Untitled
Abstract: No abstract text available
Text: SIEMENS BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 Q-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.\ ¿b at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RFINoCircuit Diagram EHA07312 Type Marking Ordering Code BGA 312 BMs
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EHA07312
Q62702-G0042
OT-143
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mmic-amplifier
Abstract: VPS05178 337 BGA
Text: BGA 312 Silicon Bipolar MMIC-Amplifier 3 Cascadable 50 -gain block 11 dB typical gain at 1.0 GHz 4 9 dBm typical P -1dB at 1.0 GHz 3 dB-bandwidth: DC to 2.0 GHz 2 1 RF IN RF OUT/Bias 1 VPS05178 3 Circuit Diagram 2, 4 GND EHA07312 Type Marking BGA 312
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VPS05178
EHA07312
OT-143
Oct-26-1999
mmic-amplifier
VPS05178
337 BGA
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PDF
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BU-64843X
Abstract: BU-64843H MN-6186X-002 MILSTD-1773 BU-64843T Mini-ACE Users Guide J-11-J1 MIL-STD-1773 MN-6186X-001 BU-64843
Text: Make sure the next Card you purchase has. BU-64843X/64863X TOTAL-ACE COMPLETE MIL-STD-1553 SOLUTION DATA SHEET FEATURES • World's First, Fully Integrated, MIL-STD-1553 Terminal & Transformer Solution • Small Package 312 Ball BGA 1.1 in x 0.6 in or 1.1 in x 0.7 in
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BU-64843X/64863X
MIL-STD-1553
BU-64843T
BU-64843X
BU-64843H
MN-6186X-002
MILSTD-1773
Mini-ACE Users Guide
J-11-J1
MIL-STD-1773
MN-6186X-001
BU-64843
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PDF
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BU-64843T8-E02
Abstract: MN-6186X-001 DDC TOTAL-ACE BU-64843T BU64843T8 MIL-STD-1773 DS-BU-648X3X-D BU-64843T8-600 MN-6186X-002 MILSTD-1773
Text: Make sure the next Card you purchase has. BU-64843X TOTAL-ACE COMPLETE MIL-STD-1553 SOLUTION DATA SHEET FEATURES • World's First, Fully Integrated, MIL- STD-1553 Terminal & Transformer Solution • Small Package 312 Ball BGA 1.1 in x 0.6 in • Fully Compatible with Enhanced Mini-
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BU-64843X
MIL-STD-1553
STD-1553
AS9100
A5976
DS-BU-648X3X-D
BU-64843T
BU-64843T8-E02
MN-6186X-001
DDC TOTAL-ACE
BU64843T8
MIL-STD-1773
BU-64843T8-600
MN-6186X-002
MILSTD-1773
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PDF
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657-10ABP
Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE
Text: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)
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XX1024
XX1025
XX1371
XX1703
XX2016
XX5045
XX1024
XX1371
XX2016
152-1B
657-10ABP
667-10ABPP
TO220 HEATSINK
637-15ABPE
651b
deltabond 152
657-25ABPNE
657-15ABPE
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PDF
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PT80
Abstract: OG516
Text: ispLSI 8840V 3.3V In-System Programmable SuperBIG High Density PLD Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 3.3V Power Supply — 45,000 PLD Gates/840 Macrocells — 192-312 I/O Pins Supporting 3.3V/2.5V I/O
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Gates/840
20-Macrocell
272-Ball
492-Ball
0212/8840V
840V-125LB272
840V-125LB492
840V-90LB272
PT80
OG516
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PDF
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s11 stopping compound
Abstract: as15 4804B
Text: LT4420 LT4420 DEVICES INCORPORATED DEVICES INCORPORATED FEATURES ❑ ❑ ❑ ❑ 155 MHz Max Data Rate 312 MHz Max Core Clock Rate 16-bit Data and Coefficients Paths 64-Tap FIR Filter, Cascadable for More Filter Taps Dual 32-Tap Transversal FIR Filter DESCRIPTION
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LT4420
32-Tap
LT4420
16bit
32-Bit
CFA11
s11 stopping compound
as15
4804B
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PDF
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BFM 17
Abstract: AC30 AG30 PT80
Text: ispLSI 8840 In-System Programmable SuperBIG High Density PLD Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 5V Power Supply — 45,000 PLD Gates/840 Macrocells — Up to 312 I/O Pins Supporting 3.3V/5V I/O
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Gates/840
20-Macrocell
8840-110LB432
432-Ball
8840-90LB432
8840-60LB432
BFM 17
AC30
AG30
PT80
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PDF
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MMIC SOT 89 marking CODE
Abstract: Q62702-G0042 VPS05178 BMS 13-58 Type 1
Text: BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data 3 • Cascadable 50 Ω-gain block • 11 dB typical gain at 1.0 GHz 4 • 9 dBm typical P -1dB at 1.0 GHz • 3 dB-bandwidth: DC to 2.0 GHz 2 1 RF OUT/Bias 1 RF IN VPS05178 3 Circuit Diagram 2, 4 GND
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Original
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VPS05178
EHA07312
Q62702-G0042
OT-143
Sep-04-1998
MMIC SOT 89 marking CODE
Q62702-G0042
VPS05178
BMS 13-58 Type 1
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PDF
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PT80
Abstract: No abstract text available
Text: ispLSI 8840V Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 3.3V Power Supply — 45,000 PLD Gates/840 Macrocells — 192-312 I/O Pins Supporting 3.3V/2.5V I/O — 1152 Registers — High-Speed Global and Big Fast Megablock BFM
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Original
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Gates/840
20-Macrocell
492-Ball
0212/8840V
840V-125LB272
272-Ball
840V-125LB492
840V-90LB272
PT80
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PDF
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AC30
Abstract: AG30 PT80 G-218
Text: ispLSI 8840 Features Functional Block Diagram • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 5V Power Supply — 45,000 PLD Gates/840 Macrocells — Up to 312 I/O Pins Supporting 3.3V/5V I/O — 1152 Registers — High-Speed Global and Big Fast Megablock BFM
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Original
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Gates/840
20-Macrocell
8840-110LB432
432-Ball
8840-90LB432
8840-60LB432
AC30
AG30
PT80
G-218
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PDF
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Untitled
Abstract: No abstract text available
Text: ISPLSI 8840 In-System Programmable SuperBIG High Density PLD • SuperBIG HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC 5V Power Supply 45,000 PLD Gates/840 Macrocells Up to 312 I/O Pins Supporting 3.3V/5V I/O 1152 Registers High-Speed Global and Big Fast Megablock BFM Interconnect
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Gates/840
20-Macrocell
ispLSI8000
IspLSI8840
38-to38
IspLSI8840
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PDF
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492-Ball
Abstract: e2cmos technology
Text: Introduction to ispLSI 8000 and 8000V Families ❑ Deterministic Performance ❑ Up to 1440 Total Registers – the Industry’s Largest CPLD! ❑ High Density 32,000 - 60,000 PLD Gates ❑ 3.3V I/O and 2.5V Outputs ❑ State-of-the-Art BGA Packaging
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Inputs/20
1080V
272-Ball
492-Ball
432-Ball
e2cmos technology
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PDF
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tba 480
Abstract: e2cmos technology 492-Ball
Text: Introduction to ispLSI 8000 and 8000V Families ❑ Deterministic Performance ❑ Up to 1440 Total Registers – the Industry’s Largest CPLD! ❑ High Density 32,000 - 60,000 PLD Gates ❑ 3.3V I/O and 2.5V Outputs ❑ State-of-the-Art BGA Packaging
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Inputs/20
1080V
272-Ball
492-Ball
432-Ball
tba 480
e2cmos technology
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PDF
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BGA 256 PACKAGE power dissipation
Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced
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00-mm
27-mm
XC9500
BGA 256 PACKAGE power dissipation
BGA 64 PACKAGE thermal resistance
xilinx CS144 thermal resistance
FG676
BG560
BGA and CSP
BGA-1156
fine BGA thermal profile
cte table flip chip substrate
BG432
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PDF
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MN-6186X-001
Abstract: BU-69092 BU-64843T BU648 MN-69092SX-002 BU-648 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
Text: Total-ACE Complete MIL-STD-1553 Solution Product Brief Model: BU-6X8X3T/U/H/i8 Save board space and simplify your 1553 design and layout with the world's first fully integrated MIL-STD-1553 terminal, complete with 1553 protocol, memory, transceivers, and isolation transformers—all in one small plastic BGA package
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MIL-STD-1553
MIL-STD-1760
AS9100
A5976
PB-BU-64843T-7
MN-6186X-001
BU-69092
BU-64843T
BU648
MN-69092SX-002
BU-648
BU-65863
DS-BU-64843T
STANAG 3838
MIL-STD-1553 ACE manual
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PDF
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ispMACH M4A3
Abstract: ISPGDX160A ispGAL22V10
Text: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm
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208-Ball
256-Ball
100-Ball
49-Ball
144-Ball
100-Pin
128-Pin
48-Pin
44-Pin
144-Pin
ispMACH M4A3
ISPGDX160A
ispGAL22V10
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PDF
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Untitled
Abstract: No abstract text available
Text: SIEMENS BGA312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 i2-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.-idB at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RF IN o- Circuit Diagram EHA07312 Type Marking Ordering Code
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OCR Scan
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BGA312
Q62702-G0042
T-143
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PDF
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NF 841
Abstract: BGA312 Q62702-G0042 IS21K 2400 siemens
Text: SIE M E N S BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data Cascadable 50 i2-Gain Block 11 dB typical Gain at 1.0 GHz 9 dBm typical at 1.0 GHz 3 dB-Bandwidth: DC to 2.0 GHz Plastic Package T ype M arking BGA312 BMs O rde rin g c o d e 8-mm taped Q62702-G0042
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OCR Scan
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BGA312
BGA312
Q62702-G0042
OT143
NF 841
IS21K
2400 siemens
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PDF
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smd transistor 312
Abstract: rf amplifier siemens 10 ghz SIEMENS MICROWAVE RADIO 8 GHz BGA310 BGA312 BGA318 Siemens MMIC Polytechnic diagram radar circuit SMX-1
Text: APPLICATIONS MMICs Gerhard Lohninger ● Knut Brenndörfer Jakob Huber ● Thomas Pollakowski Monolithic broadband amplifiers go mobile In wireless communications, there is a distinct trend toward more compact and lighter terminals. This means that the components used
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DSP56300
Abstract: gui56300 DSP56000 DSP56600 DSP563XXEVME
Text: Freescale Semiconductor, Inc. DSP56300 Assembly Code Development Using the Freescale Toolsets by Ralph Lansford Freescale Semiconductor, Inc., 2004. All rights reserved. For More Information On This Product, Go to: www.freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently
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DSP56300
DSP56301ADM
gui56300
DSP56000
DSP56600
DSP563XXEVME
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PDF
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Untitled
Abstract: No abstract text available
Text: SA50-0001 M/A-COM Preliminary Specifications BGA Digital Attenuator Amplifier 1500 - 2000 MHz Features • Ball Grid Array Outline • Surface Mount Package • Integrated Attenuator, Amplifier & TTL Driver • + 3 0 dBm Output Power • Attenuation 0.5 dB Steps to 31.5 dB
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OCR Scan
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SA50-0001
SA50-0001
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PDF
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Amkor SBGA
Abstract: JEDEC Matrix Tray outlines MO-192 copper bond wire amkor CO-029 jedec bga tray MO192 192 BGA PACKAGE thermal resistance
Text: LAMINATE data sheet SuperBGA Features: SuperBGA® SBGA Packages: The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated,
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MACH4A
Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size
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208-Ball
256-Ball
100-Ball
49-Ball
144-Ball
100-Pin
128-Pin
48-Pin
44-Pin
144-Pin
MACH4A
JTAG
jtag mhz
jtag 14
PQFP-144
ispLSI 2128-A
M4A5-64
M5A3-384
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