03JULY08 Search Results

Contextual Info: 107-68823 Packaging Specification 03July08 Rev B Floating Conn. HSG 1. PURPOSE 目的 Define the packaging specifiction and packaging method of Floating Conn. HSG . 订定 Floating Conn. HSG 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

Contextual Info: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.

Contextual Info: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2032 MHz 4.5 VDC 2032 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current:

Contextual Info: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2207 MHz 4.5 VDC 2207 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current:

Contextual Info: M ICROWAVE A Division of Crystek Corporation PERFORMANCE SPECIFICATION MIN TYP Lower Frequency: Upper Frequency: MAX UNITS 2207 MHz 4.5 VDC 2207 MHz Tuning Voltage: 0.5 Supply Voltage: 4.75 5.0 5.25 VDC Output Power: +3.0 +4.5 +6.0 dBm 33 37 mA Supply Current: