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    196-PIN BGA FOOTPRINT Search Results

    196-PIN BGA FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    196-PIN BGA FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PM8358-NI

    Abstract: M0330 196-pin bga footprint 10G serdes PM8358 CX4 connector PM8355 10G serdes 2.5 xaui wireles ethernet PM8354
    Text: Signal Integrity There’s more than Meets the Eye PMC-Sierra’s Multi-Gigabit Serial Expertise • Core to PMC-Sierra Business • >65% of PMC products integrate SERDES • History delivering production hardened SERDES • Discrete and highly integrated products such as:


    Original     		64x64 96x96 PM8352 PM8354 PM8363 PM8373 PM8355 PM8358 CD429640A M0330 PM8358-NI M0330 196-pin bga footprint 10G serdes PM8358 CX4 connector PM8355 10G serdes 2.5 xaui wireles ethernet PM8354 PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


    Original     		00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    xc2s50-tq144

    Abstract: XC2S100 XC2S150 XC2S200 XC2S30 XC2S50 SPARTAN-II xc2s100 pq208 SPARTAN-II xc2s200 pq208 SPARTAN-II xc2s200 pq208 block diagram XC17S00A
    Text: Spartan-II 2.5V FPGA Family: Introduction and Ordering Information R DS001-1 v2.2 March 5, 2001 Introduction Preliminary Product Specification • The Spartan -II 2.5V Field-Programmable Gate Array family gives users high performance, abundant logic resources,


    Original     		DS001-1 DS001-1, DS001-2, DS001-3, DS001-4, xc2s50-tq144 XC2S100 XC2S150 XC2S200 XC2S30 XC2S50 SPARTAN-II xc2s100 pq208 SPARTAN-II xc2s200 pq208 SPARTAN-II xc2s200 pq208 block diagram XC17S00A PDF

    SPARTAN-II xc2s200 pq208 block diagram

    Abstract: Spartan-II pin details SPARTAN-II xc2s200 pq208 XC2S50 tq144 SPARTAN-II xc2s50 pq208 Spartan-II xc2s100 pin details XC2S50 XC2S100 XC2S150 xilinx XC17S00A DATE CODE MARKING
    Text: 05 Spartan-II 2.5V FPGA Family: Introduction and Ordering Information R DS001-1 v2.4 September 3, 2003 Introduction Product Specification • The Spartan -II 2.5V Field-Programmable Gate Array family gives users high performance, abundant logic resources,


    Original     		DS001-1 DS001-1, DS001-2, DS001-3, DS001-4, SPARTAN-II xc2s200 pq208 block diagram Spartan-II pin details SPARTAN-II xc2s200 pq208 XC2S50 tq144 SPARTAN-II xc2s50 pq208 Spartan-II xc2s100 pin details XC2S50 XC2S100 XC2S150 xilinx XC17S00A DATE CODE MARKING PDF

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 PDF

    SPARTAN-II xc2s200 pq208

    Abstract: SPARTAN-II xc2s50 pq208 xc2s50-tq144 XC2S200 XC2S100 SPARTAN-II xc2s100 pq208 SPARTAN-II XC2S50 XC2S150 SPARTAN 6
    Text: Spartan-II 2.5V FPGA Family: Introduction and Ordering Information R DS001-1 v2.3 November 1, 2001 Introduction Preliminary Product Specification • The Spartan -II 2.5V Field-Programmable Gate Array family gives users high performance, abundant logic resources,


    Original     		DS001-1 DS001-1, DS001-2, DS001-3, DS001-4, SPARTAN-II xc2s200 pq208 SPARTAN-II xc2s50 pq208 xc2s50-tq144 XC2S200 XC2S100 SPARTAN-II xc2s100 pq208 SPARTAN-II XC2S50 XC2S150 SPARTAN 6 PDF

    TQFP 100 PACKAGE footprint

    Abstract: TQFP 144 PACKAGE footprint bga 208 PACKAGE 144-BB BGA and QFP Package 256X8 208 BGA 72V3613 BI 7284 footprint tqfp 208
    Text: Selector Guide for 6WDQGDUG 6WDQGDUG ,)2 ),)2 Products From IDT, the leading provider of FIFO solutions Standard Standard FIFO FIFO Products Products ¾ ¾ ¾ ¾ ¾ FIFO Quick Reference Guide ……………………… Featured Product: TeraSync FIFO Family ……….


    Original     		PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    TQFP 100 PACKAGE footprint

    Abstract: TQFP 144 PACKAGE footprint TQFP 100 footprint TQFP 80 PACKAGE footprint 16Kx72 TQFP 256 PACKAGE footprint 100-BGA bga 100 PACKAGE footprint 72V7250
    Text: Selector Guide for SuperSync II FIFOs From the leading provider of FIFO Solutions New! New! • 3.3V core voltage • 166MHz high speed operation • Densities up to 4 Mbit • 9-,18-,36-,72-bit configurations • BGA packaging, including JTAG SuperSync II


    Original     		166MHz 72-bit TQFP 100 PACKAGE footprint TQFP 144 PACKAGE footprint TQFP 100 footprint TQFP 80 PACKAGE footprint 16Kx72 TQFP 256 PACKAGE footprint 100-BGA bga 100 PACKAGE footprint 72V7250 PDF

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A PDF

    J-STD-013

    Abstract: AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
    Text: 82559 Printed Circuit Board PCB Design Application Note (AP-399) Revision 1.0 January 1999 Order Number: 739073-001 Revision History Revision Date Revision Description Jan. 1999 1.0 First Release Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		AP-399) J-STD-013 AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based PDF

    Untitled

    Abstract: No abstract text available
    Text: Spartan-II 2.5V FPGA Automotive IQ Product Family: Introduction and Ordering R DS105-1 v1.0 July 17, 2002 Advance Product Specification Introduction The Spartan -II 2.5V Field-Programmable Gate Array (FPGA) Automotive IQ product family gives users high performance, abundant logic resources, and a rich feature set.


    Original     		DS105-1 XC2S15 TQ144 144-pin XC2S30 FG256 256-ball XC2S100 FG456 PQ208 PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    XCR3064XL

    Abstract: CP56 DS012 TQ100 VQ100 VQ44 F864 44VQFP
    Text: R DS017 v1.0 June 1, 2000 XCR3064XL 64 Macrocell CPLD 14 Preliminary Product Specification Features Description • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,500 usable gates • Available in small footprint packages


    Original     		DS017 XCR3064XL 64-macrocell 44-pin 100-pin 56-ball XCR3064XL CP56 DS012 TQ100 VQ100 VQ44 F864 44VQFP PDF

    b13193

    Abstract: XCR3256XL 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648
    Text: R DS013 v1.2 May 3, 2000 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates • Available in small footprint packages


    Original     		DS013 XCR3256XL 208-pin 144-pin 280-ball 280-pin TQ144 PQ208 b13193 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648 PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    Untitled

    Abstract: No abstract text available
    Text: B 2 B S M T C on n e c t ors B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals with multi-finger contacts to our


    Original     		C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06 PDF

    1168 bga

    Abstract: No abstract text available
    Text: B 2 B S M T C on n e c t ors B 2 B® S M T B o ard t o B o ard C on n ect ors B2B® High Density SMT Connectors from Advanced are designed for long-life applications and robust handling. Superior quality is designed in from our screw-machined terminals with multi-finger contacts to our


    Original     		C36000) ASTM-B-16 C17200) ASTM-B-194 63Sn/37Pb B2B-BROCH06 1168 bga PDF

    G1339

    Abstract: jtag pinout TQFP 144 PACKAGE footprint CS144 DS012 TQ144 VQ100 XCR3128XL
    Text: R DS016 v1.1 May 3, 2000 XCR3128XL 128 Macrocell CPLD 14 Preliminary Product Specification Features Description • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 128 macrocells with 3,000 usable gates • Available in small footprint packages


    Original     		DS016 XCR3128XL 144-ball 144-pin 100-pin XCR3128XL G1339 jtag pinout TQFP 144 PACKAGE footprint CS144 DS012 TQ144 VQ100 PDF