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L77HDC62SD1CH3RC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
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L177HDC62SD1CH3F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
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L177HDC62SD1CO4R
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 62 Socket, 0.38um (15u\\) Gold, 4-40 Rear Threaded Insert, Without Boardlock |
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L77HDC62SD1CH4R
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
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L77HDC62SD1CH3FC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
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