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    208 BGA Search Results

    208 BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    208 BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-208-08-001429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 208-08-001 16 X 16 # Of Pins Mill-Max Part Number 208 599-10-208-08-001429 RoHS Compliant LOOSE PIN:


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-10-208-08-001429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 208-08-001 16 X 16 # Of Pins Mill-Max Part Number 208 599-10-208-08-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    LQFP 208

    Abstract: ZL3806 LQFP208 LBGA-100
    Text: Voice Echo Cancellation VOICE PROCESSING VOICE/DATA 8 4 64(128) 0.056 100 pin LQFP, 208 ball LBGA ZL50235 16(8) 64(128) 0.088 100 pin LQFP, 208 ball LBGA MT9300B 32(16) 64(128) 1 160 pin MQFP, 208 ball LBGA MT93L00 32(16) 64(128) 0.15 100 pin LQFP, 208 ball LBGA


    Original     		IEEE-1149 164/G165 MT9122 MT9123 ZL50233 ZL50234 ZL50235 MT9300B MT93L00 ZL50232 LQFP 208 ZL3806 LQFP208 LBGA-100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </


    OCR Scan     		1200XL PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-208-08-001428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 208-08-001


    Original     		C17200) 64-56A 64-22A/31A 65-17A PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 599-11-208-08-001428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 208-08-001 16 X 16


    Original     		C17200) 64-56A 64-22A/31A 65-17A PDF

    MAAM-008863

    Abstract: MAMU-009156 transistor MY52 200W MOSFET POWER AMP transistor MY51 GPS Antenna AT65 MA4ST350 MADR-007690-DR0002 a74 sot-89 SM4T mixer
    Text: Corporate Headquarters Richardson Electronics 40W267 Keslinger Road P.O. Box 393 LaFox, IL USA 60147-0393 Phone: 1 800 737-6937 630-208-3637 Fax: (630) 208-2550 Internet: www.rell.com Email: Canada Brampton, Ontario Torod, Norway 1 (800) 737-6937 Latin America


    Original     		40W267 MAAM-008863 MAMU-009156 transistor MY52 200W MOSFET POWER AMP transistor MY51 GPS Antenna AT65 MA4ST350 MADR-007690-DR0002 a74 sot-89 SM4T mixer PDF

    18CO

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch


    Original     		W3H64M64E-XSBX 18CO PDF

    MPC5634M

    Abstract: MPC5566 flexcan AMBA "microsecond bus" bosch Knock sensor mpc5554 ebi MPC5565 MPC5566 MPC5567 LQFP144
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566


    Original     		MPC551x MPC5533 MPC5534 MPC5553 MPC5554, MPC5565, MPC5566 MPC5567 MPC5634M MPC5634M MPC5566 flexcan AMBA "microsecond bus" bosch Knock sensor mpc5554 ebi MPC5565 MPC5566 LQFP144 PDF

    MPC5565

    Abstract: MPC5554 GPIO configuration mpc5554 ebi MPC500 MPC5500 MPC5533 MPC5534 MPC5553 MPC5554 MPC5566
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554,


    Original     		MPC551x MPC5533 MPC5534 MPC5553 MPC5554, MPC5565, MPC5566 MPC5567 MPC5565 MPC5565 MPC5554 GPIO configuration mpc5554 ebi MPC500 MPC5500 MPC5554 PDF

    CEE 32

    Abstract: W3H32M64E-XSBX
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature


    Original     		W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32 PDF

    84 FBGA

    Abstract: IPC17 FBGA-84
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 72 • 1.0mm pitch


    Original     		W3H64M72E-XSBX W3H64M72E-XSBXF W3H64M72E-XSBXF SN63Pb37 SAC305 84 FBGA IPC17 FBGA-84 PDF

    MPC5566 instruction set

    Abstract: MPC5510 MPC5554 IVOR14 MPC5554 instruction set MPC5500 MPC5533 MPC5534 MPC5553 MPC5553 instruction set
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566 and MPC5567 products in


    Original     		MPC551x MPC5533 MPC5534 MPC5553 MPC5554, MPC5565, MPC5566 MPC5567 AN3614 MPC5510 MPC5566 instruction set MPC5510 MPC5554 IVOR14 MPC5554 instruction set MPC5500 MPC5553 instruction set PDF

    mpc5554 emios

    Abstract: MPC5554 "pin compatible" mpc5554 ebi MPC5554 GPIO mpc5554 resonator MPC500 MPC5500 MPC5533 MPC5534 MPC5553
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566 and MPC5567 products in


    Original     		MPC551x MPC5533 MPC5534 MPC5553 MPC5554, MPC5565, MPC5566 MPC5567 MPC5554 mpc5554 emios MPC5554 "pin compatible" mpc5554 ebi MPC5554 GPIO mpc5554 resonator MPC500 MPC5500 PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M64EA-XSBX PDF

    W3H128M72

    Abstract: W3H128M72E-XSBX W3H128M72E
    Text: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		W3H128M72E-XSBX W3H128M72 W3H128M72E-XSBX W3H128M72E PDF

    84 FBGA

    Abstract: W3H64M72E-XSBX fbga84 ccd400
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ Organized as 64M x 72 • 1.0mm pitch „ Weight: W3H64M72E-XSBX - 2.5 grams typical


    Original     		W3H64M72E-XSBX W3H64M72E-XSBX 84 FBGA fbga84 ccd400 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB W3H64M72E-XSBXF SN63Pb37 SAC305 256MB" PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB with11, PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB PDF

    EP1K10

    Abstract: DATA44
    Text: EP1K10 Device Pin-Outs Version 1.4 Pin Name 1 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 256-Pin FineLine BGA 77 76 35 74 107 2 14 106 3 142 141 144 143 11 7 116 114 113 112 111 110 109 108 105 4 1 34 54, 56, 124, 126 108 107 52 105 155 2 19 154 3 206 204 208


    Original     		EP1K10 100-Pin 144-Pin 208-Pin 256-Pin DATA44 PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB PDF

    Untitled

    Abstract: No abstract text available
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		W3H64M72E-XSBX W3H64M72E-XSBXF 512MB 667Mbs 533Mbs 400Mbs PDF

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm


    Original     		W3H64M72E-XSBX 667Mbs PDF