10R3 Search Results

LB2512-10R3

Contextual Info: -PROPRIETARY- R LEDTRONICS, INC. TM LEDTRONICS, INC. 23105 KASHIWA COURT TORRANCE, CA 90505 LEDTRONICS, INC. LB2512-10R3

Contextual Info: -PROPRIETARYR LED TRON ICS, IN C. LED TRON ICS, IN C. TM LED TRON ICS, IN C. 23105 KASHIWA COURT TORRANCE, CA 90505 LB2512-10R3

Contextual Info: KOME SUPER BRIGHT LED LAMP SPECIFICAITON View Wave Luminous Intensity Package Dimension Angle Length mcd @ If = 10mA Tolerance: +0.25 (0.01) (deg) (nm) Min. Max. Unit: mm (inch) 2θ 1/2 Emitting Color Chip Material Lens - color 10R3SDA-6 Red GaA|As Red Diffused

IEC-195

Abstract: norme
Contextual Info: Typen / Types 526-0. 525-6 Serie / Metallglasurschicht-Widerstände vertikal kappenlos, umpreßt Series RGU Metalglaze Film Resistors vertical, hi-temp.-solder contacts, moulded uninflammable acc. to IEC 695-2-2 nicht entflammbar gemäß IEC 695-2-2 Technische Daten /Technical Specifications

Contextual Info: F \Q IB Q . ULTRA PRECISION METAL FILM RESISTOR Metai Film Elem ent CAR SERIES -Legend marVed Solder Coatea Copper Leads High reliability Ultra low tem perature coefficient Low noise Superior m oisture perform ance Non standard value available H ighest stability m etal film available

LCR2512

Contextual Info: PRODUCT BULLETIN CR-SERIES PRECISION RESISTIVE PRODUCTS, INC. 202 MACK LANE, MEDIAPOLIS, IA 52637 319 394-9131 FAX (319) 394-9280 E-MAIL info@prpinc.com SURFACE MOUNT RESISTORS THICK FILM STANDARD INDUSTRY CASE SIZES 0402 0603 0805 1206 1210 2010 2512 POWER RATINGS 1/16W, 1/10W, 1/8W,

Contextual Info: ULTRA PRECISION METAL FILM RESISTORS • Low Temperature Coefficients ■ Tight Tolerances ■ High Stability ■ Low Noise £ M A X. D. > -M A X . L - Dimensior S -L L Max. L. Max. Dia. CL to CL PRV 20 B PR V10 .170 .072 .280 .102 PRVsA PR Vs .280 .102 .400

Contextual Info: PRELIMINARY 2R3S THRU 20R3S SOLID STATE DEVICES, INC. 14005 Stage Road * Santa Fe Springs, Ca 90670 Phone: 562 404-4474 * Fax: (562) 404-1773 1.30 Designer's Data Sheet FEATURES: • Hyper Fast Recovery: 20nsec Maximum • Low Forward Voltage Drop • Low Reverse Leakage Current

rover

Abstract: J1000
Contextual Info: SPEb^fo. / ED-Q2Û78 , x . ISSUE Maiçh;i8,20Q2 SHARP OPTOELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR INFRARED EMITTING DIODE MODEL No. G L 100M N 0M P1M Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.

Contextual Info: Precision Thin Film Precision Surface Nichrome Chip Resistors Mount Resistors PCF Series Series thin film technology •PCF Precision · Precision Extended ohmic 1R - 3M metal range film technology · Extended Precision toohmic ±0.01% and 5ppm/°C range 1R - 3M

sl8z4

Abstract: diagram HANNSTAR k mv VDD256 hannstar j mv 1 g792 WISTRON diode c649 ST 1D05V M54-p PCI7412
Contextual Info: A B C D LWG2-D Block Diagram Discrete Mobile CPU CLK GEN. 4 IDT CV125PA Project code: 91.4Q801.001 PCB P/N : 55.4Q801.XXX REVISION : 06210-2 (Hannstar, ACCL) G792 Yonah 478 1.83G/2G/2.16G 4, 5 3 19 PCB STACKUP TOP TVO HOST BUS 400/533/667MHz LVDS DDR2 533/667MHz

TPS5117

Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
Contextual Info: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation

U665B

Abstract: SCD1U10V2KX-5GP aol14 H5PS5162 0R2J-2-GP ICS9LPRS365YGLFT-GP TPS51125 WPC775L RTM875T-606 si7686
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 667/800/1066MHz@1.05V 800/667MHz Cantiga AGTL+ CPU I/F 12,13 LVDS DDR Memory I/F PCI-EG INPUTS 71.CNTIG.00U 12,13 X4 DMI 400MHz 4 36 OUTPUTS DCBATOUT 1D8V_S3 10A RT9026 35 DDR_VREF_S0 (1.5A) S 1D8V_S3 GND DDR_VREF_S3

G545B1

Abstract: MAX8776 KBC1070-NU PDTA124EU-1-GP 74LVC1G08GW-1-GP 1SS355PT-GP SC470P50V2KX-3GP G546A1 kbc1070 isl6260
Contextual Info: 5 4 3 2 1 D D Wistron Confidential PV C 2007/03/30 C REV :PV-04 B B <Variant Name> A A Wistron Corporation 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih, Taipei Hsien 221, Taiwan, R.O.C. Title Size A3 Document Number Date: Friday, March 30, 2007 5 4 3 2 NORN Rev

rtm870t

Abstract: RTM870T-690 9LPR462 rtm870 SRN22J-4-GP ICS9LPR462 foxconn rs690mc Socket AM2 GPIO57
Contextual Info: 5 4 3 2 1 Yukon Block Diagram AMD 8,9 DDR2 SODIMM DIMM2 K8 Rev.G AM2 Socket DDR II 533/667/800 8,9 HyperTransport 16x16 32 4,5, 6,7 L1: Signal 1 L2: VCC L3: Inner Signal 2 L4: Inner Signal 3 L5: GND L6: Signal 4 Project code: 91.4BC01.001 PCB P/N : 48.4BC01.001

winbond WPCE773

Abstract: g547f2 GAP-CLOSE-PWR WPCE773 jv-71 ISL88731C RT8202A JV71 2204mA BT143
Contextual Info: 5 4 3 2 1 SYSTEM DC/DC 42 ISL62392 INPUTS JV71- M V 5V_S5 6A Block Diagram 3D3V_S5(7A) DCBATOUT 5V_AUX_S5 3D3V_AUX_S5 Project code: 91.4FX01.001 PCB P/N : 48.4FX01.0SA REVISION : 09242 -1 D SMSC Mobile CPU CLK GEN. SYSTEM DC/DC INPUTS 1D5V_S3(12A) 34 DDR2

sc3062

Abstract: SC-3062 SC 3062 usb common mode choke ICH3-M 2SB66 flamingo ALC200 15-LPC 26FWH
Contextual Info:
 Acer Flamingo L1: Signal 1 X


 ICS L5: GND L6: POWER Tualatin PAGE:03 L3: Signal 2 (Y) L4: Signal 3 (X/Y) Project code: PCB P/N: REVISION: Mobile CPU CLK GEN. L2: GND L7: Signal 4(weak) verson : L8: Signal 5 (X) PAGE:4~5 (133M) MEM BUS SO-DIMM*2

TPS51125

Abstract: D0214 ENE3310 SRN10KJ-6-GP 88e8071 51125 KB3310 ich9 WINBOND W25X80 sp5 gfx
Contextual Info: 5 4 3 2 1 Cathedral Peak Block Diagram CLK GEN. D SYSTEM DC/DC Mobile CPU ICS 9LPRS365BKLFT 71.09365.A03 RTM 875N-606-LFT (71.00875.003) 3 PCB STACKUP THERMAL EMC2102 Penryn 479 21 DDR2 DIMM1 667/800 MHz TOP 667/800/1067MHz@1.05V DCBATOUT 3D3V_S5 CRT S LCD

WPC8763LDG

Abstract: WPC8763L EC42 line output transformer RTM875T-605 BT 13A sla5v P2231NFC fds8884 g909 Socket AM2
Contextual Info: A B C D Calado Block Diagram Project code: 91.4X401.001 PCB P/N : 07227 REVISION : -1 SYSTEM DC/DC Mobile CPU 4 CLK GEN. 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U DDR2 533/667 MHz 533/667MHz G792 533/667 MHz 71.GL960.00U, SLA5V LVDS AZALIA 26 MIC In C-Link0

RTM865T-433

Abstract: PCI7412 MAX8770GTL rtm865t foxconn G545B2 HCB1608KF121T30-GP 1D05V RTM865-433 BT 342 project
Contextual Info: A B C D Dallen Block Diagram RTM865T-433 71.00865.B0W 3 62.10079.001 HOST BUS 533/667 MHz 533/667 MHz TV Out 4, 5 400/533/667MHz@1.05V LCD AZALIA 29 APL531230 27 3D3V_S0 TI PCI7412 PCI BUS CP2211F Cardbus Cardreader OP AMP 1 PATA 66/100 G1431 30 8 USB 2.0/1.1 ports

88SE6121

Abstract: wpc8763ldg G5281RC1U-GP 88se6 AN-22 1D05V Wistron Corporation SC10U10V5KX-2GP H2434 wistron
Contextual Info: PCB STACKUP Project code: 91.4U601.001 PCB P/N : 07204-SC Revision : MAKI Block Diagram L1: L2: L3: L4: L5: L6: L7: L8: Mobile CPU CLK GEN. Merom 479 2G/2.33G ICS 9LPRS365 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U 71.09502.00W HOST BUS G792 42 DOCK CRT & TV-OUT

fet B20 p03

Abstract: u7620 DCD-1530 BC148 pin configuration wistron docking foxconn WISTRON power sequence FW82807A Wistron Corporation SC 3062
Contextual Info: ÌÓíêð Ð ±¶»½¬ ½±¼»æ çïòìëÍðïòððï ÐÝÞ ÐñÒæìèòìëÍðïòÈÈÈ ÎÛÊxÍ×ÑÒæ óï Ó±¾•´» ÝÐË Ôîæ ÙÒÜ Ì«¿´¿¬·² ÝÔÕÙÛÒò ×Ó× Ýçèîé í ÷ Ôíæ Í·¹²¿´ î øÝÔÕ ÝÎÌ ÝÑÒÒ

CX20561-14Z

Abstract: max8731ae WPCE773LA b24 b03 so-8 P2003EV ICS9LPRS355 cx2056 WPCE775L p2003evg AO3413-GP
Contextual Info: 5 4 3 2 1 Warrior Intel UMA Block Diagram D Penryn SV 16 TPS51120 DDRII Slot 0 667/800 12 Cantiga-GM/GL AGTL+ CPU I/F DDRII 667/800 Slot 1 INTEGRATED GRAHPICS DDR II 667/800 Channel B LVDS, CRT I/F 13 PCIE 6,7,8,9,10,11 C LCD WXGA+ LVDS Dual Channel DDR I/F

SM 630 finger print module

Abstract: ADP3208J RTS5158E SE330U2VDM-L-GP USB232 WPCE776 BQ24740 CT3528 ADP3208 EMC2102-DZK-GP
Contextual Info: A B C D SYSTEM DC/DC LZ2 Block Diagram 4 E Project code: PCB P/N Revision : : INPUTS Penryn SV 35W 3 5V_S5 3D3V_S5 EMC2102 DDR2 socket PCB 8-LAYER STACKUP INPUTS 15 DCBATOUT 1D8V_S3 667/800/1066MHz@1.05V GND R.G.B DDR2 socket 3 TPS51100 APL5912 1D8V_S3 APL5912