30A04000 Search Results

Contextual Info: □PM DPS512S8A3 Dense-Pac Microsystems, Inc. O 5 1 2 K X 8 B U F F E R E D /D E C O D E D C M O S S R A M M O D U L E PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" m odule is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip

Contextual Info: □PM DPS512S8A3 Dense-Pac Microsystems, Inc. O 5 1 2 K X 8 B U FFER ED /D ECO D ED C M O S SRAM M O D U LE PRELIMINARY D ESCR IPTIO N : The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: □; pm DPS512S8A3 D ense-Pac Microsystems. Inc. 512K X 8 BUFFERED/DECODED C M O S SRAM M O D U LE PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: OPM / V Dense-Pac Microsystems, Inc^ DPS512S8A3 512K X 8 BUFFERED/DECODED CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC along with memory interface logic and capacitors mounted