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    Abstract: No abstract text available
    Text: I 3 iv a 9003/80/20 »HO ÀX038 A3Ü ON SN0ISIA3Ü 3SV313Ü M3N 0 8 LO O Z/yZ/LO JZH D jD Q A jip o fl 18 0L0Z/8L/90 JZH D JD Q ¿upon 38 ZS'IL 28'8S OZ' IS 3 L‘9 f L L 6C 96’SC 2 fC C L9‘62 LO 'LZ CS>3 Z U OZ ¿rn OL'CL 8 £Z'Z9 C S '6 f 16' If C8’9C


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    Abstract: No abstract text available
    Text: 3 : File No. I I o SHEET 227 1 /2 kSPECIFICATION l1. General Characteristics 3.0m m Micro Fit 2XXX SMT 90* Wafer Shell Tap:SMT 2.Material&iFinish Insulator: P A 4 6 U L 9 4 V -0 , Black Contact: Copper Alloy,Tin Plated 3.Electrical Characteristics 0.64±0.01


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