14558
Abstract: LT1782 LT1783 LT1784 9934
Text: RELIABILITY DATA LT1782 / LT1783 / LT1784 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SOIC/SOT/MSOP 153 9940 153 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP SSOP/TSSOP 1,342 50 1,392 • TEMP CYCLE FROM -65°C to +150°C
|
Original
|
PDF
|
LT1782
LT1783
LT1784
00-03-6209B.
14558
LT1784
9934
|
JEDEC MO-153
Abstract: MO153 44mm MO-153
Text: 4 5.00±0.10 4.55 5.90 4.45 7.35 4.4±0.1 0.65 1.45 5.00 0.11 12° MTC16rev4 16LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
|
Original
|
PDF
|
MTC16rev4
MO-153,
JEDEC MO-153
MO153
44mm
MO-153
|
BiCD-0
Abstract: TX4939XBG-400 TX4939 DDR400 EN60747-5-2 TB62737FUG TLP261J TLP361J TSSOP14 NAND Flash part number toshiba
Text: TOSHIBA SEMICONDUCTOR BULLETIN EYE APRIL 2005 VOLUME 153 CONTENTS New Products White LED Driver 6-Pin MFSOP Photo Triac
|
Original
|
PDF
|
64-bit
TB62737FUG
BiCD-0
TX4939XBG-400
TX4939
DDR400
EN60747-5-2
TB62737FUG
TLP261J
TLP361J
TSSOP14
NAND Flash part number toshiba
|
JEDEC MO-153
Abstract: MTC16
Text: Revised January 1999 Package MTC16 16-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC16 1999 Fairchild Semiconductor Corporation mtc16.prf www.fairchildsemi.com Package MTC16 January 1999
|
Original
|
PDF
|
MTC16
16-Lead
MO-153,
mtc16
JEDEC MO-153
|
JEDEC MO-153
Abstract: MTD56
Text: Revised January 1999 Package MTD56 56-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 6.1mm Wide Package Number MTD56 1999 Fairchild Semiconductor Corporation mtd56.prf www.fairchildsemi.com Package MTD56 January 1999
|
Original
|
PDF
|
MTD56
56-Lead
MO-153,
mtd56
JEDEC MO-153
|
JEDEC MO-153
Abstract: MTC24 MO-153
Text: Revised January 1999 Package MTC24 24-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC24 1999 Fairchild Semiconductor Corporation mtc24.prf www.fairchildsemi.com Package MTC24 January 1999
|
Original
|
PDF
|
MTC24
24-Lead
MO-153,
mtc24
JEDEC MO-153
MO-153
|
JEDEC MO-153
Abstract: MO-153-BD-1 MO-153BD-1
Text: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages TSSOP M38.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL
|
Original
|
PDF
|
MO-153-BD-1
JEDEC MO-153
MO-153BD-1
|
LT1567
Abstract: LT1568 8549
Text: RELIABILITY DATA LT1567 / LT1568 / LT6600 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SIDEBRAZE SOIC/SOT/MSOP 153 0213 70 0201 223 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP SSOP/TSSOP
|
Original
|
PDF
|
LT1567
LT1568
LT6600
00-03-6209B.
8549
|
MK6006GAH
Abstract: MK3006GAL mcd-d50 D33003 DDK mcd Connectors MCD-D50P MCD-D50SA-3 HDD1442 MK4006GAH EG 8010
Text: 1.1.1.1.1.1.1.1 TOSHIBA TOSHIBA Hard Disk Drive Specification 1.8 inch Hard Disk Drive MK6006GAH/MK4006GAH /MK3006GAL Rev. 01 REF 360050398 Toshiba Corporation Digital Media Network Company Page 1 of 153 2003, Copyright TOSHIBA Corporation All Rights Reserved
|
Original
|
PDF
|
MK6006GAH/MK4006GAH
/MK3006GAL
MK6006GAH/MK4006GAH/MK3006GAL
MK6006GAH
MK3006GAL
mcd-d50
D33003
DDK mcd Connectors
MCD-D50P
MCD-D50SA-3
HDD1442
MK4006GAH
EG 8010
|
vme bus specification
Abstract: D2316 IDT73720 VME64
Text: USING THE IDT73720 BUS EXCHANGER IN A VME64 DESIGN APPLICATION NOTE AN-153 Integrated Device Technology, Inc. By David P. D’Aurelio, Eastman Kodak Company and Dean Smith, Integrated Device Technology INTRODUCTION Many system designers that deal with very large quantities
|
Original
|
PDF
|
IDT73720
VME64
AN-153
VME64
0-471-61601-X
vme bus specification
D2316
|
JEDEC MO-153
Abstract: e 430
Text: ISSI PACKAGING INFORMATION Thin Shrink Small Outline TSSOP Package Code: Z N E H α 1 A1 D A2 e B TSSOP Z Ref. Std. JEDEC MO-153 No. Leads 8 Millimeters Inches Symbol Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.032 0.041
|
Original
|
PDF
|
MO-153
PK004-0A
JEDEC MO-153
e 430
|
100MHZ
Abstract: 133MHZ WED3DL644V
Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by
|
Original
|
PDF
|
WED3DL644V
4Mx64
WED3DL644V
4x1Mx64.
4Mx16
133MHZ,
125MHZ
100MHZ.
100MHZ
133MHZ
|
MTC08
Abstract: No abstract text available
Text: Revised January 2002 Package MTC08 8-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC08 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
|
Original
|
PDF
|
MTC08
MO-153,
MTC08
|
JEDEC MO-153
Abstract: MO-153 MO-153-ED
Text: 48-Lead Thin Shrink Small Outline Package [TSSOP] RV-48 Dimensions shown in millimeters a 12.60 12.50 12.40 25 48 6.20 6.10 6.00 8.10 BSC 1 24 PIN 1 1.20 MAX 0.15 0.05 0.50 BSC 0.27 0.17 SEATING PLANE 0.20 0.09 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-ED
|
Original
|
PDF
|
48-Lead
RV-48)
MO-153-ED
JEDEC MO-153
MO-153
MO-153-ED
|
|
|
MTD48
Abstract: No abstract text available
Text: Revised August 2000 Package MTD48 48-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
|
Original
|
PDF
|
MTD48
48-Lead
MO-153,
MTD48
|
MTC20
Abstract: No abstract text available
Text: Revised August 2000 Package MTC20 20-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
|
Original
|
PDF
|
MTC20
20-Lead
MO-153,
MTC20
|
100MHZ
Abstract: 133MHZ WED3DL644V
Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by
|
Original
|
PDF
|
WED3DL644V
4Mx64
WED3DL644V
4x1Mx64.
4Mx16
133MHZ,
125MHZ
100MHZ.
100MHZ
133MHZ
|
MO-153
Abstract: JEDEC MO-153 MO-153-AE JEDEC TSSOP 28 LEAD PACKAGE coplanarity RU-28
Text: 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters a 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.15 0.05 COPLANARITY 0.10 0.65 BSC 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AE
|
Original
|
PDF
|
28-Lead
RU-28)
MO-153-AE
MO-153
JEDEC MO-153
MO-153-AE
JEDEC TSSOP 28 LEAD PACKAGE
coplanarity
RU-28
|
Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by
|
Original
|
PDF
|
WED3DL644V
4Mx64
WED3DL644V
4x1Mx64.
4Mx16
133MHZ,
125MHZ
100MHZ.
|
MTC14
Abstract: No abstract text available
Text: Revised August 2000 Package MTC14 14-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC14 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
|
Original
|
PDF
|
MTC14
14-Lead
MO-153,
MTC14
|
Untitled
Abstract: No abstract text available
Text: Package Information Vishay Siliconix TSSOP: 8-LEAD POWER IC ONLY JEDEC Part Number: MO-153 R 0.10 Corners) e A1 A A2 D 0.25 (Gage Plane) E1 MILLIMETERS E C B Document Number: 72803 28-Jan-04 L R 0.10 (4 Corners) L1 oK1 Dim A A1 A2 B C D E E1 e L L1 Y oK1
|
Original
|
PDF
|
MO-153
28-Jan-04
S-40079--Rev.
02-Feb-04
|
JEDEC MO-153
Abstract: No abstract text available
Text: ISSI PACKAGING INFORMATION Thin Shrink Small Outline TSSOP Package Code: Z 8 pin, 14 pin N E1 1 E α N/2 A1 D A2 A L C e B TSSOP (Z) Ref. Std. JEDEC MO-153 No. Leads 8 Millimeters Inches Symbol Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006
|
Original
|
PDF
|
MO-153
JEDEC MO-153
|
Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by
|
Original
|
PDF
|
WED3DL644V
4Mx64
WED3DL644V
4x1Mx64.
4Mx16
133MHZ,
125MHZ
100MHZ.
|
jedec MO-153
Abstract: MO-153 98ARH98352A MO153
Text: AA FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE TITLE: 30 LD. TSSOP, PITCH 0.50MM PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARH98352A REV: B CASE NUMBER: 1294-01 20 MAY 2005 STANDARD: JEDEC MO-153 DETAIL ”E” 0.22 SECTION B - B
|
OCR Scan
|
PDF
|
98ARH98352A
MO-153
jedec MO-153
MO-153
98ARH98352A
MO153
|
