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    0.13UM ST Search Results

    0.13UM ST Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    X9313UMZT1 Renesas Electronics Corporation Digitally Controlled Potentiometer (XDCP™), Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC Visit Renesas Electronics Corporation
    X9313UMIZ-3T1 Renesas Electronics Corporation Digitally Controlled Potentiometer (XDCP™), Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC Visit Renesas Electronics Corporation
    X9313UMIZ-3 Renesas Electronics Corporation Digitally Controlled Potentiometer (XDCP™), Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC Visit Renesas Electronics Corporation
    X9313UMZ-3T1 Renesas Electronics Corporation Digitally Controlled Potentiometer (XDCP™), Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC Visit Renesas Electronics Corporation
    X9313UMZ Renesas Electronics Corporation Digitally Controlled Potentiometer (XDCP™), Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC Visit Renesas Electronics Corporation

    0.13UM ST Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    ARM9TDMI

    Abstract: ARM1020E samsung hdd Samsung S ARM teaklite DSPG SMART ASIC bga ARM920t datasheet Avant Electronics USB samsung
    Text: V S MSUNG STDH150 ELECTRONICS STDH150 Standard Cell 0.13um System-On-Chip ASIC Dec 2001, V1.0 Features Analog cores - Ldrawn = 0.13um 1.2/2.5/3.3V Device - Up to 34.3 million gates - Power dissipation:9nW/MHz@1.2V, 2SL, ND2 3.3/5.0V - Gate Delay: 52ps @ 1.2V, 2SL, ND2


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    STDH150 STDH150 ARM920T/ARM940T, ARM9TDMI ARM1020E samsung hdd Samsung S ARM teaklite DSPG SMART ASIC bga ARM920t datasheet Avant Electronics USB samsung PDF

    ARM dual port SRAM compiler

    Abstract: DSPG teaklite ARM9TDMI ARM1020E samsung hdd UART 16C450 Standard Cell 0.13um System-On-Chip ASIC ARM920T ARM926EJ
    Text: V S MSUNG STD150 ELECTRONICS STD150 Standard Cell 0.13um System-On-Chip ASIC Oct 2001, V1.0 Features Analog cores - Ldrawn = 0.13um 1.2/2.5/3.3V Device - Up to 46 million gates - Power dissipation:9nW/MHz@1.2V, 2SL, ND2 3.3/5.0V - Gate Delay: 52ps @ 1.2V, 2SL, ND2


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    STD150 STD150 ARM920T/ARM940T, ARM dual port SRAM compiler DSPG teaklite ARM9TDMI ARM1020E samsung hdd UART 16C450 Standard Cell 0.13um System-On-Chip ASIC ARM920T ARM926EJ PDF

    ternary content addressable memory VHDL

    Abstract: ARM1020E SMART ASIC bga ARM dual port SRAM compiler Samsung ASIC 0.13um standard cell library Standard Cell 0.13um System-On-Chip ASIC DSPG samsung lcd JTAG "content addressable memory" precharge
    Text: V S MSUNG STDL150 ELECTRONICS STDL150 Standard Cell 0.13um System-On-Chip ASIC March 2003, V2.0 Features Analog cores - Ldrawn = 0.13um 1.5/2.5/3.3V Device 1.5/2.5/3.3V - Up to 45.8 million gates Interface - Power dissipation: 13nW/MHz@1.5V, 2SL, ND2 5.0V


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    STDL150 STDL150 13nW/MHz ARM920T/ARM940T, ternary content addressable memory VHDL ARM1020E SMART ASIC bga ARM dual port SRAM compiler Samsung ASIC 0.13um standard cell library Standard Cell 0.13um System-On-Chip ASIC DSPG samsung lcd JTAG "content addressable memory" precharge PDF

    VCO 10GHz

    Abstract: tsmc cmos TSMC 0.13um CMOS 10GHz clock oscillator XCVR 10gbps clock and data recovery 10GHz VCO applications of prbs generator 10Gbps P802
    Text: SB3000 PRODUCT BRIEF SILICON BRIDGE SB3000 - 10Gbps Serial Low Power 0.13um TSMC CMOS Programmable Transceiver Macro Cell FEATURES • Power dissipation: 400mW typical • Available in 0.13um TSMC CMOS technology • Compliant with 10Gbps Ethernet IEEE P802.3ae,


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    SB3000 SB3000 10Gbps 400mW 32/64-bit 10GHz s/622MHz VCO 10GHz tsmc cmos TSMC 0.13um CMOS 10GHz clock oscillator XCVR 10gbps clock and data recovery 10GHz VCO applications of prbs generator P802 PDF

    ARM1020E

    Abstract: samsung hdd Samsung Soc processor 4468 8 pin ARM920t datasheet ARM9TDMI DSPG ARM SRAM compiler UART 16C450 ARM940T
    Text: V S MSUNG STD150 ELECTRONICS STD150 Standard Cell 0.13um System-On-Chip ASIC Oct 2001, V1.0 Features Analog cores - Ldrawn = 0.13um 1.2/2.5/3.3V Device - Up to 46 million gates - Power dissipation:9nW/MHz@1.2V, 2SL, ND2 3.3/5.0V - Gate Delay: 52ps @ 1.2V, 2SL, ND2


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    STD150 STD150 ARM920T/ARM940T, ARM1020E samsung hdd Samsung Soc processor 4468 8 pin ARM920t datasheet ARM9TDMI DSPG ARM SRAM compiler UART 16C450 ARM940T PDF

    PLL2113X

    Abstract: 50MHz-300MHz
    Text: 50MHz ~ 300MHz FSPLL PLL2113X Ver 1.0.1. Aug. 2002 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2113x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provides frequency multiplication capabilities. The output clock frequency


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    50MHz 300MHz PLL2113X pll2113x 300MHz 150ps 50MHz 50MHz-300MHz PDF

    PLL2108X

    Abstract: No abstract text available
    Text: 50MHz ~ 300MHz FSPLL PLL2108X Ver 1.3.0. May. 2002 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2108x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provides frequency multiplication capabilities. The output clock frequency


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    50MHz 300MHz PLL2108X pll2108x 300MHz 150ps 50MHz PDF

    0.18-um

    Abstract: 0.35uM STI CS100A CS70DL CS-80 pMOS NAND GATE 0.35Um CS70B Fujitsu inverter CG61
    Text: CMOS PROCESS TECHNOLOGY 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC & COT TECHNOLOGY ROADMAP Node 0.25um 0.18um CS70B 0.10um CS70DLS CS80DL 0.2 L gate [mm] CS70DL 0.13um CS80/CS80A ASIC/DRAM Half Pitch CS90A MPU


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    CS70B CS70DL CS70DLS CS80DL CS80/CS80A CS90A CS100 CS90DLS CS100A/DL 0.18-um 0.35uM STI CS100A CS-80 pMOS NAND GATE 0.35Um CS70B Fujitsu inverter CG61 PDF

    PLL2124X

    Abstract: No abstract text available
    Text: 50MHz ~ 300MHz FSPLL PLL2124X Ver 1.0.0. July, 2002 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2124x is a Phase Locked Loop (PLL) frequency synthesizer. The PLL provides frequency multiplication capabilities. The output clock frequency


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    50MHz 300MHz PLL2124X pll2124x 300MHz 150ps 50MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: QUALIFICATION REPORT Date: 3/28/12 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8864RMN/RMNI/RMNU Qual vehicles PACKAGE TYPE : ASSEMBLY FAB LOC PROCESS 64L MLF QFN TICP DONGBU, TAIWAN 0.13um KSZ8864RMNU QUALIFICATION RESULTS: Test # Reference Test Conditions


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    KSZ8864RMN/RMNI/RMNU KSZ8864RMNU JESD22 AEC-Q100008 AEC-Q100002 AEC-Q100001 Mil-STD883 PDF

    PLL2127X

    Abstract: 100MHz FREQUENCY DIVIDER
    Text: 20MHz ~ 100MHz FSPLL PLL2127X Ver 0.0 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2127x is a Phase Locked Loop PLL frequency synthesizer. The PLL provide frequency multiplication capabilities. The output clock frequency FOUT is related to the input clock frequency FIN by


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    20MHz 100MHz PLL2127X pll2127x 100MHz 200ps 20MHz 100MHz FREQUENCY DIVIDER PDF

    PLL2126X

    Abstract: No abstract text available
    Text: 20MHz ~ 100MHz FSPLL PLL2126X Ver 0.0 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2126x is a Phase Locked Loop PLL frequency synthesizer. The PLL provide frequency multiplication capabilities. The output clock frequency FOUT is related to the input clock frequency FIN by


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    20MHz 100MHz PLL2126X pll2126x 100MHz 200ps 20MHz PDF

    vco 27MHz

    Abstract: PLL VCO 27MHz phase sequence detector phone tap
    Text: 0.13um, 12-145 MHz Phase Locke d Loop FEATURES • Industry Standard 0.13 Micron CMOS ■ Digital Logic Process; 1.2/3.3 volts ■ Digital Controlled Output Frequency — up to 145 MHz with a Symmetric Duty Cycle ■ Embedded VCO Frequency Range: 216 MHz, locked to 27


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    PDF

    TSMC 0.13um CMOS

    Abstract: "programmable on-chip termination" 10gbps serdes tsmc cmos XCVR CHIP EXPRESS SB1011 ethernet mdio circuit diagram mdio termination
    Text: SB1011 PRODUCT BRIEF SILICON BRIDGE SB1011 - Quad 0.625 - 4.25Gbps Low Power CMOS Transceiver Macro Cell in 0.13um TSMC Process FEATURES BENEFITS/ADVANTAGES • • • • • • • • • • • • • • • Quad SerDes transceivers with Clock multiplier and


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    SB1011 SB1011 25Gbps 0625Gbps, 125Gbps, 25Gbps, 10b/20b TSMC 0.13um CMOS "programmable on-chip termination" 10gbps serdes tsmc cmos XCVR CHIP EXPRESS ethernet mdio circuit diagram mdio termination PDF

    calmRISC16

    Abstract: S3FC9 scrambling "flash controller" smart card 7816 emv 7816 smart card
    Text: S3FC9CE 1 Bank Flash Embedded Smart Card Controller Advanced Information Publication Number: 00-S3-FC9CE Feb 2007 rev2 ) OVERVIEW The S3FC9CE is high performance security controller is specially designed and packaged for "Smart Card" application and fabricated using a secured 0.13um CMOS technology. The CalmRISC16 16-bit CPU and secure


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    00-S3-FC9CE CalmRISC16 16-bit CalmRISC16) 84Kbyte 176Kbyte 16-Bits S3FC9 scrambling "flash controller" smart card 7816 emv 7816 smart card PDF

    PLL2128X

    Abstract: No abstract text available
    Text: 20MHz ~ 100MHz FSPLL PLL2128X Ver 0.0 GENERAL DESCRIPTION FEATURES • 0.13um CMOS device technology The pll2128x is a Phase Locked Loop PLL frequency synthesizer. The PLL provide frequency multiplication capabilities. The output clock frequency FOUT is related to the input clock frequency FIN by


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    20MHz 100MHz PLL2128X pll2128x 100MHz 200ps 20MHz PDF

    Pseudo SRAM

    Abstract: No abstract text available
    Text: Low Power Pseudo SRAM 4 M Words x 16 bit CS26LV64163 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.19, 2007 1.1 Upgrade wafer process from 0.13um to 90nm Dec. 18, 2009 1 Rev 1.1 Chiplus reserves the right to change product or specification without notice.


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    CS26LV64163 CS26LV64163 150uA 200us Pseudo SRAM PDF

    S3FS9

    Abstract: arm7 architecture calculator circuit diagram ARM SC100 Architecture S3FS ARM SC100 ARM SC100 7816 S3FS92F CRC calculator S3FS92
    Text: S3FS92F 1 Bank Flash Embedded Smart Card Controller Advanced Information Publication Number: 00-S3-FS92F Mar 2007 rev1 OVERVIEW The S3FS92F is a cost-effective, high performance security controller designed and packaged for "Smart Card" application and using a secured 0.13um Flash technology. The 16-/32-bit SC100 RISC CPU and secure flash


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    S3FS92F 00-S3-FS92F S3FS92F 16-/32-bit SC100 SC100 32-bit 256kB 16-Bit S3FS9 arm7 architecture calculator circuit diagram ARM SC100 Architecture S3FS ARM SC100 ARM SC100 7816 CRC calculator S3FS92 PDF

    CS26LV64163

    Abstract: cs26lv64163 data
    Text: Low Power Pseudo SRAM 4 M Words x 16 bit CS26LV64163 Revision History Rev. No. History Issue Date 1.0 Initial issue Jan.19, 2007 1.1 Upgrade wafer process from 0.13um to 90nm Dec.18, 2009 1.2 Add the package dimensions: D2 and E2 Aug.26, 2010 1 Rev 1.2 Chiplus reserves the right to change product or specification without notice.


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    CS26LV64163 CS26LV64163 cs26lv64163 data PDF

    1016w

    Abstract: A15F6
    Text: New Products MBM29BS12DH 128Mbit x16 Burst Mode Flash Memory MBM29BS12DH A Flash Memory mounted with burst mode, operated on a single 1.8V power supply. Adoption of an original FUJITSU sensing method reduces the current consumption to one-twentieth the standard level of competitor


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    MBM29BS12DH 128Mbit 128M-bit 40REF 80REF 1016w A15F6 PDF

    FBGA-60

    Abstract: FBGA60 fbga60 package
    Text: New Products MBM29BS64LF 64M-bit x16 Burst Mode Flash Memory MBM29BS64LF FUJITSU has developed a new burst mode flash memory device operating with a 1.8 V single power supply. This device incorporates an original FUJITSU sense system that reduces the current consumption (mean value in the standby mode)


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    MBM29BS64LF 64M-bit 64M-bit fMBM29BSxxx 128M-bit MBM29BS64LF, FBGA-60 FBGA60 fbga60 package PDF

    0.18-um

    Abstract: No abstract text available
    Text: Serial LINK Code Information 1/2 S5SXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 9 10 11 12 13 14 15 9. Interface (Serial / Parallel) 4 : 4 bit interface 5 : 5 bit interface 8 : 8 bit interface 1 : 10 bit interface 6 : 16 bit interface 2 : 20 bit interface


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    PDF

    LBC7

    Abstract: BiCD 0.13 BCD8 0.18um LDMOS BCD8* riccardi cd013 BCD8 st 7to30V LBC7 RONA free transistor e2p
    Text: Ultra-low On-Resistance LDMOS Implementation in 0.13 m CD and BiCD Process Technologies for Analog Power IC's Koji Shirai, Koji Yonemura, Kiminori Watanabe, Koji Kimura System LSI Division, Toshiba Semiconductor Company, 2-5-1 Kasama, Sakae, Yokohama, Kanagawa/Japan,


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    7to30V LBC7 BiCD 0.13 BCD8 0.18um LDMOS BCD8* riccardi cd013 BCD8 st LBC7 RONA free transistor e2p PDF

    internal block diagram of mobile phone

    Abstract: s3c2413 touch screen controller samsung ARM926EJ camera interface samsung OneNAND Samsung sd ARM926EJ-S AMBA APB UART touch screen controller for mobile phone
    Text: Samsung S3C2413 Mobile Processor Cost-effective Solution for Smartphones and Other Handhelds The Samsung S3C2413 mobile processor gives designers of products such as smartphones, portable GPS devices and PDAs a solution for reducing system costs while providing


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    S3C2413 S3C2413 16/32-bit ARM926EJ-S DS-07-SLSI-002 internal block diagram of mobile phone touch screen controller samsung ARM926EJ camera interface samsung OneNAND Samsung sd AMBA APB UART touch screen controller for mobile phone PDF