Untitled
Abstract: No abstract text available
Text: SPRING-LOADED CONNECTORS & PAD CONNECTORS 811-S1-NNN-30-015101 Single Row 2.54 mm, Surface mount perpendicular SERIES 811 Low resistance modular connectors with spring-loaded contacts SLC , surface mount. Contacts with improved, shaped piston design. TECHNICAL SPECS.:
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811-S1-NNN-30-015101
CuZn36Pb3
C36000)
J-STD-002A,
J-STD-0020C,
J-STD-020C
CH-2800
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Untitled
Abstract: No abstract text available
Text: Product Number: 814-22-020-30-015101 Description: Interconnect Header Spring-Loaded Header with Alignment Pins Double Row Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A Mill-Max Part Number 20
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C36000)
C/885
2002/95Annex
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IRGCC40KE
Abstract: IRGPC40K
Text: Previous Datasheet Index Next Data Sheet PD-9.1427 TARGET IRGCC40KE IRGCC40KE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage
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IRGCC40KE
IRGCC40KE
IRGPC40K
IRGPC40K
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IRGCC40KE
Abstract: IRGPC40K
Text: PD-9.1427 TARGET IRGCC40KE IRGCC40KE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage
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IRGCC40KE
IRGCC40KE
IRGPC40K
IRGPC40K
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91428
Abstract: IRGCC40FE IRGPC40F IRGCC40F
Text: PD-9.1428 TARGET IRGCC40FE IRGCC40FE IGBT Die in Wafer Form C 600 V Size 4 Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage
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IRGCC40FE
IRGCC40FE
IRGPC40F
91428
IRGPC40F
IRGCC40F
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6P2C
Abstract: No abstract text available
Text: H O S ID E N Through Type Mounting Style I UNIT : mm 4 Position H JC0175 With reinforcement terminals P P HO LE LAYOUT (B O T T O M V IE W ) S # / M o d e l No. Housing Color 4P-4C Gray HJC0175-01-012 Black HJC0175-01-022 Ivory HJ C 0 175-01-032 4 Position
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JC0175
HJC0175-01-012
HJC0175-01-022
HJC0277-010012
HJC0277-010022
JC0277-010032
HJC0151
HJC0212
HJC0212-01-012
HJC0212-01
6P2C
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IRGCC40UE
Abstract: IRGPC40U
Text: PD-9.1426 IRGCC40UE IRGCC40UE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage
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IRGCC40UE
IRGCC40UE
IRGPC40U
IRGPC40U
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IRGCC40
Abstract: IRGCC40UE IRGPC40U
Text: Previous Datasheet Index Next Data Sheet PD-9.1426 IRGCC40UE IRGCC40UE IGBT Die in Wafer Form C 600 V Size 4 Ultra-Fast Speed 5" Wafer G E Electrical Characteristics Wafer Form Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage
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IRGCC40UE
IRGCC40UE
IRGPC40U
IRGCC40
IRGPC40U
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T2066
Abstract: No abstract text available
Text: Tantalum Hermetically Sealed/Axial Through-Hole Capacitors T255 Series High Temperature Solder Overview The KEMET T255 High Temperature Solder Series of solid tantalum capacitors offers high capacitance-to-volume ratios and is available in standard MIL style A, B, C, and D
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I960 mx
Abstract: 271194 marking A17 DIODE marking ED BDATA23 i960mx 27119
Text: In te l. MILITARY i960 MM/MX SUPERSCALAR MICROPROCESSOR Implements JIAWG 32-bit ISA Standard i960® MX Processor Only High-Performance 32-bit Superscalar Architecture — Up to Three Instructions per Clock Execution — Five Parallel Execution Units — Load/Store Architecture
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32-bit
BDIRTAG16
BDATA61
BDATA58
BDIRTAG18
BDATA62
I960 mx
271194
marking A17
DIODE marking ED
BDATA23
i960mx
27119
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Untitled
Abstract: No abstract text available
Text: SIEMENS PNP Silicon AF Transistors • • • • • BCX 69 For general AF applications High collector current High current gain Low collector-emitter saturation voltage Complementary type: BCX 68 NPN Type Marking BCX 69 BCX 69-10 BCX 69-16 BCX 69-25 CF
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Q62702-C1714
Q62702-C1867
Q62702-C1868
Q62702-C1869
OT-89
fi235b05
012101b
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Diaphragm Pressure Gauge
Abstract: oem sensor
Text: pressure and vacuum transducers MAGTRANS, INTERNAL DIAPHRAGM, OEM SENSOR • Brass wetted parts • Pressure ranges from -1… 0 bar to 0… 25 bar • 0-10V and 0-5V output • Low cost suitable for OEM applications Type 3301 PART NUMBERS 3301 Range Bar
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30VDC
M12x1
Diaphragm Pressure Gauge
oem sensor
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max3930
Abstract: 3296W-202 0805CS-221XKBC 3296W GRM33 MAX3930EVKIT TAJB106K010 CAPACITORS 0201 2K variable resistor
Text: 19-2070; Rev 0; 6/01 MAX3930 Evaluation Kit The MAX3930 evaluation kit EV kit is an assembled demonstration board that provides electrical evaluation of the MAX3930 10.7Gbps laser driver. The output of the evaluation board is interfaced to an SMA connector that
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MAX3930
MAX3930EVKIT
1000pF
GRM33X3R102K016A
EJC-ZEBOJ103K
MAX3930
3296W-202
0805CS-221XKBC
3296W
GRM33
MAX3930EVKIT
TAJB106K010
CAPACITORS 0201
2K variable resistor
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Untitled
Abstract: No abstract text available
Text: Tantalum Hermetically Sealed/Axial Through-Hole Capacitors T245 Series High Temperature Solder Overview Applications The KEMET standard MIL case hermetically sealed T245 Series Extended Capacitance Range is compact, ruggedly built and designed for miniaturized circuitry. The capacitors are especially
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Untitled
Abstract: No abstract text available
Text: SIEMENS BFP 181W NPN Silicon RF Transistor • For low noise, high-gain broadband amplifiers at collector currents from 0.5mA to 12mA • f j = 8GHz F = 1.45dB at 900MHz ESP: Electrostatic discharge sensitive device, observe handling precaution! Type Marking
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900MHz
Q62702-F1501
OT-343
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Untitled
Abstract: No abstract text available
Text: International pc-9.1428 IRGCC40FE IQRRectifi Gf_ TARGET IRGCC40FE IGBT Die in Wafer Form 600 V Size 4 Fast Speed 5" Wafer Electrical Characteristics Wafer Form P a ra m e te r D e s c rip tio n G u a ra n te e d (M in /M a x ) VCE (on) Cotlector-to-Em itter Saturation Voltage
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IRGCC40FE
IRGCC40FE
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Untitled
Abstract: No abstract text available
Text: International IOR Rectifier PD-9.1427 IRGCC40KE TARGET IRGCC40KE IGBT Die in Wafer Form 600 V Size 4 Ultra-Fast Speed 5 " Wafer Electrical Characteristics Wafer Form Param eter Description G uaranteed (Min/Max) VcE (on) Collector-to-Emltter Saturation Voltage
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P-947
IRGCC40KE
IRGCC40KE
250pA,
250pA
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Untitled
Abstract: No abstract text available
Text: SIEMENS NPN Silicon High-Voltage Transistors BFN 24 BFN 26 • Suitable for video output stages in TV sets and switching power supplies • High breakdown voltage • Low collector-emitter saturation voltage • Complementary types: BFN 25, BFN 27 PNP Type
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Q62702-F1065
Q62702-F976
OT-23
fl535b05
aE35hDS
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01510010
Abstract: SIU800 80E06 tektronix k4000 80C01 80C02 80C07B 80C08C 80C10 TDS8000B
Text: Digital Sampling Oscilloscope TDS8000B Features & Benefits DC to 70+ GHz Bandwidth*1 Exceptional Trigger Jitter and Horizontal Timebase Stability Modular Architecture Up to Eight Channels Acquisition High Resolution and Measurement Repeatability Comprehensive, Accurate,
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TDS8000B
TDS8000B
5W-13553-9
01510010
SIU800
80E06 tektronix
k4000
80C01
80C02
80C07B
80C08C
80C10
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Untitled
Abstract: No abstract text available
Text: PD-9.1426 International IO R Rectifier IRGCC40UE IRGCC40UE IGBT Die in Wafer Form 600 V Size 4 Ultra-Fast Speed 5" Wafer Electrical Characteristics Wafer Form D e s c rip tio n G u a ra n te e d (M in /M a x ) VCE (on) C ollector-to-Em itter Saturation Voltage
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PM1426
IRGCC40UE
250pA,
250pA
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T4FS
Abstract: RMJ BH 6b022 B1481-2 core i3 addressing modes RD085 55ag nbf1 Application note U68A mark ea02
Text: NATL SEMICOND UP/UC 31E D Bi b S G U S Ö 2 H PRELIMINARY Semiconductor 7 = 4 9 -/9 -1 4 , HPC16400/HPC36400/HPC46400 High-Performance Communications microcontroller General Description Features The HPC16400 Is à member of the HPO lamily ol High Performance microcontrollers. Each member o f the family
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HPC16400/HPC36400/HPC46400
HPC16400
HPC1640Q
tl/do/6302-20
T4FS
RMJ BH
6b022
B1481-2
core i3 addressing modes
RD085
55ag
nbf1
Application note U68A
mark ea02
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MIL-C-39006
Abstract: No abstract text available
Text: MIL-C-39006 Military Style Tantalum Capacitors i MIL-C-39006 Tantalum Capacitors VIBRATION, HIGH FREQUENCY DESIGN AND CONSTRUCTION Capacitors shall be tested in accordance with method 204 of MILEach fixed capacitor consists of a sintered tantalum anode isolated
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MIL-C-39006
STD-202.
MIL-C-39006
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Untitled
Abstract: No abstract text available
Text: Male Style H 15 2 rows 1 x 7 + 1 x 8 Contact Design and Termination Length Number of Contacts 15 Right Angled PCB Solder 15 FASTON (6.3 x 0.8) Part Number Performance classes according to DIN 41612 I Loading Description fully loaded 10 8456 015 001 169 fully loaded + ground z + 32
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HPC16400
Abstract: No abstract text available
Text: HPC16400/HPC36400/HPC46400 High-Performance Communications microcontroller G e n e r a l D e s c r ip t io n Features The HPC16400 is a member of the H P C t m family of High Performance microcontrollers. Each member of the family has the same identical core CPU with a unique memory and
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HPC16400/HPC36400/HPC46400
HPC16400
16-bit
TUDO/8802-20
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