2M X 32 CHIP BLOCK DIAGRAM Search Results

as8flc2m32b

Abstract: DQ0-DQ14
Contextual Info: FLASH AS8FLC2M32 FIGURE 1: PIN ASSIGNMENT Top View Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array • MIL-PRF-38534, Class H FEATURES • • • • • • • • • • • • • • • 64Mb device, total density, organized as 2M x 32

JED-STD-020

Abstract: 125OC we3266
Contextual Info: Issue 5.1 April 2001 Description The PUMA 68FV64006X is a 2M x 32 Flash Module housed in a 68 ‘J’ Leaded Surface mount package with access times of 90, 120 and 150ns. A 70ns variant is under development Block Diagram A0~A20 /OE /WE /RESET The Output width is user configurable as 8, 16 or 32

2A193

Abstract: 125OC JED-STD-020 D2250
Contextual Info: Issue 5.1 April 2001 Description The PUMA 68F64006X is a 2M x 32 Flash Module housed in a 68 ‘J’ Leaded Surface mount package with access times of 90, 120 and 150ns. A 70ns variant is under development Block Diagram A0~A20 /OE /WE /RESET The Output width is user configurable as 8, 16 or 32

I-012

Contextual Info: Issue 1.1 November 2002 Description The PUMA 84 range of devices provide a high density, surface mount memory solution with density up to twice that of standard monolithic devices. Block Diagram A0 ~A20 /OE /CS1 /WE1 2M x 8 /CS2 /WE2 2M x 8 The device is available to commercial and industrial

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

toshiba toggle mode nand

Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
Contextual Info: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit

O28 Package

Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

WF2M32-XXX5

Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES „ „ Access Time of 90, 120, 150ns „ Organized as 2Mx32 Packaging: „ • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  5 Volt Read and Write  Packaging:  Low Power CMOS  Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP

4MX32

Abstract: WF4M32-XXX5 01HXX IO30
Contextual Info: WF4M32-XXX5 White Electronic Designs 4MX32 5V FLASH MODULE, SMD 5962-97612 pending PRELIMINARY* FEATURES n Organized as 4Mx32 n Access Times of 100, 120, 150ns n Packaging: n User configurable as 8Mx16 or 16Mx8 in HIP and G4T packages. n Commercial, Industrial, and Military Temperature Ranges

Contextual Info: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  Commercial, Industrial, and Military Temperature Ranges  Packaging:  5 Volt Read and Write. 5V ± 10% Supply.  Low Power CMOS • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP

Contextual Info: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  5 Volt Read and Write  Packaging:  Low Power CMOS  Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP

4MX32

Abstract: WF4M32-XXX5
Contextual Info: WF4M32-XXX5 HI-RELIABILITY PRODUCT 4MX32 5V FLASH MODULE, SMD 5962-97612 pending PRELIMINARY* FEATURES • Access Times of 100, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP (Package 402). ■ User configurable as 8Mx16 or 16Mx8 in HIP and G4T

Contextual Info: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Preliminary Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram

Contextual Info: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Preliminary Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram

Contextual Info: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram

Contextual Info: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

footprint cqfp 240

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES „ Commercial, Industrial, and Military „ Access Time of 90, 120, 150ns Temperature Ranges „ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

WF4M32-XXX5

Contextual Info: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES „ „ „ „ „ Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package

WF4M32-XXX5

Contextual Info: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.

PCMCIA CARD, Static Memory, write protect switch

Abstract: 32-PIN LH28F020SU-L LH28F020SUN-L12
Contextual Info: LH28F020SU-L FEATURES • 256K x 8 Bit Configuration • 5 V Write/Erase 3.3 V VCC • Access Time – For 3.3 V Read: 150 ns • Minimum 2.7 V Read Capability – 180 ns Maximum Access Time (VCC = 2.7 V) • 16 Independently Lockable Blocks (16K Blocks)

32-PIN

Abstract: LH28F008SA LH28F020SU-N TSOP032-P-0820 28F020SUN80-20
Contextual Info: LH28F020SU-N FEATURES • 256K x 8 Bit Configuration • 5 V Write/Erase Operation 5 V VPP – No Requirement for DC/DC Converter to Write Erase • • • • 2M (256K × 8) Flash Memory 32-PIN TSOP TOP VIEW A11 1 32 A9 2 31 A10 A8 3 30 CE OE A13 4 29