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    304 MQFP Search Results

    304 MQFP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    QFP40

    Abstract: P304GL-50-NMU JEDEC TRAY mQFP
    Text: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of


    Original     		LA-A41A SC-601-C* P304GL-50-NMU, QFP40 P304GL-50-NMU JEDEC TRAY mQFP PDF

    QFP JEDEC tray

    Abstract: JEDEC TRAY QFP
    Text: UNIT : mm HEAT PROOF 7 PPE 29.22 44.5 MQFP 40x40 3.7mm 135.9 77.46 A A' 50.56 31.1 44.5 252.8 315 322.6 SECTION A – A' 3.32 6.35 7.62 44.5 39.2 Applied Package Quantity pcs 304-pin Plastic QFP (Fine Pitch)(3.7mm thick) MAX. 12 Tray Material Heat Proof Temp.


    Original     		304-pin QFP JEDEC tray JEDEC TRAY QFP PDF

    MO-143

    Abstract: No abstract text available
    Text: MECHANICAL DATA MQFP028 – OCTOBER 1994 PDN S-PQFP-G304 PLASTIC QUAD FLATPACK (DIE–DOWN) 228 153 229 152 0,27 0,17 0,08 M 0,50 0,13 NOM 304 77 1 76 37,50 TYP 40,20 SQ 39,80 42,80 SQ 42,40 Gage Plane 0,25 0,25 MIN 4,00 3,60 0,75 0,50 0°– 7° Seating Plane


    Original     		MQFP028 S-PQFP-G304) MO-143 MO-143 PDF

    XC5200

    Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		XC5200 16-Bit 24-Bit 16-to-1 XC5210-5 XC5210-3 XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100 PDF

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		XC8100 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L PDF

    XC2064

    Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
    Text: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP


    Original     		XC2064 XC2018 XC2064L XC2018L XC4002A XC4003A XC4004A XC4005A XC4003H XC4005H XC2064 XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204 PDF

    304 MQFP

    Abstract: MQ240 XC3030A
    Text: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PDF

    XC2064

    Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
    Text: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		XC2064 XC2018 XC2064L XC4003 XC4005 XC4006 XC4008 XC4010 XC4010D XC4013 XC2064 XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090 PDF

    XC3042A PQ100

    Abstract: WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L
    Text: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PLAST20 PP132 PG132 TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 XC3042A PQ100 WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L PDF

    XC3030A

    Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PQ100 TQ100 VQ100 CB100 PG120 PP132 PG132 TQ144 PG144 PG156 XC3030A XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L PDF

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L PDF

    MS-029

    Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
    Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through


    Original     		PDF

    MO-112

    Abstract: MS-022 MS-029 DS250G JEDEC standard 033
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,


    Original     		PDF

    FPQ 208 0.5 10

    Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
    Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch


    Original     		AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 PDF

    PC5004

    Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
    Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz


    OCR Scan     		55-micron PC5004 VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding PDF

    TQFP Shipping Trays

    Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
    Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will


    Original     		PB1083 1-888-ISP-PLDS TQFP Shipping Trays MQFP Shipping Trays PB1083 Lattice PLSI PDF

    TMS320C40

    Abstract: WB225 MiroTech Microsystems Spectrum Microsystems PG499 fpga radAR XILINX texas instruments qfp pga 132 packaging XC4013L
    Text: Our congratulations to the develop8 ment team at MiroTech Microsystems Inc. Montreal, Canada . MiroTech Microsystems has released a commercial product that uses reconfigurable computing to advance the state-of-the-art for DSP acceleration. At the most recent


    Original     		TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 TMS320C40 WB225 MiroTech Microsystems Spectrum Microsystems PG499 fpga radAR XILINX texas instruments qfp pga 132 packaging XC4013L PDF

    PD-1503

    Abstract: pd1503 PD-2078 PD-2028 pd 2028 PD-2026 PD2028 pd2029 PD-2029 jedec MS-026 ABA
    Text: Pericom offers a wide range of advanced packaging solutions to fit any application including SOTiny , DisplayPort™, ReDriver™, HDMI™, others. Additional information can be obtained from individual data sheets, or by contacting your Pericom representative.


    Original     		MO-267 PD-2085 PD-2073 MO-236/MO-252 PD-2074 MO-220 PD-2076 PD-1503 pd1503 PD-2078 PD-2028 pd 2028 PD-2026 PD2028 pd2029 PD-2029 jedec MS-026 ABA PDF

    Arm processor vlsi technology

    Abstract: PC302 QFP 128 bonding
    Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec


    OCR Scan     		45-micron Arm processor vlsi technology PC302 QFP 128 bonding PDF

    BMA16X16

    Abstract: No abstract text available
    Text: SI GE C P L E S S E Y MARCH 1997 S E M I C O N D U C T O R S CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. Improvements in design combined with


    OCR Scan     		CLA80000 CLA80k PGA100-ACA-3434 PGA120-ACA-3434 PGA144-ACA-4040 PGA180-ACA-4040 PGA181 -ACA-4040 PGA257-ACA-5151 BMA16X16 PDF

    CQFP44

    Abstract: hp 4552 CLA80000 Series MQFP52 clt82xxx O2-A2 CQFP100 gh 312 PS-3306 Series cqfp120
    Text: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


    Original     		CLA80000 DS3820 CLA80k 210ps CQFP44 hp 4552 CLA80000 Series MQFP52 clt82xxx O2-A2 CQFP100 gh 312 PS-3306 Series cqfp120 PDF

    hp 4552

    Abstract: O2-A2 CQFP100 PSOP24-MP0816 CLT84 gh 312 clt82xxx CQFP44 diode gp 421 PS-3306 Series
    Text: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


    Original     		CLA80000 DS3820 CLA80k 210ps hp 4552 O2-A2 CQFP100 PSOP24-MP0816 CLT84 gh 312 clt82xxx CQFP44 diode gp 421 PS-3306 Series PDF

    Power Supply PS-613 uk

    Abstract: CQFP44 GP141 DS3820 mux2*1 hp 4552 PSOP28-MP0818 cla85xxx PS-3306 Series Mitel Semiconductor process flow
    Text: CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS3820-2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Mitel Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


    Original     		CLA80000 DS3820-2 CLA80k 210ps Power Supply PS-613 uk CQFP44 GP141 DS3820 mux2*1 hp 4552 PSOP28-MP0818 cla85xxx PS-3306 Series Mitel Semiconductor process flow PDF

    EPROM retention bake

    Abstract: 24LC04A 24c04 National Semiconductor MICROCHIP TECHNOLOGY 920 1075
    Text: M Product Reliability OVERVIEW Microchip Technology Inc.’s products provide competitive leadership in quality and reliability, with demonstrated performance of less than 100 FITs Failures in Time operating life for most products. The designed-in reliability of Microchip’s products are supported by


    Original     		27C256 27C512A DS11008K-page EPROM retention bake 24LC04A 24c04 National Semiconductor MICROCHIP TECHNOLOGY 920 1075 PDF