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    Abstract: No abstract text available
    Text: SLE D • 3Q30t.0S QQ 01 0 5E 470 H V C T V TB 8443, 8444 [vTB Process Photodiodes E G & G VACTEC T-41-51 PACKAGE DIMENSIONS inch mm CASE 21 PRODUCT DESCRIPTION P la n a r s ilico n photodiode in a recessed ceramic package. Chip is coated with a protective layer of epoxy.


    OCR Scan     		PDF 3Q30t T-41-51 x1012 VTB8444 VTB8443 x1013