BMS-2508H
Abstract: M200
Text: BMS-2508H DB LECTRQ Inc. Type Rated Im pedance O Rated(Max.) Power{W) Resonant Frequency(Hz) Rated Freq.Range(Hz) Sound Pressure Level(dB) Magnet(g) Operating TemperaturefC) BMS-2508H 8±15% 0.1 (0.2) 1000±20% M 200 75 ±3 1.7 -40-+85 O E M p in o r e x te n te d w ire w ith c o n n e c to r
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OCR Scan
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BMS-2508H
BMS-2508H
M200
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K8P2815UQB
Abstract: No abstract text available
Text: K8P2815UQB FLASH MEMORY 128Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P2815UQB
128Mb
20000h-027FFFh
018000h-01FFFFh
010000h-017FFFh
008000h-00FFFFh
007000h-007FFFh
006000h-006FFFh
005000h-005FFFh
004000h-004FFFh
K8P2815UQB
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samsung ba92
Abstract: BA137 k8p3215
Text: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P6415UQB
64-Ball
60Solder
samsung ba92
BA137
k8p3215
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F300H
Abstract: FC44H BIT137
Text: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
F300H
FC44H
BIT137
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PDF
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USB cable AWM 2725 rx tx pinout
Abstract: No abstract text available
Text: CP3BT26 CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces Literature Number: SNOSAE5C CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded
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CP3BT26
CP3BT26
USB cable AWM 2725 rx tx pinout
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F1A4
Abstract: TR-28 national timer switch tb 208
Text: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT26
CSP-9-111C2)
CSP-9-111S2)
CSP-9-111S2.
F1A4
TR-28
national timer switch tb 208
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PDF
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K8P3215UQB
Abstract: K8P2815 K8p3215 K8P3215U k8p2815u K8P32 48FBGA samsung nor flash Samsung MCP K8P6415
Text: K8P3215UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P3215UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P3215UQB
K8P2815
K8p3215
K8P3215U
k8p2815u
K8P32
samsung nor flash
Samsung MCP
K8P6415
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PDF
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K8P6415UQB
Abstract: K8P2815 BA141 K8P6415U K8p3215 K8P6415 K8P32 k8p2815u K8P3215U K8P64
Text: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P6415UQB
047MAX
64-Ball
60Solder
K8P6415UQB
K8P2815
BA141
K8P6415U
K8p3215
K8P6415
K8P32
k8p2815u
K8P3215U
K8P64
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PDF
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Untitled
Abstract: No abstract text available
Text: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
CP3UB26
LQFP-128
LQFP-144
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CP3BT23
Abstract: CP3BT23G18NEP CP3BT23G18NEPNOPB CR16C LMX5251 LMX5252 LQFP-144 315 receiver module
Text: MAY 2004 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
CP3BT23G18NEP
CP3BT23G18NEPNOPB
CR16C
LMX5251
LMX5252
LQFP-144
315 receiver module
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4 wire resistive touch screen
Abstract: deutsch dmc CP3UB26 CP3UB26G18NEP CP3UB26G18NEPNOPB CP3UB26G18NEPX CP3UB26G18NEPXNOPB CR16C LQFP-144
Text: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
12-bit
4 wire resistive touch screen
deutsch dmc
CP3UB26G18NEP
CP3UB26G18NEPNOPB
CP3UB26G18NEPX
CP3UB26G18NEPXNOPB
CR16C
LQFP-144
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EE CORE 70
Abstract: books national semiconductor
Text: CP3UB26 CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces Literature Number: SNOSAE7D CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
CP3UB26
EE CORE 70
books national semiconductor
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Untitled
Abstract: No abstract text available
Text: CP3UB26 www.ti.com SNOSAE7E – APRIL 2005 – REVISED JANUARY 2014 CP3UB26 Reprogrammable Connectivity Processor with USB Interface 1 GENERAL DESCRIPTION The CP3UB26 connectivity processor combines high performance with the massive integration needed for
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CP3UB26
CP3UB26
12-bit
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SLE 78
Abstract: USB cable AWM 2725 rx tx pinout CP3BT26 CP3BT26G18AWM CP3BT26G18AWMX CR16C DS202 LMX5251 LMX5252 LQFP-144
Text: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT26
LMX5251
CP3BT26
LQFP-128
LQFP-144
SLE 78
USB cable AWM 2725 rx tx pinout
CP3BT26G18AWM
CP3BT26G18AWMX
CR16C
DS202
LMX5252
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Untitled
Abstract: No abstract text available
Text: CP3BT23 www.ti.com SNOSCX3A – JULY 2013 – REVISED JANUARY 2014 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces Check for Samples: CP3BT23 1 Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for
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CP3BT23
CP3BT23
12-bit
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K8P6415
Abstract: K8P32 K8P3215u K8P6415UQB K8P64
Text: Target Information FLASH MEMORY K8P6415UQB 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
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K8P6415UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P6415
K8P32
K8P3215u
K8P6415UQB
K8P64
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PDF
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SLE 78
Abstract: CR16C LMX5251 national timer switch tb 179 CP3BT26 CP3BT26G18NEP CP3BT26G18NEPNOPB DS202 LMX5252 LQFP-144
Text: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT26
SLE 78
CR16C
LMX5251
national timer switch tb 179
CP3BT26G18NEP
CP3BT26G18NEPNOPB
DS202
LMX5252
LQFP-144
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ERTEC200
Abstract: ertec Sapling Master Clock IEC-93 Firmware ssd 2310h HX1188 uPD800261F1-523-HN2 Sapling Master Clock 2000 Series PL021
Text: Preliminary User’s Manual ERTEC 200 Enhanced Real-Time Ethernet Controller 32-Bit RISC CPU Core Hardware µPD800261F1-523-HN2 Document No. A17988EE1V1UM00 Date Published August 2007 NEC Electronics Corporation 2007 Printed in Germany NOTES FOR CMOS DEVICES
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32-Bit
PD800261F1-523-HN2
A17988EE1V1UM00
ERTEC200
ertec
Sapling Master Clock
IEC-93
Firmware ssd
2310h
HX1188
uPD800261F1-523-HN2
Sapling Master Clock 2000 Series
PL021
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ERTEC400
Abstract: A17812EE1V1UM00 264ch l PL021 nec PC 2500H ertec manual* cygnus sl 5000 ARM946E-S 2310h ahb pci bridge fujitsu
Text: Preliminary User’s Manual ERTEC 400 Enhanced Real-Time Ethernet Controller 32-Bit RISC CPU Core Hardware µPD800232F1-012-HN2 Document No. A17812EE1V1UM00 Date Published July 2007 NEC Electronics Corporation 2007 Printed in Germany NOTES FOR CMOS DEVICES
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32-Bit
PD800232F1-012-HN2
A17812EE1V1UM00
ERTEC400
A17812EE1V1UM00
264ch l
PL021
nec PC 2500H
ertec
manual* cygnus sl 5000
ARM946E-S
2310h
ahb pci bridge fujitsu
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K8P1615UQB
Abstract: K8P2815 K8P1615U K8P6415U K8P3215U 555H k8p2815u samsung nor flash Samsung MCP 256-w
Text: K8P1615UQB FLASH MEMORY 16Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P1615UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P1615UQB
K8P2815
K8P1615U
K8P6415U
K8P3215U
555H
k8p2815u
samsung nor flash
Samsung MCP
256-w
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Untitled
Abstract: No abstract text available
Text: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip
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CP3BT23
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AEH 5PIN
Abstract: atdr1 DS021 IR CP3UB26 CR16C LQFP-144 CVSD pcm EE CORE 70
Text: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM
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CP3UB26
CP3UB26
LQFP-128
LQFP-144
AEH 5PIN
atdr1
DS021 IR
CR16C
CVSD pcm
EE CORE 70
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PDF
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Untitled
Abstract: No abstract text available
Text: H ousing Wafer Terminal 2.5mm Terminal / Housing 5.75 1.35 0.80 0.20 1.25 1.66 0.40 2.90 1.05 1.60 2.60 2.10 1.74 0.80 SEC:A-A 1.50 Wire Range AWG#22-#30 Insulation O.D. 1.90mm max SEC:B-B Material Phosphor Bronze Part No.:2505-T-L Finish Tin Plated Specifications
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2505-T-L
UL94V-0
2508H-02B-L
2508H-03B-L
2508H-04B-L
2508H-05B-L
2508H-06B-L
2508H-07B-L
2508H-08B-L
2508H-09B-L
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MAX9060
Abstract: No abstract text available
Text: K8P3315UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P3315UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
MAX9060
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