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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION
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