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    026MHZ Search Results

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    026MHZ Price and Stock

    Abracon Corporation ABM10-26.000MHZ-20-R30-D50-T

    Crystals Xtal 2520 4-SMD 26MHz Tol +/-20ppm Stab +/-50ppm -40C - 85C 20pF 30 Ohms
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics ABM10-26.000MHZ-20-R30-D50-T
    • 1 $0.25
    • 10 $0.237
    • 100 $0.233
    • 1000 $0.225
    • 10000 $0.203
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    Abracon Corporation ABM10-26.000MHZ-20-R30-D50-

    Crystals 26.0 MHZ
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI ABM10-26.000MHZ-20-R30-D50- Reel 1,000 1,000
    • 1 -
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    • 100 -
    • 1000 $0.139
    • 10000 $0.133
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    Nihon Dempa Kogyo Co Ltd FRB3355026MHZ

    Electronic Component
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA FRB3355026MHZ 6,000
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    026MHZ Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    H26M* hynix

    Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
    Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title


    Original     		150ms) 512KB 220ms 247ms 262ms H26M* hynix Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5 PDF

    KLM4G1FE3B-B001

    Abstract: KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5
    Text: Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e•MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		KLMxGxFE3B-x00x KLM4G1FE3B-B001 KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5 PDF

    cc3000

    Abstract: 330-0085-R1 IEEE 802.11 interference TQM679002A schematic
    Text: TiWi-SL MODULE DATASHEET Integrated 802.11 b/g WLAN Module FEATURES • DESCRIPTION IEEE 802.11 b/g compliant. • Typical WLAN Transmit Power: o +19.0 dBm, 11 Mbps, CCK b o +15 dBm, 54 Mbps, OFDM (g) • Typical WLAN Sensitivity: o - 85 dBm, 8% PER,11 Mbps


    Original     		CC3000 330-0085-R1 IEEE 802.11 interference TQM679002A schematic PDF

    KLM8G2FEJA-A001

    Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
    Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.


    Original     		8/16/32GB KLMXGXFEJA-X001 KLM8G2FEJA-A001 KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMCGAFEJA-B001 PDF

    toshiba emmc

    Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
    Text: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip


    Original     		16-GB 32-GB toshiba emmc 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC PDF

    SAMSUNG moviNAND

    Abstract: MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash
    Text: KMCEN0000M-S998000 4GB moviNAND_8Gb MLC Based SAMSUNG moviNANDTM KMCEN0000M (4GB MLC) Product Data Sheet Version 1.0 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		KMCEN0000M-S998000 KMCEN0000M KMCEN0000M, SAMSUNG moviNAND MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash PDF

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB PDF

    hynix emmc

    Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
    Text: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History


    Original     		H26M31001EFR fig13 25Mhz, 52MHz, 64Kbyte hynix emmc h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31 PDF

    S3F49SAX

    Abstract: EXT_CSD MMCA 4.3 MultiMediaCard System Specification Version MMCA CMD38 Mmcplus commands package tsop1 nec 384M serial flash 256Mb fast erase spi sim card chips
    Text: MultiMediaCardTM Revision 0.3 SAMSUNG MultiMediaCard Product Datasheet Version 0.3 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G PDF