22MR008 Search Results

Contextual Info: Recommended P.C.B Loyout Componend Side 12.SO 2.00 difl Ep (Lp n CD NOTE: A. 0 2 0 1 22MR008 S_Q 20Z X (2522A X - 08 G D T -T) 1 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /

Contextual Info: 14.50 ref. 13.10+0.25 12.50 + 0.10 \_ v_ \_ r R0.3 01 % o +1 l=D CM to cnzi CD NOTE: I'd A. 0201 22MR008 S_Q 1 4ZX 2522A X - 08 G D T -N 3=- :f+ T ro c\i 1 2.00 7.00 1 1.10 14.90 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/

Contextual Info: I R ecom m end ed P.C.B 10 I 11 La yo ut C o m p o nend Side CD NOTE: A. 0201 22MR008 S_Q 21 ZX (2522A X - 08 G D T -U) 1 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /

Contextual Info: 17.50 1?. 50+ 0.1 CDNOTE: A. 0201 22MR008 S_Q 1 6ZX 2522A X - 08 G D T - P 1 Recom m ended 14.50 REF (Com ponend 2.50 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /