L142
Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)
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M095-01
M095-14B~
M095-40
160P6E-A
M095-01
M095-04
M095-06
M095-13B
M095-14B
M095-17
L142
M095-51
M095-37
M095-14B
M095-45
M095-06
M095-29
M095-23B
m095
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QFP160-P-2424-0
Abstract: QFP160
Text: 160P6E-A Plastic 160pin 24✕24mm body QFP Weight g 3.39 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code QFP160-P-2424-0.50 160 b2 ME HD D 121 1 120 I2 HE E Recommended Mount Pad Symbol 81 40 41 80 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c
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160P6E-A
160pin
QFP160-P-2424-0
QFP160
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240K6X-A
240P6Y-A
240P6Z-A
255F7F
256F7B
256F7X-A/B
256P6J-E
256P6K-E
272F7X-A/B
281S8-C
432W6
48P4B
hssop
44P3W-R
28P0
5P5T
tsop 2-54
42P9R
70P3S-M
479F7G
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100MHZ
Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,
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136P6S-C
100P6S-C
80P6N-C
208P6Y-A
64P6N-B
160P6E-A
44P6N-B
100MHZ
IC PACKAGE ELECTRICAL CHARACTERISTIC LCR
24p2n-a
136P6S-C
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
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160-pin renesas
Abstract: No abstract text available
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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160P6E
160-PIN
160-pin renesas
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12P9B
14P5A
16P5A
20P5A
24P5A
18P4G
20P4G
22P4H
24P4D
24P4Y
10C2
144PFB-A
48P4B
16P2S-A
240mil
hssop
Package tray dimension
12P9
16P2Z-A
18P4G
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240mil
SP050PC
340mil
SP070PC
440mil
12P9B
14P5A
16P5A
20P5A
24P5A
324pc
L198
L-088
930PC
12P9B
300mil trays
4028PC
L199
SP080
pt881
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M38881M2XXXFP
Abstract: M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2
Text: B uilt-in LCD driver type Memory type Memory size byte 20K One time PROM Mask ROM 32K One time PROM OnetimePROM Mask ROM OnelimePROM Type I*». Package ROM RAM Mask ROM Mask ROM # 24K 60K M37500M5-XXXFP 160P6E-A M37500M5-XXXGP 176P6D M37500E5-XXXFP M37500E5-XXXGP
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M37500M5-XXXFP
M37500M5-XXXGP
M37500E5-XXXFP
M37500E5-XXXGP
M37500M8-XXXFP
M37500M8-XXXGP
M37500E8-XXXFP
M37500E8-XXXGP
M37510M6-XXXFP
M37S10E6-XXXFP
M38881M2XXXFP
M38881M2
M38802M2
M37510
176P6D
M37690E8-XXXFP
M38881M2XXXGP
80P6S-A
m38813m4
m38802e2
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M37500M8
Abstract: No abstract text available
Text: MITSUBISHI MICROCOMPUTERS 7500 Group SINGLE-CHIP 8-B IT CMOS MICROCOMPUTER DESCRIPTION • 2 C lo c k gen e ra tin g circuit T h e 7 5 0 0 group is th e 8 -b it m icro com puter b a s e d on the C o n n e c t to external c era m ic resonator or quartz-crystal
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001B16
M37500M8
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M31010M6-XXXHP
Abstract: M33210AFP-20 m31002s2hp 32-Bit Microcomputers M31000S2FP 5kpa M31010 31002S2HP 160P6-C 30600E8-XXXFP
Text: ♦M16C Family M I 6 C / 6 0 group # Memory size Memory type byte Package Type No. ROM RAM Mask ROM O ne time PROM 64K - 100P6S-A M30600M8-XXXGP 100P6Q-A 10K M 30600E8-XXXFP EPRO M External ROM M30600M8-XXXFP 10K M16C./61 g rou p (S IM -c o m p a tib le se ria l I/O built in)
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M30600M8-XXXFP
M30600M8-XXXGP
30600E8-XXXFP
100P6S-A
100P6Q-A
100P8S-A
M30612M4-XXXFP
100P6S-A
M306I2M4-XXXGP
M31010M6-XXXHP
M33210AFP-20
m31002s2hp
32-Bit Microcomputers
M31000S2FP
5kpa
M31010
31002S2HP
160P6-C
30600E8-XXXFP
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m37500
Abstract: M37500M5 M37500M8 M37500E8FP
Text: MITSUBISHI M ICROCOM PUTERS 7500 Group SINGLE-CHIP 8-BIT CM O S M ICR O CO M P U TER DESCRIPTION • 2 C lock ge nera ting circu it The 7500 group is the 8 -b it m icro com p uter based on the C o n n e ct to external ceram ic resonator or quartz-crystal
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