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    17X17* BGA 256 Search Results

    17X17* BGA 256 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation
    7MMV4101S15BG Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    17X17* BGA 256 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 PDF

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 PDF

    xxxxx

    Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
    Text: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：SALES@PRECIDIP.COM 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码


    Original     		100VRMS150VDC Preci-DipULE174442 3NMIL-DTL-83734, EIA481 500VAC10 540PLCC PPS-GF30-FR UL94V-O 600VRMS 540PCB xxxxx 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR PDF

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1 PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    NA11

    Abstract: NA12 NA13 VSC834
    Text: VITESSE SEMICONDUCTOR CORPORATION Datasheet 2.5Gb/s 17x17 Crosspoint Switch With Signal Monitoring VSC834 Features • 17 Input by 17 Output Crosspoint Switch • On-chip 50Ω Input Terminations • 2.5Gb/s NRZ Data Bandwidth • 50Ω Source Terminated PECL Output Drivers


    Original     		17x17 VSC834 VSC834 G52247-0, NA11 NA12 NA13 PDF

    256-pin BGA drawing

    Abstract: NA11 NA12 NA13 VSC834
    Text: VITESSE SEMICONDUCTOR CORPORATION Datasheet 2.5Gb/s 17x17 Crosspoint Switch with Input Signal Activity ISA Monitoring VSC834 Features • 17 Input by 17 Output Crosspoint Switch • On-chip 50Ω Input Terminations • 2.5Gb/s NRZ Data Bandwidth • 50Ω Source Terminated PECL Output Drivers


    Original     		17x17 VSC834 VSC834 G52247-0, 256-pin BGA drawing NA11 NA12 NA13 PDF

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20 PDF

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132 PDF

    256-pin BGA drawing

    Abstract: NA11 NA12 NA13 VSC834
    Text: VITESSE SEMICONDUCTOR CORPORATION Data Sheet 2.5Gb/s 17x17 Crosspoint Switch with Input Signal Activity ISA Monitoring VSC834 Features • 17 Input by 17 Output Crosspoint Switch • On-Chip 50Ω Input Terminations • 2.5Gb/s NRZ Data Bandwidth • 50Ω Source Terminated PECL Output Drivers


    Original     		17x17 VSC834 256-Pin VSC834 G52247-0, 256-pin BGA drawing NA11 NA12 NA13 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.


    Original     		FBGA17 256-pin SSD-A-H7511 JEDEC TRAY DIMENSIONS PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20 PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    GAL20V8B-15LD

    Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
    Text: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.


    Original     		I0162 GAL20V8B-15LD pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2 PDF

    UBGA49

    Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
    Text: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm


    Original     		100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE PDF

    PB-BGA256K-Z-01

    Abstract: No abstract text available
    Text: US PATENT # 6,351,392 78.74mm [3.100"] 2.54mmtyp. [0.100"] 20.23mm sqr. [0.796"] 50.8mm [2.000"] 1 Top View * This height variable depends on the screw position. * 9.97mm [0.393"] 6.08mm [0.239"] 12.44mm [0.490"] 2 Compatible BGA package Side View 15mm 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]


    Original     		54mmtyp. FR4/G10 17x17 PB-BGA256K-Z-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: VSC834 Data Sheet FEATURES ● ● ● ● ● 17 input by 17 output crosspoint switch 2.7 Gbps NRZ data bandwidth 46 Gbps aggregate bandwidth TTL-compatible µP interface Differential PECL data inputs ● ● ● ● ● On-chip 50 Ω input terminations


    Original     		VSC834 256-pin VSC834 17x17 G52247-0 J-STD-020. PDF

    Untitled

    Abstract: No abstract text available
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]


    OCR Scan     		16X16 17X17 PDF

    16X16

    Abstract: bga 576 socket bga 24x24 576
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00


    OCR Scan     		16X16 C-1640240 bga 576 socket bga 24x24 576 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 15X15 PDF