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Catalog Datasheet	MFG & Type	PDF	Document Tags
CMOS Abstract: No abstract text available Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications	Original	PDF
ED-712IRV Abstract: No abstract text available Text: ED-712IRV AlGaAs/AlGaAs Highspeed IrED Chips 880 nm Features : Typical Applications : • AlGaAs/AlGaAs wafer • Very high power • High speed • High performance • Superior thermal stability • IrDA • Encoder • Data Communication Outline Dimensions : Unit: um	Original	PDF	ED-712IRV 120um 270um 180um 285um x285um ED-712IRV
ED-712IRP Abstract: No abstract text available Text: ED-712IRP AlGaAs/AlGaAs Highspeed IrED Chips 865 nm Features : Typical Applications : • AlGaAs/AlGaAs wafer • Very high power • High speed • High performance • Superior thermal stability • IrDA • Encoder • Data Communication Outline Dimensions : Unit: um	Original	PDF	ED-712IRP 120um 270um 180um 285um x285um ED-712IRP
TF208TH Abstract: TF252TH ultra low idss TF222B TF246 FET electret microphone J-FET ultra low Ciss jfet condenser microphone 3MM Text: T OP I C S News Release Product Topics Released on Jun. 4, 2008 ECM Junction FET 「TF246」 The industry’s smallest package realizing the miniaturization of ∗1 ∗2 portable equipments. TOP share 53% Further increase to 150MPcs/Month! ∗3 ∗1：Electret Condenser Microphone ∗ 2 : as of Jun. 4, 2008 ∗ 3 : based on Sanyo’s 2007 research	Original	PDF	TF246 150MPcs/Month! 150MPcs/M -108dB TF246" TF208TH TF252TH ultra low idss TF222B TF246 FET electret microphone J-FET ultra low Ciss jfet condenser microphone 3MM
GaAs wafer Abstract: No abstract text available Text: ED-012IRC GaAs/GaAs IrED Chips 940 nm Features : Typical Applications : • GaAs/GaAs wafer • Good spectral matched to si detector • Peripherals • Photocoupler • Photointerrupter Outline Dimensions : Unit: um 285 270 p-Electrode p-GaAs epi layer	Original	PDF	ED-012IRC 110um 270um 280um 285um 285um GaAs wafer
NMOS depletion pspice model Abstract: NMOS MODEL PARAMETERS SPICE "X-Fab" Core cell library PSPICE MODEL R2R bsim3 ADS bsim3 model SPECTRE MODEL QS 100 NPN Transistor RP20 analog devices transistor tutorials Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications	Original	PDF
AT1793S Abstract: k2313 LY0504 SOP14 PM646 Text: AT1793 Preliminary Product Information 2-Channel Step-Down PWM Controller Features • 4.75V to 26V supply voltage operating. • Efficiency up to 85%. • Typical frequency operation to 1MHz. • Voltage-mode PWM step-down regulation. • 1V±2% internal reference.	Original	PDF	AT1793 QFN-16 OP-14 AT1793 350mm3 AT1793S k2313 LY0504 SOP14 PM646
Untitled Abstract: No abstract text available Text: CM6100 2 Channel Very Low Capacitance ESD Protection Device in CSP Product Description California Micro Devices' CM6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant.	Original	PDF	CM6100 CM6100 178mm
sac105 Abstract: CM6000 CM6100 ww15 Text: 0.4mm Pitch Daisy Chain CM6100 Product Description The 6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant. Electrical Schematic / Pin Description WHERE X =	Original	PDF	CM6100 CM6100 sac105 CM6000 ww15