land pattern 0805
Abstract: 0402 0603 0805 land
Text: 4/2/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4
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land pattern 0805
Abstract: 0402 land pattern land pattern 1812 0402 0603 0805 1206 0402 0603 0805 land
Text: APPLICATION NOTE RECOMMENDED LAND PATTERN NMC CHIP CERAMIC CAPACITOR Land Pattern NMC C < >< D > A < > B Solder Resist 1. Flow Soldering SIZE 0402 0603 0805 1206 1210 1812 2225 A NA 0.8 ~ 1.0 0.8 ~ 1.4 1.8 ~ 2.4 1.8 ~ 2.4 2.5 ~ 3.2 N/A B NA 2.6 ~ 3.2 3.0 ~ 4.0
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01005 land pattern
Abstract: 0402 land pattern
Text: NMC SERIES - LAND PATTERN DIMENSIONS Component Outline D Solder Resist A C Land Pads B 1. Flow Soldering Dimension mm A B C D 0603 0.8 ~ 1.0 2.6 ~ 3.2 0.7 ~ 0.8 0.8 ~ 1.2 Size 1206 1.8 ~ 2.4 4.2 ~ 5.2 1.2 ~ 1.6 0.9 ~ 1.7 1210 1.8 ~ 2.4 4.2 ~ 5.2 1.8 ~ 2.5
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Untitled
Abstract: No abstract text available
Text: Recommended Land Patterns Recommended Land Patterns Chip Type Unit : mm C A B EIA Size A B C 0805 1.0 0.8 1.2 1206 2.2 0.9 1.5 1020 1.4 1.0 5.0 2512 5.0 1.0 3.0 B Array Type (Unit : mm) Solder resist b a d Series a b c d CRB2A4E 0.4 1.5 0.25 0.5 CRC11A2E
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CRC11A2E
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RNA4A8E
Abstract: No abstract text available
Text: Recommended Land Patterns Recommended Land Patterns Chip Type Unit : mm C A B B EIA Size A B C 0805 1.0 0.8 1.2 1206 2.2 0.9 1.5 1020 1.4 1.0 5.0 2512 5.0 1.0 3.0 Array Type (Unit : mm) Solder resist b a d Series a b c d CRB2A4E 0.4 1.5 0.25 0.5 CRC11A2E
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CRC11A2E
RNA4A8E
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Untitled
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 1206CD SERIES Wirewound ceramic core construction High Inductance value and high self resonant frequency Industry standard 1206 3216 SMT land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C
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1206CD
PE-1206CD030KTT
PE-1206CD060KTT
PE-1206CD100KTT
WC701
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Untitled
Abstract: No abstract text available
Text: Ver 201208 Chip Bead For EMI Suppression CIB/CIM31 Series 3216/ EIA 1206 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm Perfect shape for automatic mounting, with no directionality.
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CIB/CIM31
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Untitled
Abstract: No abstract text available
Text: Ver 201305 Chip Bead For EMI Suppression CIB/CIM31 Series 3216/ EIA 1206 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm Perfect shape for automatic mounting, with no directionality.
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CIB/CIM31
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Untitled
Abstract: No abstract text available
Text: Ver 201207 Chip Bead For High Current CIC31 Series 3216/ EIA 1206 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 1.8~2.5mm CIC series is used for high current. (~ 3A) 1.2~2.0mm 0.6~1.5mm 0.6~1.5mm DIMENSION Type 31 Dimension [mm]
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CIC31
100MHz
CIC31P260
CIC31P300
CIC31P310
CIC31P330
CIC31P350
CIC31P500
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Untitled
Abstract: No abstract text available
Text: Ver 201306 Chip Bead For High Current CIC31 Series 3216/ EIA 1206 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN CIC series is used for high current. (~ 3A) 1.8~2.5mm 1.2~2.0mm 0.6~1.5mm 0.6~1.5mm DIMENSION Type 31 Dimension [mm]
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CIC31
100MHz
CIC31P260
CIC31P300
CIC31P310
CIC31P330
CIC31P350
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IEC 60127-4
Abstract: r net 1206
Text: Surface Mount Fuses Type USF 1206 Typical time/current characteristic curves at 23°C super-quick-acting directly solderable on printed circuit boards Lead-free Pre-arcing time in s 1:1 Current in amperes Recommended land pattern for reflow solder Empfohlene Anschlussflächen für
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EIA-RS481
IEC 60127-4
r net 1206
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Untitled
Abstract: No abstract text available
Text: Fixed Surface Mount Microwave Line Terminators IRC Advanced Film Division PCS-S Series • 3 GHz Operation • 1206 and 1612 chip size • VSWR < 1.1 @ 3GHz 50W The PCS-S series fixed surface mount microwave terminators are designed with a terminal configuration that permits a reduced land pattern.
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PCS1632SLF
PCS3042S
PCS3042SLF
PCS3042S
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Untitled
Abstract: No abstract text available
Text: Fixed Surface Mount Microwave Line Terminators IRC Advanced Film Division PCS-S Series • 3 GHz Operation • 1206 and 1612 chip size • VSWR < 1.1 @ 3GHz 50¾ The PCS-S series fixed surface mount microwave terminators are designed with a terminal configuration that permits a reduced land pattern.
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PCS3042S
PCS3042SLF
PCS3042S
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PCS1632S
Abstract: PCS3042S
Text: Fixed Surface Mount Microwave Line Terminators PCS-S Series • • • • RoHS Compliant Up to 10GHz Operation VSWR <1.2 @ 3GHz 50Ω 0603, 0805, 1206 and 1612 chip sizes The PCS-S series fixed surface mount microwave terminators are designed with a terminal configuration that permits a reduced land
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10GHz
PCS0816S
PCS1220S
PCS1632S
PCS3042S
10GHz
PCS1632SLF
PCS3042SLF
PCS1632S
PCS3042S
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hua jung
Abstract: No abstract text available
Text: POWER TRANSFORMERS HUA JUNG SMD Series SFB type SFB 1204 Type 5 C I G 5 B E F 0. A H Land patterns DIMENSIONS : mm A 12.0 B 0.5 12.0 0.5 C E F G H I 5.0 max. 12.8 7.6 2.9 5.0 1.0 SFB 1205 Type 5 C I G 5 B E F 0. A H Land patterns DIMENSIONS : mm A 12.0 B 0.5
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land pattern 0805
Abstract: 01005 land pattern resistor ERJ-3GE ERJA1 RESISTOR ARRAY 0402 land pattern ERA1A
Text: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type ERJXGN ERJ1GN ERJ2GE ERJ3GE Thick Film Chip Resistors ERJ6GE ERJ8GE ERJ14 ERJ12 ERJ12Z ERJ1T ERJXGN ERJ1GN/1RH ERJ2RH/2RK Precision Thick Film Chip Resistors ERJ3RB/3RE/
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ERJ14
ERJ12
ERJ12Z
ERJ14N
ERJ12N
ERJ12S
ERJ3R/3B/L03
ERJ6R/6B/L06
ERJ8R/8B/8C/L08
ERJ14R/14B/L14
land pattern 0805
01005 land pattern resistor
ERJ-3GE
ERJA1
RESISTOR ARRAY 0402 land pattern
ERA1A
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ERJA1
Abstract: RESISTOR ARRAY 0402 land pattern
Text: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type Size mm (inch) 0402 (01005) 0603 ERJ1GN (0201) 1005 ERJ2GE (0402) 1608 ERJ3GE (0603) 2012 ERJ6GE Thick Film (0805) 3216 Chip Resistors ERJ8GE (1206) 3225 ERJ14 (1210)
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ERJ14
ERJ12
ERJ12Z
ERJ14N
ERJ12N
ERJ12S
ERJA1
RESISTOR ARRAY 0402 land pattern
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Untitled
Abstract: No abstract text available
Text: Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns Chip Size L mm inch G mm (inch) H mm (inch) 0402(1005) 1.3 (0.051) 0.4 (0.016) 0.5 (0.020) 0603(1608) 2.6 (0.102) 0.6 (0.023) 0.8 (0.031) 0805(2012) 3.0 (0.118) 1.0 (0.039)
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CA92121,
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Untitled
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors Size 7267 Coldwater Canyon, North Hollywood. California 91605 • Phone 818 765-8300 • Toll Free (800) 827-7422 • Fax (818) 765-2387 B33 Chip Film Capacitors CFC Surface Mount Stacked Metallized Polyester Film Capacitors
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100pf
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Untitled
Abstract: No abstract text available
Text: *1566 PRINTER 03-62 12/4/06 9:06 AM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0)
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Abstract: No abstract text available
Text: *1130 PRINTER 003-62 v2 3/13/03 2:32 PM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0)
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Abstract: No abstract text available
Text: TA-I Thick Film Chip Resistors Low Resistance 20-91 mΩ Ω for 1206 No TRL-12OS011B page 1/10 1. Scope : This specification applies for the RL12(1206) of thick film chip resistors made by TA-I. Conductor : 2.Construction: (Lead-free or with lead ) Over Coat
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TRL-12OS011B
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Untitled
Abstract: No abstract text available
Text: Thick Film Chip Resistors Low Resistance for 1206 TA-I No TRL-120S004B page 1/9 1. Scope : This specification applies for the RL12(1206) of thick film chip resistors made by TA-I. Conductor : 2. Construction: (Lead-free or with lead ) Over Coat Sn Plating
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TRL-120S004B
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Untitled
Abstract: No abstract text available
Text: SPECTRUM CONTROL INC. Land Patterns and Soldering Temperature Profiles Chip Size EIA EIAJ A B C 0402 (1005) 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0) 0.039 (1.0) 1206 (3216) 0.173 (4.4)
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