amkor flip
Abstract: 3D-IC 3D IC TSV 3D IC cu pillar 50um silicon die attach amkor Cu pillar FCCSP
Text: solution three-dimensional packages technology Through Silicon Via TSV Wafer Finishing & Flip Chip Stacking Through silicon via (TSV) interconnects are emerging to serve a wide range of 3D packaging applications and 3D IC architectures that demand higher levels of performance and silicon integration. To enable the use of TSVs in these 3D
|
Original
|
|
PDF
|
ECG sensor
Abstract: epic sensor ECG Semiconductors WLCSP flip chip FO-WLP micromechanical
Text: Plessey Semiconductors debuts ECG sensor from passive component project - Electro. Page 1 of 2 ADVERTISE | SUBSCRIBE Home Semiconductors Packaging MEMS LEDs Displays Photovoltaics Energy Storage ElectroIQ E-Source Magazines Plessey Semiconductors debuts ECG sensor from
|
Original
|
/03/plessey-semiconductors-debuts-ecg-sen
ECG sensor
epic sensor
ECG Semiconductors
WLCSP flip chip
FO-WLP
micromechanical
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Engineering Ultra Low Power System on Chip Sensors Steve Grady – Cymbet Scott Hanson – Ambiq Micro Jim Magos – Cardinal Components Key Trends Driving Micro SoC Sensors Ultra Low Power Processors Smart Devices and Sensors Everywhere Wireless is pervasive
|
Original
|
CBC34813
AM0813
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products
|
Original
|
|
PDF
|
Trends And Opportunities In Semiconductor Licensing
Abstract: FinFET
Text: Semiconductor Licensing Trends Trends And Opportunities In Semiconductor Licensing By Stefan Tamme, Stephen Schott, Dogan Gunes, Jeffrey Wallace, Richard Boadway, Frank Razavi, and Marc Pépin Summary The following article examines the impact of current business, technology, and international trends
|
Original
|
|
PDF
|
TCI D2S
Abstract: TCI D2S f TE2515 ADI881 AD1819 AD1881 ADI819A SR10 SRO15 5310H
Text: ANALOGDEVICES fAX-ON-DEMAND HOTLINE ,. - Page HI ANALOG DEVICES AC'97 SoundM~ Codec AD1881 AC '97 2.1 FEATURES Variable Sample Rate True Line-level Output AC '97 FEATURES Fully Compliant AC '97 Analog 1/0 Component 48-lead lQFP Pacl age Multibit !,d Converter Architecture for Improved
|
Original
|
AD1881
48-lead
16-Bit
ST-48)
TCI D2S
TCI D2S f
TE2515
ADI881
AD1819
AD1881
ADI819A
SR10
SRO15
5310H
|
PDF
|
Light Detector laser
Abstract: short distance measurement ir infrared diode
Text: Opto-semiconductors Condensed Catalog HAMAMATSU PHOTONICS K.K. Our unique photonics technology delivers highly sophisticated opto-semiconductors with high-sensitivity and high-speed response. Hamamatsu Photonics has been at the cutting edge of photonics technology for 60 years. In that
|
Original
|
KOTH0001E15
Light Detector laser
short distance measurement ir infrared diode
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TC7MTX02FK TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC7MTX02FK Digital temperature compensation IC Due to the demand for compactness and lower power dissipation, circuits for portable devices are being manufactured as individual chips. In particular, during the manufacture of
|
Original
|
TC7MTX02FK
|
PDF
|
NLT-4
Abstract: Voltage Output Temperature Sensor TC7MTX02FK
Text: TC7MTX02FK TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC7MTX02FK Digital temperature compensation IC Due to the demand for compactness and lower power dissipation, circuits for portable devices are being manufactured as individual chips. In particular, during the manufacture of
|
Original
|
TC7MTX02FK
NLT-4
Voltage Output Temperature Sensor
TC7MTX02FK
|
PDF
|
27c eeprom
Abstract: No abstract text available
Text: TC7MTX02FK TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC7MTX02FK Digital temperature compensation IC Due to the demand for compactness and lower power dissipation, circuits for portable devices are being manufactured as individual chips. In particular, during the manufacture of
|
Original
|
TC7MTX02FK
27c eeprom
|
PDF
|
power supply DVD schematic diagram ic viper 22 A
Abstract: md1803dfx equivalent toshiba laptop schematic diagram toshiba notebook schematic diagram free L6585D STM32 LQFP-64 footprint md1803dfx VIPER22A EQUIVALENT md1803 STM32 PWM output soft DCM developer kit
Text: www.st.com/express Semiconductor Product Design & Innovations 2. STM32 MCU Family 4. ST7 GEM Firmware 16. L6566 2 M3 ST Multi-Mode Controller 17. L598x DC-DC Converters 18. PM8800 PoE-PD Controller 5. EMIF06-SD02F3 IPAD Memory Card Transceiver 6. ACST2 Series
|
Original
|
STM32
L6566
L598x
PM8800
EMIF06-SD02F3
L674x
GS-R12/24
PM6600
DSL01-008SC5
/-016SC5
power supply DVD schematic diagram ic viper 22 A
md1803dfx equivalent
toshiba laptop schematic diagram
toshiba notebook schematic diagram free
L6585D
STM32 LQFP-64 footprint
md1803dfx
VIPER22A EQUIVALENT
md1803
STM32 PWM output soft DCM developer kit
|
PDF
|
car speed control using bluetooth advantages and
Abstract: gps 5350 CIRCUIT SCHEMATIC CAR ECU "General Catalog" TV SOC 3D MEMS camera module SiP EMI
Text: 2010.01 ルネサス システムインパッケージ 総合カタログ System in Packages General Catalog www.renesas.com Creating Future you imagine ルネサスの先端技術が お客様の未来を広げていきます。
|
Original
|
RJJ01N0001-1300
car speed control using bluetooth advantages and
gps 5350
CIRCUIT SCHEMATIC CAR ECU
"General Catalog"
TV SOC 3D
MEMS camera module
SiP EMI
|
PDF
|
HP3582
Abstract: somai OP50FY OP50 analog devices OP- DICE CHARACTERISTICS N6263 RC5600
Text: ANALOGDEVICESfAX-ON-DEMANDHOTLINE - Page 2 ~ ANALOG W DEVICES High-Output -Current Operational Amplifier ~OP-50 > 51 I FEATURES . . . . . . . . . . ORDERING INFORMATIONt Open-Loop Gain. . 10,OOO,OOOV/V Mln Low InputOffset Voltage. . . . . . . . 25pV Max
|
Original
|
OP-50
126dB
126dBM/n
14-PIN
OP-50AY'
OP-50BYOP-50EY
OP-50FY
t50ations.
047/lF
200mV.
HP3582
somai
OP50FY
OP50
analog devices OP- DICE CHARACTERISTICS
N6263
RC5600
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Foundry Services for Integrated Circuits and MEMS Micrel Inc., is a leading global manufacturer of IC solutions for the worldwide high-performance linear and power solutions, LAN, and timing and communications markets. Micrel’s Custom Foundry Service is the alternative to traditional foundry services, allowing customers to
|
Original
|
M4007-052013
|
PDF
|
|
|
3D Effect Audio Processor IC
Abstract: passive surround sound circuits 3D surround sound IC 20 pin 3D audio ICs NJH2187 NJM2187 NJM2187L NJM2187M SDIP30 SDMP30
Text: NJM2187 PR E L IMI NARY] TruSurround wiihSRS C O * Passive Matrix TruSurround 3D AUDIO PROCESSOR • GENERAL DESCRIPTION The NJM2187 is PACKAGE OUTLINE a regenerates the full TruSur round™ decode Virtualizer Therefore, the surround encode no 3D audio
|
OCR Scan
|
NJM2187
NJM2187
3D Effect Audio Processor IC
passive surround sound circuits
3D surround sound IC
20 pin 3D audio ICs
NJH2187
NJM2187L
NJM2187M
SDIP30
SDMP30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HARR IS S E M I C O N D SECTOR 27E » • 4302271 0Q2QM?b Q * H A S Power T ra n sis to rs - MJE13009 File Number 15.92 T -3 3 - »3 High-Speed Silicon N-P-N
|
OCR Scan
|
MJE13009
JE13009
T-33-13
|
PDF
|
NJM2187
Abstract: NJM2187L NJM2187M SDIP30 SDMP30
Text: C irci T r u NJM2187 S if lT O u n d wiihSRS C 3 Passive Matrix TruSurround m NJM2187liPassive Matrix TruSurround*’ t z f n - b v y - v ? ', K è - t if e ^ - r U f r 2 7. e — rti® h ' J ^ X 0 i S l 3 d ; o T - 9 - 7 ^ ^ K f i § í f a - TruSurroundO*T-^-V;7 'l'+ fl- c t:o T 2 X tf—
|
OCR Scan
|
NJM2187
NJM2187liPassive
NJM2187IÃ
NJM2187L
NJM2187M
35/uVrms
SDIP30,
SDMP30
mmIDI-4-59
NJM2187M
SDIP30
SDMP30
|
PDF
|
dallas ds80c320 high speed micro guide
Abstract: DS1640
Text: 'w - l J J t f °0 _72 , TABLE OF CONTENTS Short-Form Catalog T im e k e e p in g .1 M em ory P rodu cts .
|
OCR Scan
|
|
PDF
|
BUT23
Abstract: pin diagram of ic 1496
Text: 3D E D • 7^2^37 QG3G3TQ 1 SCS-THOMSOW s 6 S THQMS0N BUT232F I t i « ! "T-SVI5 BUT232V NPN TRANSISTOR POWER MODULE . HIGH CURRENT POWER BIPOLAR MODULE ■ VERY LOW Rth JUNCTION CASE . SPECIFIED ACCIDENTAL OVERLOAD AREAS « ISOLATED CASE 2500V RMS
|
OCR Scan
|
BUT232F
BUT232V
BUT232V
BUT232F
SC04840
O-240)
PC-029«
BUT23
pin diagram of ic 1496
|
PDF
|
NJM2187
Abstract: NJM2187L NJM2187M SDIP30 SDMP30
Text: NJM2187 T n iS u ir o u n d wim s r s C 1 Passive Matrix TruSurround 3 D — ^ P Hz '>» " T •4* NJM 2187liPass i ve M a trix T ruS urro un d’ * J - J a - b y V - T ’t * 3D ^ 7 ^ ^ NJII2187li&iI+*-;7 ' t 7 > K x v a — 1s^ LT/RT)^bit^. K it —
|
OCR Scan
|
NJM2187
NJM2187IÃ
3D-STERE01Â
NJM2187L
-90dBu
SDIP30,
SDMP30
NJM2187M
NJK2187lcÃ
NJM2187
NJM2187L
NJM2187M
SDIP30
|
PDF
|
3DGM
Abstract: No abstract text available
Text: ^ j^ 8 1 G E SOLI D S T A T E ~ ° 1 DE | 3 0 7 5 0 3 1 D O l^Sl T ~ 3 3 ' “ f 3 MJE13005 NPN POWER TRANSISTORS 400 V O L T S 4 AMP, 75 W A T T S Designed,for switching regulator, D C -D C converter, A C -D C inverter, high voltage, high speed switching applications.
|
OCR Scan
|
MJE13005
3DGM
|
PDF
|
Motorola ic
Abstract: 2N6543 300 volt 5 ampere transistor a 31
Text: MOTORCL A SC XST RS/ R F 12E D I b3b?2SM 00ä4bfc.a 7 | MOTOROLA SEMICONDUCTOR 2N6543 TECHNICAL DATA D e s ig n e r s D a ta . S h e e t 5 AMPERE NPN SILICON POWER TRANSISTOR 400 VOLTS 100 WATTS SW ITCHM ODE S E R IE S NPN SIL IC O N POWER T R A N SIST O R S
|
OCR Scan
|
2N6543
Motorola ic
2N6543
300 volt 5 ampere transistor a 31
|
PDF
|
13003T
Abstract: SI 13003 SH 13003 B834 TR 13003 A 13003ts 13003 TO 126 transistors 13003 SGS13003 g 13003
Text: 7 ^ 5 3 7 005^153 SGS-THOMSON IILIOT «! S G S-TH0MS0N 3 • SGS13002/13003 SGS13002T/13003T 3D E » HIGH VOLTAGE SWITCHING APPLICATIONS DESC RIPTIO N The SGS13002, SGS13003 SOT-82 plastic package and the SGS13002T, SGS13003T (TO220 plastic package) are silicon multiepitaxial-mesa
|
OCR Scan
|
SGS13002/13003
SGS13002T/13003T
SGS13002,
SGS13003
OT-82
SGS13002T,
SGS13003T
O-220
MJE13002
O-126,
13003T
SI 13003
SH 13003
B834
TR 13003 A
13003ts
13003 TO 126
transistors 13003
SGS13003
g 13003
|
PDF
|
Untitled
Abstract: No abstract text available
Text: & 93LCS66 M icro ch ip 4K CMOS Serial Electrically Erasable PROM FEATURES DESCRIPTION • Single supply with programming operation down to 2.5 V • Low power C M O S technology — 1 mA active current typical — 5 nA standby current typical at 3.0 V • Organized as 256 x 16 bits
|
OCR Scan
|
14-pin
93LCS66
93LCS66
14-Lead
93LCS66X
93LCS66T
93LCS66XT
DS20064B-page
|
PDF
|
