030414HC02 Search Results
030414HC02 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Component Weight : 0.0233 grams QFN33 3.0mmx3.0mm Lead #: No 1 2 3 3 4 5 6 16LD Material Content in % Molding Compound 46.46% Copper Alloy Frame 43.27% Silver Plating 0.47% Die Attach Material 0.73% Wire |
Original |
QFN33 QFN33-16LD-PBY-RS-C2S 030414HC02 Secret00 |