastructure - Radio ABSTRACT


    Original     		PDF SLWA038 TRF1123/TRF1223 TRF1123 TRF1223. FR4 Prepreg for RF 06 layer PCB Ablestik 84-1 lmis N4000-13 ablestik ablebond TRF1223 C001 ablebond ablestik m0021

    pcb layout guide differential ohms stackup

    Abstract: magnetic module ethernet 802.3-2005 Decoupling And Layout Of Digital Printed Circuits rj45 stackup cm choke DESIGN RULE PCB AN18 magnetics basic AN-186
    Text: AN18.6 SMSC Ethernet Physical Layer Layout Guidelines 1 Introduction SMSC Ethernet products are highly-integrated devices designed for 10 or 100 Mbps Ethernet systems. They are based on IEEE 10BASE-T and 100BASE-TX standards. The IEEE 802.3-2005 standard for


    Original     		PDF 10BASE-T 100BASE-TX pcb layout guide differential ohms stackup magnetic module ethernet 802.3-2005 Decoupling And Layout Of Digital Printed Circuits rj45 stackup cm choke DESIGN RULE PCB AN18 magnetics basic AN-186

    MMM7210

    Abstract: AN3585 L302 inductor C338 EUROPE C338 c341 transistor diode c341 transistor c341 FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET C342
    Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding


    Original     		PDF AN3585 MC13853 QFN16 MMM7210 AN3585 L302 inductor C338 EUROPE C338 c341 transistor diode c341 transistor c341 FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET C342

    AN3585

    Abstract: c337 transistor C338 c341 transistor MMM7210 C337 C339 C340 C341 C342
    Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding


    Original     		PDF AN3585 MC13853 QFN16 AN3585 c337 transistor C338 c341 transistor MMM7210 C337 C339 C340 C341 C342

    iMX28EVK

    Abstract: emmc MX283 emmc4.4 ring ferrite inductor design I.MX28 RJ45 SMALL Freescale i.MX28 AN4215 DDR2 layout guidelines
    Text: Freescale Semiconductor Application Note Document Number: AN4215 Rev. 0, 09/2010 i.MX28 Layout and Design Guidelines This application note describes proper design, placement, and PCB routing techniques for the i.MX28 processor. Freescale Semiconductor, Inc., 2009. All rights reserved.


    Original     		PDF AN4215 iMX28EVK emmc MX283 emmc4.4 ring ferrite inductor design I.MX28 RJ45 SMALL Freescale i.MX28 AN4215 DDR2 layout guidelines

    ER226303

    Abstract: rj45 connector to parallel port RJ45 low connector pcb board LAN9500 LAN9500i magnetic module ethernet schematic usb to rj45 PIN DIAGRAM OF RJ45 to usb RJ45 flat Lan RJ45 TAP UP
    Text: AN 18.0 LAN9500/LAN9500i Layout Guidelines Chapter 1 Introduction The LAN9500/LAN9500i is a high performance solution for USB to 10/100 Ethernet port bridging. With applications ranging from embedded systems, set-top boxes, and PVR’s, to USB port replicators, USB


    Original     		PDF LAN9500/LAN9500i LAN9500/LAN9500i ER226303 rj45 connector to parallel port RJ45 low connector pcb board LAN9500 LAN9500i magnetic module ethernet schematic usb to rj45 PIN DIAGRAM OF RJ45 to usb RJ45 flat Lan RJ45 TAP UP

    pcb crystal layout

    Abstract: pcie Design guide MCS9901 USB 3 pcb layout LAYOUT GUIDELINES MCS9901-4S-EVB 200mil high speed parallel to usb IC connector Crystal oscillator 12 MHz USB Connector pcb layout
    Text: PCB Layout GuideLines MCS9901 PCB Layout Guidelines 1.Introduction As system operation speeds are increasing, PCB layout is becoming increasingly complex. A successful high-speed layout / PCB need to integrate the IC’s and other peripherals / components effectively into a single design. MCS9901 has PCIe, Serial,


    Original     		PDF MCS9901 pcb crystal layout pcie Design guide USB 3 pcb layout LAYOUT GUIDELINES MCS9901-4S-EVB 200mil high speed parallel to usb IC connector Crystal oscillator 12 MHz USB Connector pcb layout

    PIN DIAGRAM OF RJ45 to usb

    Abstract: LAN9512 CONNECTOR 5 PIN FOR pcb mount RJ45 low connector pcb board RJ45 CONNECTOR PLUG schematic usb to rj45 EMC for PCB Layout ER226303 LAN9514 LAN9514 SMSC
    Text: AN 19.20 LAN9512/LAN9513/LAN9514 Layout Guidelines 1 Introduction The LAN9512/LAN9513/LAN9514 is a high performance Hi-Speed USB 2.0 hub with a 10/100 Ethernet Controller. With applications ranging from embedded systems, desktop PCs, notebook PCs, printers,


    Original     		PDF LAN9512/LAN9513/LAN9514 LAN9512/LAN9513/LAN9514 PIN DIAGRAM OF RJ45 to usb LAN9512 CONNECTOR 5 PIN FOR pcb mount RJ45 low connector pcb board RJ45 CONNECTOR PLUG schematic usb to rj45 EMC for PCB Layout ER226303 LAN9514 LAN9514 SMSC

    XE166

    Abstract: XC2000 xc2000 reference manual AP24026 reference design using infineon infineon qfp144 QFP-100 AP16116
    Text: Application Note, V1.1, October 2007 AP16116 XC2000 & XE166 Families Design Guidelines for XC2000 & XE166 Microcontroller Board Layout Microcontrollers Edition 2007-10 Published by Infineon Technologies AG 81726 Münich, Germany 2007 Infineon Technologies AG


    Original     		PDF AP16116 XC2000 XE166 XE166 QFP-144) QFP-100) XC2000 xc2000 reference manual AP24026 reference design using infineon infineon qfp144 QFP-100 AP16116

    ER226303

    Abstract: LAN9500Ai LAN9500 LAN9500i LAN9500A RJ45 flat Lan RJ45 BOTTOM ENTRY LAN950x rj45 stackup
    Text: AN 18.0 LAN9500/LAN9500i LAN9500A/LAN9500Ai Layout Guidelines Chapter 1 Introduction The SMSC LAN950x is a family of high performance Hi-Speed USB 2.0 to 10/100 Ethernet controllers. The “x” in the part number is a generic term referring to the entire family, which includes the following


    Original     		PDF LAN9500/LAN9500i LAN9500A/LAN9500Ai LAN950x LAN9500 LAN9500i LAN9500A LAN9500Ai ER226303 LAN9500Ai LAN9500 LAN9500i LAN9500A RJ45 flat Lan RJ45 BOTTOM ENTRY rj45 stackup

    epoxy prepreg panasonic

    Abstract: Capacitor tantalum 0402 10uF/16V IPC-600-A IPC-SM-840 type b class 2 ceramic capacitor 1uf/16v UAR10-4W5100 IPC-6011 ipc sm 840 CMD15-21VRC smd diode s1
    Text: WirelessUSB LS Micro-Bridge Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for micro-bridge printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio IC and its application as an


    Original     		PDF

    AN2010

    Abstract: ZL2005 ZL2006 ZL2105 ZL2106 A-100 AN2011 AN2015
    Text: Thermal and Layout Guidelines for Digital-DC Products Application Note May 01, 2009 AN2010.0 Introduction This application note provides guidance on the thermal considerations and preferred layout practices for using Zilker Labs’ Digital-DC power management and


    Original     		PDF AN2010 ZL2005 ZL2006 ZL2105 ZL2106 A-100 AN2011 AN2015

    isp1763a

    Abstract: ISP1763AHNUM ISP1763 PCB design AN3184 FR4 Prepreg VFQFPN64 ericsson switch CD00269082 diodes 2f3
    Text: ISP1763A PCB design guidelines AN3184 Application note Abstract This document describes the PCB design guidelines for the ISP1763A. Keywords isp1763a; host controller; peripheral controller; otg controller; usb; universal serial bus CD00269082 Rev 2 2010-08-18


    Original     		PDF ISP1763A AN3184 ISP1763A. isp1763a; CD00269082 ISP1763A ISP1763AHNUM ISP1763 PCB design AN3184 FR4 Prepreg VFQFPN64 ericsson switch CD00269082 diodes 2f3

    Routability

    Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
    Text: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.


    Original     		PDF XAPP157 FG1156 Routability XAPP157 FG676 BGA 23 x 23 array FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball

    isp1763a

    Abstract: Ericsson reference manual "USB Connector" ISP1763 diodes 2f3 dm led circuits ST OTG controller VFQFPN64 AN3184 PCB design
    Text: ISP1763A PCB design guidelines AN3184 Application note Abstract c u d This document describes the PCB design guidelines for the ISP1763A. Keywords e t le s t o r P o s b O - isp1763a; host controller; peripheral controller; otg controller; usb; universal serial bus


    Original     		PDF ISP1763A AN3184 ISP1763A. isp1763a; CD00269082 ISP1763A Ericsson reference manual "USB Connector" ISP1763 diodes 2f3 dm led circuits ST OTG controller VFQFPN64 AN3184 PCB design

    SPEAr300

    Abstract: SPEAr310 0402 land pattern ddr pcb layout DDR2 pcb layout spear SPEAr320 ARM926 LFBGA289 DL1 327
    Text: AN2674 Application note PCB layout guidelines for SPEAr3xx Introduction SPEAr3xx is a 15 x15 mm LFBGA289 device family with 0.8 mm ball pitch. The SPEAr3xx family includes SPEAr300, SPEAr310 and SPEAr320. SPEAr3xx devices all feature the ARM926 core running at up to 333 MHz, an external


    Original     		PDF AN2674 LFBGA289 SPEAr300, SPEAr310 SPEAr320. ARM926 1420y SPEAr300 0402 land pattern ddr pcb layout DDR2 pcb layout spear SPEAr320 DL1 327

    GMII layout

    Abstract: ardent 88E3080 AR2224 rmii trace layout guidelines
    Text: Application Note REV 1.0, March 2001 Ardent AR2224 Reference Board PCB Layout Guidelines BLUE AR2224 A3 Confidential Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics.


    Original     		PDF AR2224 88E3080. RJ-45 GMII layout ardent 88E3080 rmii trace layout guidelines

    DDR2 pcb layout

    Abstract: AA10 AN2797 ARM926 PBGA420
    Text: AN2797 Application note PCB layout guidelines for SPEAr600 Introduction SPEAr600 is a 23 x 23 mm PBGA420 device with 1 mm ball pitch. It is a member of the SPEAr family of 32-bit embedded MPUs. The device features dual ARM926 cores running at up to 333 MHz, an external DDR2 memory interface and a full set of powerful on-chip


    Original     		PDF AN2797 SPEAr600 SPEAr600 PBGA420 32-bit ARM926 SPEAr600. DDR2 pcb layout AA10 AN2797