2.7 PACKAGE DIAGRAMS Search Results

SMLN34

Abstract: SMLN3
Contextual Info: Tri-Color Side View 1104 <2.7 0.95 t=0.5mm> High Brightness Type SMLN34 Series under development Emitting Color PICOLEDTM -RGB Target Spec. Blue Part No. Green Material Red InGaN on SiC AlGalnP on GaAs Package Size(mm) SMLN34RGB1T 2710(1104) 2.7x0.95(t=0.5)

A144

Abstract: G145 B144 U162 145-Pin 2.7 Package Diagrams
Contextual Info: 2.7 Package Diagrams 144ĆPin Thin Quad Flat Pack A144 2-31 Package Diagrams 145ĆPin Plastic Grid Array Cavity Up B144 145ĆPin Grid Array (Cavity Up) G145 2-32 Package Diagrams 160ĆLead Plastic Quad Flatpack N160 2-33 Package Diagrams 160ĆLead Ceramic Quad Flatpack U162

MB84VD23381EF-90

Abstract: MBM29DL640E MBM29DL640
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET SMCP0.1E_w Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64M (x16) FLASH MEMORY & 16M (×16) SRAM Interface FCRAM MB84VD23381EF-90 • FEATURES • Power supply voltage of 2.7 to 3.0V for FCRAM • Power supply voltage of 2.7 to 3.3V for Flash

MBM29DL640E

Abstract: MB84VD23380EF-90 F0006
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET AE2E_w Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64M (x16) FLASH MEMORY & 16M (×16) SRAM Interface FCRAM MB84VD23380EF-90 • FEATURES • Power supply voltage of 2.7 to 3.0V for FCRAM • Power supply voltage of 2.7 to 3.3V for Flash

analogtodigital oy

Contextual Info: TLV1572 2.7 SERIAL ANALOG-TO-DIGITAL CONVERTER WITH AUTO-POWERDOWN SLAS171A-DECEMBER 1997- REVISED SEPTEMBER 1998 D PACKAGE TOP VIEW • Fast Throughput Rate: 1.25 MSPS • 8-Pin SOIC Package

transistor A144

Abstract: TQFP 144 PACKAGE A144 transistor data sheet A144 a144* transistor CERAMIC FLATPACK TQFP 32 PACKAGE B144 G145 U162
Contextual Info: 2.7 Package Diagrams 144-Pin Plastic Thin Quad Flat Pack TQFP A144 2-30 Package Diagrams 145-Pin Plastic Grid Array (Cavity Up) B144 145-Pin Grid Array (Cavity Up) G145 2-31 Package Diagrams 160-Lead Plastic Quad Flatpack N160 2-32 Package Diagrams 160-Lead Ceramic Quad Flatpack (Cavity Up) U162

Contextual Info: Transistor Outline Package Center Leadless Type TO–220NIS (Center Leadless Type) Package Outline Dimensions Outline Dimensions Unit: mm 2.7 ±0.2 10.0 ±0.3 5.6 max 1.1 0.75 ±0.15 15.0 ±0.3 Notes • The above diagrams may not be actual sizes. Diagrams may be enlarged,

f5lc20u

Abstract: F5LC20 SF5LC20U C137C A45A
Contextual Info: □ -□ 3 . V'CX-Y- Super Fast Recovery Diode Twin Diode OUTLINE DIMENSIONS SF5LC20U Unit • mm Package I FTO-220 10 4>3.2- 200V 5A Date code na%i_ Type No. M i_ Polarity 4.5±a: 2.7±a ±0- 0181 F5LC20U 2.7±a: •trr3 5 n s 1 o u”3 m

32 KB SRAM

Abstract: DS05-50208-1E SWITCH SA125
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50208-1E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M (x 16) FLASH MEMORY & 16 M (× 16) SRAM Interface FCRAM MB84LD23381EJ-10 • FEATURES • Power supply voltage of 2.3 to 2.7 V for FCRAM • Power supply voltage of 2.3 to 2.7 V for Flash

Contextual Info: Preliminary Information X9530 Temperature Compensated Laser Diode Controller DESCRIPTION • Compatible with Popular Fiber Optic Module Specifications such as Xenpak, SFF, SFP, and GBIC • Package —14 Pin TSSOP —15 Lead 2.7 x 3.5mm Chip-Scale Package

BGA-101P-M01

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50208-2E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M (x 16) FLASH MEMORY & 16 M (× 16) SRAM Interface FCRAM MB84LD23381EJ-10 • FEATURES • Power Supply Voltage of 2.3 V to 2.7 V for Flash • Power Supply Voltage of 2.3 V to 2.7 V for FCRAM

32 KB SRAM

Abstract: MBM29DL640E
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50209-2E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M ( x 16) FLASH MEMORY & 16 M ( × 16) SRAM Interface FCRAM MB84VD23381EJ-90 • FEATURES • Power supply voltage of 2.7 V to 3.1 V for FCRAM • Power supply voltage of 2.7 V to 3.3 V for Flash

MPS 0731

Abstract: I2 200-5 AN156 X9530 X9530B15I X9530V14I TAA 691
Contextual Info: Preliminary Information X9530 Temperature Compensated Laser Diode Controller DESCRIPTION • Compatible with Popular Fiber Optic Module Specifications such as Xenpak, SFF, SFP, and GBIC • Package —14 Pin TSSOP —15 Lead 2.7 x 3.5mm Chip-Scale Package

Contextual Info: Preliminary Information X9530 Temperature Compensated Laser Diode Controller DESCRIPTION • Compatible with Popular Fiber Optic Module Specifications such as Xenpak, SFF, SFP, and GBIC • Package —14 Pin TSSOP —15 Lead 2.7 x 3.5mm Chip-Scale Package

f5lc30

Abstract: S 437 Diode
Contextual Info: □ -□ 3 . V'CX-Y- Super Fast Recovery Diode Twin Diode OUTLINE DIMENSIONS SF5LC30 Unit • mm Package I FTO-220 4.5±a: 10±0-2 <¿3.2-01 2.7±0~ M 300V 5A Date code ^0181 Type No. F5LC30 M •trr3 0 n s Polarity 2.7±a 1.2-0.1 ° LO m m •SRSÎÜ

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50208-3E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M (x 16) FLASH MEMORY & 16 M (× 16) SRAM Interface FCRAM MB84LD23381EJ-10 • FEATURES • Power Supply Voltage of 2.3 V to 2.7 V for Flash • Power Supply Voltage of 2.3 V to 2.7 V for FCRAM

SGA29

Abstract: 32-KW Load Bank SA133 MBM29DL640E SA72 SA136
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50301-1E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M (x ×16) FLASH MEMORY & 16 M (× ×16) Mobile FCRAMTM MB84VD23381EF-85 • FEATURES • Power Supply Voltage of 2.7 V to 3.0 V for FCRAM • Power Supply Voltage of 2.7 V to 3.3 V for Flash

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50209-1E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M ( x 16) FLASH MEMORY & 16 M ( × 16) SRAM Interface FCRAM MB84VD23381EJ-90 • FEATURES • Power supply voltage of 2.7 V to 3.1 V for FCRAM • Power supply voltage of 2.7 V to 3.3 V for Flash

Contextual Info: S/avM*- KU7 S W - I* Schottky Barrier Diode Twin Diode OUTLINE DIMENSIONS SF10SC3L Unit • mm Package I FTO-220 4.5 ±a 1 0 ±0-2 2.7±0- <t> 3.2-ö:i 30 V 10 A Date code nafe_ 0181 Type No. ^F10èC3L mu_ >Tjl50°C US V f = 0.45 V Polarity 2.7±a-

32 KB SRAM

Abstract: MBM29DL640E
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50209-3E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M ( x 16) FLASH MEMORY & 16 M ( × 16) SRAM Interface FCRAM MB84VD23381EJ-90 • FEATURES • Power supply voltage of 2.7 V to 3.1 V for FCRAM • Power supply voltage of 2.7 V to 3.3 V for Flash

2101A

Abstract: MSTM TOSHIBA toshiba mosfet MSTM Midium Type Small Signal Transistor 2-7D101A transistor outline package 3
Contextual Info: Midium Type Small Signal Transistor Mold Package MSTM Package Outline Dimensions Outline Dimensions Unit: mm 1.0 4.7 max 7.1 max 0.9 0.65 0.85 3.5 min 0.55 +0.15 –0.05 0.45 +0.15 –0.05 2.54 0.45 +0.15 –0.05 1 2 3 1.025 ±0.05 2.7 max 2.54 Toshiba package name

KDS 16.000

Abstract: KDS 16.000MHz DSX321G DSX321G kds kds thermostats ZD00882 HCS08 LDB212G4020C-001 MC13192 MC13193
Contextual Info: Freescale Semiconductor Technical Data MC13192/D Rev. 2.7, 12/2004 MC13192/MC13193 Scale 1:1 Package Information Plastic Package Case 1311-03 (QFN-32) MC13192/MC13193 2.4 GHz Low Power Transceiver for the IEEE 802.15.4 Standard Ordering Information Device

4upg

Abstract: DSX321G
Contextual Info: Freescale Semiconductor Technical Data MC13192/D Rev. 2.7, 12/2004 MC13192/MC13193 Scale 1:1 Package Information Plastic Package Case 1311-03 (QFN-32) MC13192/MC13193 2.4 GHz Low Power Transceiver for the IEEE 802.15.4 Standard Ordering Information Device

Contextual Info: Ordering number:ENN4668 PNP Epitaxial Planar Silicon Transistor 2SA1723 High-Frequency Amplifier, Medium-Power Amplifier Applications Applications Package Dimensions • Wideband amplifiers. · High-frequency drivers. unit:mm 2009B [2SA1723] Features 8.0 2.7