08GXT Search Results

Contextual Info: I_ 10 I 11_I 15 IS Recommended I P.C.B 16 17 I 18 Layout NOTE: 2 5 4 7 A —0 8 DDD 1 1 .Selective plated G 1 T -0 5 u ” Min.gold 1OOu” Min.Tin G2T—Gold fla sh in 1OOu” Min.Tin G3T—1Ou” Min.gold 1OOu” Min.Tin G4T—15 u ” Min.gold

Contextual Info: □ NOTE : 0201 67MR008 QQ02ZU 1 1. Selective plating ’S1,—05u" select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2,—Gold flash in contact a r e a / Min. 1OOu” tin in solder area ’S 3 ,-•1Ou" select gold in c o n ta c t/ Min. 100” tin in solder area

UL94V-9

Abstract: C2680 C6280 suyin usb SUYIN
Contextual Info: I_ 9_ I_ 10 1 4 .5 0 I 11_ I IS I 13 I 14 I 15 I 16 I 17 I 18 I -=T r e f. 1 3 .1 0 ± 0 .2 0 12 .5 0 ± 0 .15 %y o CD CN H ''stCO * yy y * XI A Recommended P.C.B Layout Ï II Œ 2 .5 0 NOTE: 2 5 4 7 A — 08 □ □ □ - A .Selective p la te d

2553A

Contextual Info: Recommended P.C.B Layout Com ponent Side 1.40 DETAIL”A" SCALE (8:1) N O T E (I): 2553A - 08D D D - G 1 14.30 + 0 .30 4.30+0.1 5 □ l T 3.75 1.54 .20 0.30 5.70 1 .Selective plating ’GIT,—G 5U” select gold in c o n to c t/ Min 1 0 0 u ”tin in solder area

Contextual Info: R e com m ended P.C.B Layout NOTE: 25 2 2 A —08EDQ—Q 1 1.Selective plating G1T—05 u” Min gold 1 OOu” Min. Tin G2T—Gold fla sh in 1 OOu” Min. Tin G3T—10u” Min gold 1 OOu” Min. Tin G4T—1 5u” Min gold 1 OOu” Min. Tin G5T—30u” Min gold

Contextual Info: I g I 3 I 4 1 A SO I 5 I 9_ I 10 I 11 I IE I 13 I 14 I 15 I 16 I 17 I 18 -=T rp f Recommended P.C.B Layout 2 .5 0 NOTE: 2 5 4 7 A —0 8 □ □ □ - A Sel ec tive pla ted G1T—0 5 u ” Min.gold 1 OOu” Min.Tin G2T—Gold f l a s h in 1 OOu” Min.Tin

SUYIN Connector

Abstract: SUYIN SUYIN 40 ConnectoR 10MR-D suyin connector gold
Contextual Info: I g I 3 I 4 I 5 I 6 I_10 I 11_ I_IS I 13 I 14 I 15 Recom m ended ro uu o -H oij I 16 P.C.B I 17 I_18 I Layout o C ±0.1 7 ~ T Z 7 XZ 7 X 7 UU UU 1 .5 0 A + n .3 D im e n s io n a l In fo rm a tio n SUYIN P/NO. OLD. DIM.A SUYIN P /N O .

Contextual Info: 1 5 .1 0 Reco m m end ed P .C .B Layo ut 1 2 .8 0 8 —0 O .9 2 ± O . 1 R 0 .5 MAX T Y P . -«a* g 1 1 2 .5 1 9 .7 0 1 3 .5 0 1. S elective plating ’ S 1 ,—0 5 u" Min. gold in co n ta ct a r e a / 1 0 0 u ” Min. Tin in so ld er a re a . ’ S 2 ,—Gold flash in co n ta ct a r e a /